中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

19 records (took 0.019 seconds)

    Specific gravity monitor
    1.
    发明授权
    Specific gravity monitor 失效
    比重监测仪

    公开(公告)号：US3922511A

    公开(公告)日：1975-11-25

    申请号：US35677173

    申请日：1973-05-03

    Applicant: MACDERMID INC

    Inventor： LETIZE RAYMOND A ,  JOHNSON JAMES A

    IPC: H05K3/06 ,  C23F1/08 ,  C23F1/46 ,  G01N9/18 ,  H01H35/18

    CPC classification number: G01N9/18

    Abstract: Apparatus is disclosed for sensing small changes in the specific gravity of a solution system undergoing change, whereby through periodic withdrawal and replenishment thereof to compensate for chemical reaction taking place within the solution, the specific gravity can be maintained substantially uniform. In the system, a portion of the solution is continuously monitored for specific gravity by a float operated sensor whose effective density is equal to a predetermined minimum specific gravity condition, and whose float volume bears a predetermined minimum numerical ratio to the minimum predetermined specific gravity, the sensor being employed to control operation of a pump which simultaneously withdraws solution which has undergone reaction and reintroduces an equal volume of fresh solution to the reaction site.

    Abstract translation: 公开了用于检测经历变化的溶液系统的比重的小变化的装置，由此通过周期性的取出和补充来补偿溶液中发生的化学反应，比重可以保持基本均匀。 在该系统中，通过浮动操作的传感器连续监测溶液的一部分，该浮动操作传感器的有效密度等于预定的最小比重条件，并且其浮动体积与最小预定比重具有预定的最小数值比， 所述传感器用于控制泵的操作，所述泵同时抽出经过反应的溶液并且将等体积的新鲜溶液重新引入反应部位。

    PROCESS FOR STRIPPING TIN OR TIN-LEAD ALLOY FROM COPPER
    4.
    发明专利
    PROCESS FOR STRIPPING TIN OR TIN-LEAD ALLOY FROM COPPER 未知

    公开(公告)号：AU7643887A

    公开(公告)日：1988-01-12

    申请号：AU7643887

    申请日：1987-06-17

    Applicant: MACDERMID INC

    Inventor： WILLIAMS ANN S ,  LETIZE RAYMOND A

    IPC: C23F1/44 ,  H05K3/06 ,  C23F1/00 ,  C03C25/06 ,  C03C15/00 ,  B44C1/22

    Abstract: A two step process is described for selectively stripping tin or tin-lead alloys from a copper substrate without significant loss of copper from the substrate. In a first step the substrate coated with tin or tin-lead alloy is subjected to the action of a first stripping composition which can be any of those known in the art containing a mixture of an oxidant for the metal or metals of said layer and an acceptor for the cation or cations so oxidized. When the stripping has reached the stage at which a thin film of tin remains on the copper substrate the latter is subjected to the action of a second stripping composition which comprises a mixture of an alkali metal hydroxide and an alkali metal chlorite until the film of tin has been removed and replaced by a film of copper oxide. If desired, the latter can be removed by known means such as treatment with aqueous acid. The process represents an improvement over known processes in which, in order to remove the last traces of tin from the copper substrate or to remove the film of tin which in some cases is re-deposited from the stripper composition itself, it is necessary to employ stripping conditions so rigorous that significant loss of copper from the substrate takes place. While the process of the invention is applicable to stripping of tin or tin-lead alloys from copper substrates in a wide variety of contexts, it is of particular application to stripping etch resists from copper substrates after completion of the etching step in formation of a printed circuit board.

    PROCESS FOR INCREASING THE ADHESION OF A METAL SURFACE TO A POLYMER
    6.
    发明申请
    PROCESS FOR INCREASING THE ADHESION OF A METAL SURFACE TO A POLYMER 审中-公开
    将金属表面粘附到聚合物上的方法

    公开(公告)号：WO2008005094A3

    公开(公告)日：2008-03-13

    申请号：PCT/US2007010340

    申请日：2007-04-27

    Applicant: MACDERMID INC ,  LETIZE RAYMOND A

    Inventor： LETIZE RAYMOND A

    IPC: C23C22/06 ,  C23C22/52

    CPC classification number: C23C22/52 ,  H05K3/385 ,  H05K2203/0789

    Abstract: A process for increasing the adhesion between a copper or copper alloy surface and a polymeric material is disclosed. The process comprises treating the copper or copper alloy surface with an aqueous solution of cupric ions at a pH from 2.8 to 4.2 to form an oxide conversion coating on the copper or copper alloy surface. The so treated surface can then be bonded to the polymeric material.

    Abstract translation: 公开了一种用于增加铜或铜合金表面与聚合物材料之间的粘附性的方法。 该方法包括在2.8至4.2的pH下用铜离子水溶液处理铜或铜合金表面，以在铜或铜合金表面上形成氧化物转化涂层。 然后将如此处理的表面结合到聚合物材料上。

    SYSTEM AND PROCESS FOR ETCHING WITH AND REGENERATING, ALKALINE AMMONIACAL ETCHANT SOLUTION
    8.
    发明专利
    SYSTEM AND PROCESS FOR ETCHING WITH AND REGENERATING, ALKALINE AMMONIACAL ETCHANT SOLUTION 未知

    公开(公告)号：CA2029444A1

    公开(公告)日：1991-09-22

    申请号：CA2029444

    申请日：1990-11-07

    Applicant: MACDERMID INC

    Inventor： LETIZE RAYMOND A ,  GIGAS BERND ,  KUKANSKIS PETER E

    IPC: C23F1/34 ,  C23F1/46 ,  H05K3/26

    Abstract: A process and related system is disclosed for etching copper with, and regenerating, a working alkaline ammoniacal etchant solution, the regeneration involving withdrawal of a portion of the working solution as spent etchant solution and electrolytic removal therefrom of at least a portion of the etched copper therein so as to produce a fresh etchant solution which is returned to the working solution; accumulation vessels upstream and downstream of the electrolytic process; and supply to the working solution and/or the fresh etchant solution of sufficient oxygen and ammonia to maintain the desired cupric ion content and pH in the working solution.

    9.
    发明专利
    未知

    公开(公告)号：DE2420496A1

    公开(公告)日：1974-11-21

    申请号：DE2420496

    申请日：1974-04-25

    Applicant: MACDERMID INC

    Inventor： LETIZE RAYMOND A ,  JOHNSON JAMES A

    IPC: H05K3/06 ,  C23F1/08 ,  C23F1/46 ,  G01N9/18 ,  G05D11/06 ,  H01H36/02

    Abstract: Apparatus is disclosed for sensing small changes in the specific gravity of a solution system undergoing change, whereby through periodic withdrawal and replenishment thereof to compensate for chemical reaction taking place within the solution, the specific gravity can be maintained substantially uniform. In the system, a portion of the solution is continuously monitored for specific gravity by a float operated sensor whose effective density is equal to a predetermined minimum specific gravity condition, and whose float volume bears a predetermined minimum numerical ratio to the minimum predetermined specific gravity, the sensor being employed to control operation of a pump which simultaneously withdraws solution which has undergone reaction and reintroduces an equal volume of fresh solution to the reaction site.

Patent Agency Ranking