公开(公告)号：US20160157334A1

公开(公告)日：2016-06-02

申请号：US14893255

申请日：2013-12-12

Applicant: KANEKA CORPORATION

Inventor： Aki KOUKAMI ,  Kazuo HAGIWARA ,  Keisuke OGUMA ,  Kazuhide FUJIMOTO

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0104 ,  H05K2201/06 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

Abstract translation: 一种散热结构，包括：印刷电路板; 第一发热元件; 第二发热元件; 和导热性可固化液体树脂组合物的固化物，所述印刷电路板具有与所述第一表面相对的第一表面和第二表面，所述第一发热元件设置在所述第一表面上， 所述第一发热元件被放置在所述第二表面上，所述第一发热元件产生与所述第二发热元件相同或更多的热量，所述第二发热元件被所述固化产物包围，所述第一发热元件 被具有比固化产物低的热导率的层包围。

公开(公告)号：US20150351217A1

公开(公告)日：2015-12-03

申请号：US14646340

申请日：2013-11-20

Applicant: KANEKA CORPORATION

Inventor： Aki KOUKAMI ,  Kazuo HAGIWARA ,  Keisuke OGUMA

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0204 ,  H01L23/3121 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/284 ,  H05K7/20463 ,  H05K9/0024 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A heat dissipation structure including: (A) a printed circuit board; (B) a heat-generating element; (C) an electromagnetic shielding case; (D) a rubbery, thermally conductive resin layer with a tensile elastic modulus of 50 MPa or lower and a thermal conductivity of 0.5 W/mK or higher; and (E) a thermally non-conductive layer with a thermal conductivity of lower than 0.5 W/mK, the heat-generating element (B) being placed on the printed circuit board (A), the heat-generating element (B) and the thermally conductive resin layer (D) being in contact with each other, the thermally non-conductive layer (E) being provided between the heat-generating element (B) and the electromagnetic shielding case (C).

Abstract translation: 一种散热结构，包括：（A）印刷电路板; （B）发热元件; （C）电磁屏蔽壳; （D）拉伸弹性模量为50MPa以下，热导率为0.5W / m·K以上的橡胶状导热性树脂层; 和（E）导热率低于0.5W / mK的热不导电层，发热元件（B）放置在印刷电路板（A），发热元件（B）和 所述导热性树脂层（D）彼此接触，所述热不导电层（E）设置在所述发热元件（B）和所述电磁屏蔽壳体（C）之间。