公开(公告)号：EP1085219A2

公开(公告)日：2001-03-21

申请号：EP00810798.9

申请日：2000-09-05

Applicant: JDS Uniphase Inc. ,  Cronos Integrated Microsystems, Inc.

Inventor： Dhuler, Vijayakumar R. ,  Hill, Edward ,  Cowen, Allen

IPC: F15C5/00 ,  H01H37/32

CPC classification number: F16K99/0001 ,  B81B3/0024 ,  B81B2201/031 ,  F03G7/06 ,  F15C5/00 ,  F16K99/0007 ,  F16K99/0036 ,  F16K99/0042 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H1/0036 ,  H01H37/32 ,  H01H2037/008 ,  Y10S310/06

Abstract: A MEMS thermal actuator device is provided that is capable of providing linear displacement in a plane generally parallel to the surface of a substrate. Additionally, the MEMS thermal actuator of the present invention may provide for a self-contained heating mechanism that allows for the thermal actuator to be actuated using lower power consumption and lower operating temperatures. The MEMS thermal actuator includes a microelectronic substrate having a first surface and at least one anchor structure affixed to the first surface. A composite beam extends from the anchor(s) and overlies the first surface of the substrate. The composite beam is adapted for thermal actuation, such that it will controllably deflect along a predetermined path that extends substantially parallel to the first surface of the microelectronic substrate. In one embodiment the composite beam comprises two or layers having materials that have correspondingly different thermal coefficients of expansion. As such, the layers will respond differently when thermal energy is supplied to the composite. An electrically conductive path may extend throughout the composite beam to effectuate thermal actuation. In one embodiment of the invention a two layer composite beam comprises a first layer of a semiconductor material and a second layer of a metallic material. The semiconductor material may be selectively doped during fabrication so as to create a self-contained heating mechanism within the composite beam. The invention also comprises a MEMS thermal actuator that includes two or more composite beams. The two or more composite beams may be disposed in an array or a ganged fashion, such that the multiple composite beams benefit from overall force multiplication and are therefore capable of greater and more linear displacement distances. The invention is also embodied in a method for fabricating the MEMS thermal actuators of the present invention.

Abstract translation: 提供了一种MEMS热致动器装置，其能够在大致平行于衬底的表面的平面中提供线性位移。 此外，本发明的MEMS热致动器可以提供一种独立的加热机构，其允许使用较低的功率消耗和较低的工作温度来致动热致动器。 MEMS热致动器包括具有固定到第一表面的第一表面和至少一个锚定结构的微电子衬底。 复合梁从锚固体延伸并覆盖在基底的第一表面上。 复合梁适于热致动，使得其可沿着基本上平行于微电子衬底的第一表面延伸的预定路径可控地偏转。 在一个实施例中，复合梁包括具有相应不同热膨胀系数的材料的两层或多层。 因此，当将热能提供给复合材料时，这些层将作出不同的响应。 导电路径可延伸穿过复合梁，以实现热致动。 在本发明的一个实施例中，双层复合束包括第一层半导体材料和第二层金属材料。 半导体材料可以在制造期间被选择性掺杂，以便在复合束内产生独立的加热机构。 本发明还包括包括两个或更多个复合梁的MEMS热致动器。 两个或更多个复合梁可以以阵列或组合的方式设置，使得多个复合梁受益于总的力倍增，因此能够具有更大和更大的线性位移距离。 本发明也体现在本发明的MEMS热致动器的制造方法中。

公开(公告)号：EP1089109A2

公开(公告)日：2001-04-04

申请号：EP00307696.5

申请日：2000-09-06

Applicant: JDS Uniphase Inc.

Inventor： Dhuler, Vijayakumar R. ,  Hill, Edward A. ,  Mahadevan, Ramaswamy ,  Walters, Mark David ,  Wood, Robert L.

