公开(公告)号：CA2009131A1

公开(公告)日：1990-11-10

申请号：CA2009131

申请日：1990-02-01

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  RETALLICK RICHARD C

IPC: C23C18/38 ,  C23C18/31 ,  C23C18/40 ,  C25D3/38 ,  C23C18/54

Abstract: Non-adherent copper metal particles ("fines") formed in a plating bath during the course of autocatalytic electroless copper deposition onto activated substrate surfaces are oxidized and redissolved in the bath by brief application of current between an anode element and a cathode element immersed in the bath, the anode element being comprised of an anode surface substantially parallel and proximate to the bottom surface of the vessel containing the bath.

公开(公告)号：CA2031422A1

公开(公告)日：1991-11-02

申请号：CA2031422

申请日：1990-12-04

Applicant: MACDERMID INC

Inventor： RETALLICK RICHARD C ,  LETIZE RAYMOND A ,  KUKANSKIS PETER E

IPC: H05K3/26 ,  C23C18/22 ,  H05K3/00 ,  H05K3/38 ,  H05K3/46 ,  C23C18/20 ,  C23C18/28 ,  C23C18/38

Abstract: The adhesion between surfaces of polyimide, particularly the through hole surfaces of polyimide-based multilayer laminates used in the fabrication of multilayer printed circuits, is improved by pretreatment of the surfaces with an essentially non-alkaline aqueous permanganate solution.

公开(公告)号：WO2006043994A3

公开(公告)日：2006-09-28

申请号：PCT/US2005020635

申请日：2005-06-10

Applicant: MACDERMID INC

Inventor： RETALLICK RICHARD C ,  LEE HYUNJUNG

IPC: C25D5/34 ,  C25D3/38

CPC classification number: C25D3/38 ,  C25D5/34 ,  H05K3/0055 ,  H05K3/383 ,  H05K3/424 ,  H05K3/427 ,  H05K2201/0323

Abstract: A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating.

Abstract translation: 提出了一种制备用于电镀的非导电基材的方法。 所提出的方法包括在去污之后使基材与组合的中和/牺牲涂层溶液接触，然后用碳分散溶液处理。 组合的中和/牺牲涂层溶液从去污步骤中中和高锰酸盐残余物，并将牺牲涂层施加到基材上的金属表面。 牺牲涂层允许在电镀之前从金属表面容易且可靠地去除不需要的碳残余物。

公开(公告)号：EP2326751A4

公开(公告)日：2011-11-02

申请号：EP09805315

申请日：2009-06-08

Applicant: MACDERMID INC

Inventor： RETALLICK RICHARD C ,  RAU WERNER ,  SCHUSTER JOSEF

IPC: H05K3/42 ,  C25D5/02

CPC classification number: H05K3/424 ,  H05K3/427 ,  H05K2201/0323 ,  H05K2203/0143 ,  H05K2203/082

公开(公告)号：EP1799884A4

公开(公告)日：2007-10-03

申请号：EP05758554

申请日：2005-06-10

Applicant: MACDERMID INC

Inventor： RETALLICK RICHARD C ,  LEE HYUNJUNG

IPC: C25D5/34 ,  C25D3/38

CPC classification number: C25D3/38 ,  C25D5/34 ,  H05K3/0055 ,  H05K3/383 ,  H05K3/424 ,  H05K3/427 ,  H05K2201/0323

Abstract: A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating.

Abstract translation: 提出了一种制备用于电镀的非导电基材的方法。 所提出的方法包括在去污之后使基材与组合的中和/牺牲涂层溶液接触，然后用碳分散溶液处理。 组合的中和/牺牲涂层溶液从去污步骤中中和高锰酸盐残余物，并将牺牲涂层施加到基材上的金属表面。 牺牲涂层允许在电镀之前从金属表面容易且可靠地去除不需要的碳残余物。