公开(公告)号：DE69916761T2

公开(公告)日：2004-09-23

申请号：DE69916761

申请日：1999-11-04

Applicant: KOREA ELECTRONICS TECHNOLOGY ,  PILKOR ELECTRONICS LTD

Inventor： KANG NAM KEE ,  PARK IN SHIG ,  LIM WOOK ,  YOO CHAN SEI ,  KIM JONG DAE ,  KO HYUN JONG ,  KIM SANG CHEOL

IPC: H01F17/00 ,  H01F27/34

Abstract: A multilayer type chip inductor includes a pair of outermost sheets each of which has a terminal pattern and a first via hole for an electrical connection with neighboring patterns and a plurality of intermediate sheets each of which has a conductor pattern, a second via hole for an electrical connection with neighboring patterns, and a first through hole for reducing a dielectric constant of the inductor. The intermediate sheets are stacked between the outermost sheets in such a way that the conductor patterns thereof are electrically connected with each other and simultaneously are electrically connected with the terminal patterns of the outermost sheets through the first and the second via holes.

公开(公告)号：DE69916761D1

公开(公告)日：2004-06-03

申请号：DE69916761

申请日：1999-11-04

Applicant: KOREA ELECTRONICS TECHNOLOGY ,  PILKOR ELECTRONICS LTD

Inventor： KANG NAM KEE ,  PARK IN SHIG ,  LIM WOOK ,  YOO CHAN SEI ,  KIM JONG DAE ,  KO HYUN JONG ,  KIM SANG CHEOL

IPC: H01F17/00 ,  H01F27/34

Abstract: A multilayer type chip inductor includes a pair of outermost sheets each of which has a terminal pattern and a first via hole for an electrical connection with neighboring patterns and a plurality of intermediate sheets each of which has a conductor pattern, a second via hole for an electrical connection with neighboring patterns, and a first through hole for reducing a dielectric constant of the inductor. The intermediate sheets are stacked between the outermost sheets in such a way that the conductor patterns thereof are electrically connected with each other and simultaneously are electrically connected with the terminal patterns of the outermost sheets through the first and the second via holes.

公开(公告)号：KR20090007917A

公开(公告)日：2009-01-21

申请号：KR20070071141

申请日：2007-07-16

Applicant: KOREA ELECTRONICS TECHNOLOGY

Inventor： YOO MYONG JAE ,  PARK SEONG DAE ,  KANG NAM KEE

IPC: H01C7/00

Abstract: A thermosetting paste for thick film resistor, manufacturing method thereof, and thick film resistor are provided to maintain high electric conductance by using filler having negative temperature coefficient of resistance or low coefficient of thermal expansion along with carbon black. A manufacturing method of thermosetting paste for thick film resistor comprises the following steps: a step for preparing for an organic resin(S210); a step for first-mixing the organic resin(S220); a step for second-mixing the organic resin(S230); and a step for performing three roll milling about the organic resin(S240). A carbon black is injected into a first-mixed organic resin. A deaeration and filtering processes are performed about a second-mixed organic resin.

Abstract translation: 提供一种用于厚膜电阻器的热固性糊剂，其制造方法和厚膜电阻器，以通过使用具有负的耐温系数或低的热膨胀系数的填料以及炭黑来保持高电导率。 一种用于厚膜电阻器的热固性糊剂的制造方法，包括以下步骤：制备有机树脂的步骤（S210）; 首先混合有机树脂的步骤（S220）; 二次混合有机树脂的步骤（S230）; 以及关于有机树脂进行三辊研磨的步骤（S240）。 将炭黑注入第一混合有机树脂中。 对二次混合有机树脂进行脱气和过滤。