公开(公告)号：EP1089109A2

公开(公告)日：2001-04-04

申请号：EP00307696.5

申请日：2000-09-06

Applicant: JDS Uniphase Inc.

Inventor： Dhuler, Vijayakumar R. ,  Hill, Edward A. ,  Mahadevan, Ramaswamy ,  Walters, Mark David ,  Wood, Robert L.

IPC: G02B26/02 ,  B81B3/00

CPC classification number: G02B26/0841 ,  B81B3/0054 ,  B81B2201/038 ,  B81B2201/047 ,  G02B6/266

Abstract: A MEMS (Micro Electro Mechanical System) variable optical attenuator is provided that is capable of optical attenuation over a full range of optical power. The MEMS variable optical attenuator comprises a microelectronic substrate, a MEMS actuator and an optical shutter. The MEMS variable optical attenuator may also comprise a clamping element capable of locking the optical shutter at a desired attenuation position. The variable light attenuator is capable of attenuating optical beams that have their optical axis running parallel and perpendicular to the substrate. Additionally, the MEMS actuator of the present invention may comprise an array of MEMS actuators capable of supplying the optical shutter with greater displacement distances and, thus a fuller range of optical attenuation. In one embodiment of the invention, the MEMS actuator comprises a thermal arched beam actuator. Additionally, the variable optical attenuator of the present invention may be embodied in a thermal bimorph cantilever structure. This alternate embodiment includes a microelectronic substrate and a thermal bimorph cantilever structure having at least two materials of different thermal coefficient of expansion. The thermal bimorph is responsive to thermal activation and moves in the direction of the material having the lower thermal coefficient expansion. Upon activation, the thermal bimorph intercepts the path of the optical beam and provides for the desired level of optical attenuation. The invention also provides for a method of optical attenuation and a method for fabricating an optical attenuator in accordance with the described structures.

Abstract translation: 提供了能够在全光范围内进行光衰减的MEMS（微机电系统）可变光衰减器。 MEMS可变光衰减器包括微电子衬底，MEMS致动器和光学快门。 MEMS可变光衰减器还可以包括能够将光学快门锁定在期望的衰减位置的夹紧元件。 可变光衰减器能够使其光轴平行且垂直于衬底的光束衰减。 此外，本发明的MEMS致动器可以包括MEMS致动器的阵列，其能够向光学快门提供更大的位移距离，并且因此具有更宽的光学衰减范围。 在本发明的一个实施例中，MEMS致动器包括热拱形梁致动器。 此外，本发明的可变光衰减器可以以热双压电晶片悬臂结构体现。 该替代实施例包括具有不同热膨胀系数的至少两种材料的微电子衬底和热双压电晶片悬臂结构。 热双压电晶体响应于热激活并沿具有较低热系数膨胀的材料的方向移动。 在激活时，热双压电晶片截取光束的路径，并提供所需的光衰减水平。 本发明还提供了一种光衰减的方法以及根据所述结构制造光衰减器的方法。

公开(公告)号：EP1081391A2

公开(公告)日：2001-03-07

申请号：EP00810770.8

申请日：2000-08-29

Applicant: JDS Uniphase Inc. ,  Cronos Integrated Microsystems, Inc.

Inventor： Dhuler, Vijayakumar R. ,  Walters, Mark David

IPC: F15C5/00

CPC classification number: F15C5/00 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  B81C2203/031 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0009 ,  F16K99/0011 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2001/0042

Abstract: A microelectromechanical (MEMS) device (10) is provided that includes a microelectronic substrate (50) and a thermally actuated microactuator (20). For example, the MEMS device (10) may be a valve. As such, the valve may include at least one valve plate (30) that is controllably brought into engagement with at least one valve opening (40) in the microelectronic substrate (50) by selective actuation of the microactuator (20). While the MEMS device (10) can include various microactuators (20), the microactuator advantageously includes a pair of spaced apart supports (22) disposed on the substrate (50) and at least one arched beam (24) extending therebetween. The microactuator (20) may further include metallization traces (70) on distal portions (23) of the arched beams (24) to constrain the thermally actuated regions of arched beams to medial portions thereof. The valve may also include a latch (680) for maintaining the valve plate (30) in a desired position without requiring continuous energy input to the microactuator (20).

Abstract translation: 提供了一种包括微电子衬底（50）和热致动微致动器（20）的微机电（MEMS）装置（10）。 例如，MEMS器件（10）可以是阀。 因此，阀可以包括至少一个阀板（30），其通过选择性地致动微致动器（20）而可控制地与微电子衬底（50）中的至少一个阀开口（40）接合。 虽然MEMS器件（10）可以包括各种微致动器（20），微致动器有利地包括设置在基板（50）上的一对间隔开的支撑件（22）和在其间延伸的至少一个拱形梁（24）。 微致动器（20）还可包括在拱形梁（24）的远侧部分（23）上的金属化走线（70），以将拱形梁的热致动区域约束到其中间部分。 阀还可以包括用于将阀板（30）保持在期望位置的闩锁（680），而不需要对微致动器（20）的连续能量输入。