IPC: G02B26/02 ,  B81B3/00

CPC classification number: G02B26/0841 ,  B81B3/0054 ,  B81B2201/038 ,  B81B2201/047 ,  G02B6/266

Abstract: A MEMS (Micro Electro Mechanical System) variable optical attenuator is provided that is capable of optical attenuation over a full range of optical power. The MEMS variable optical attenuator comprises a microelectronic substrate, a MEMS actuator and an optical shutter. The MEMS variable optical attenuator may also comprise a clamping element capable of locking the optical shutter at a desired attenuation position. The variable light attenuator is capable of attenuating optical beams that have their optical axis running parallel and perpendicular to the substrate. Additionally, the MEMS actuator of the present invention may comprise an array of MEMS actuators capable of supplying the optical shutter with greater displacement distances and, thus a fuller range of optical attenuation. In one embodiment of the invention, the MEMS actuator comprises a thermal arched beam actuator. Additionally, the variable optical attenuator of the present invention may be embodied in a thermal bimorph cantilever structure. This alternate embodiment includes a microelectronic substrate and a thermal bimorph cantilever structure having at least two materials of different thermal coefficient of expansion. The thermal bimorph is responsive to thermal activation and moves in the direction of the material having the lower thermal coefficient expansion. Upon activation, the thermal bimorph intercepts the path of the optical beam and provides for the desired level of optical attenuation. The invention also provides for a method of optical attenuation and a method for fabricating an optical attenuator in accordance with the described structures.

Abstract translation: 提供了能够在全光范围内进行光衰减的MEMS（微机电系统）可变光衰减器。 MEMS可变光衰减器包括微电子衬底，MEMS致动器和光学快门。 MEMS可变光衰减器还可以包括能够将光学快门锁定在期望的衰减位置的夹紧元件。 可变光衰减器能够使其光轴平行且垂直于衬底的光束衰减。 此外，本发明的MEMS致动器可以包括MEMS致动器的阵列，其能够向光学快门提供更大的位移距离，并且因此具有更宽的光学衰减范围。 在本发明的一个实施例中，MEMS致动器包括热拱形梁致动器。 此外，本发明的可变光衰减器可以以热双压电晶片悬臂结构体现。 该替代实施例包括具有不同热膨胀系数的至少两种材料的微电子衬底和热双压电晶片悬臂结构。 热双压电晶体响应于热激活并沿具有较低热系数膨胀的材料的方向移动。 在激活时，热双压电晶片截取光束的路径，并提供所需的光衰减水平。 本发明还提供了一种光衰减的方法以及根据所述结构制造光衰减器的方法。

公开(公告)号：EP1081391A2

公开(公告)日：2001-03-07

申请号：EP00810770.8

申请日：2000-08-29

Applicant: JDS Uniphase Inc. ,  Cronos Integrated Microsystems, Inc.

Inventor： Dhuler, Vijayakumar R. ,  Walters, Mark David

IPC: F15C5/00

CPC classification number: F15C5/00 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  B81C2203/031 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0009 ,  F16K99/0011 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2001/0042

Abstract: A microelectromechanical (MEMS) device (10) is provided that includes a microelectronic substrate (50) and a thermally actuated microactuator (20). For example, the MEMS device (10) may be a valve. As such, the valve may include at least one valve plate (30) that is controllably brought into engagement with at least one valve opening (40) in the microelectronic substrate (50) by selective actuation of the microactuator (20). While the MEMS device (10) can include various microactuators (20), the microactuator advantageously includes a pair of spaced apart supports (22) disposed on the substrate (50) and at least one arched beam (24) extending therebetween. The microactuator (20) may further include metallization traces (70) on distal portions (23) of the arched beams (24) to constrain the thermally actuated regions of arched beams to medial portions thereof. The valve may also include a latch (680) for maintaining the valve plate (30) in a desired position without requiring continuous energy input to the microactuator (20).

Abstract translation: 提供了一种包括微电子衬底（50）和热致动微致动器（20）的微机电（MEMS）装置（10）。 例如，MEMS器件（10）可以是阀。 因此，阀可以包括至少一个阀板（30），其通过选择性地致动微致动器（20）而可控制地与微电子衬底（50）中的至少一个阀开口（40）接合。 虽然MEMS器件（10）可以包括各种微致动器（20），微致动器有利地包括设置在基板（50）上的一对间隔开的支撑件（22）和在其间延伸的至少一个拱形梁（24）。 微致动器（20）还可包括在拱形梁（24）的远侧部分（23）上的金属化走线（70），以将拱形梁的热致动区域约束到其中间部分。 阀还可以包括用于将阀板（30）保持在期望位置的闩锁（680），而不需要对微致动器（20）的连续能量输入。