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公开(公告)号：WO2014179111A3
公开(公告)日：2016-03-10
申请号：PCT/US2014034908
申请日：2014-04-22
Applicant: MKS INSTR INC
Inventor： GU LEI , BART STEPHEN F
CPC classification number: F15D1/0005 , G01L19/0007 , G01L19/0636 , Y10T29/49
Abstract: A pressure sensor system may sense the pressure of a gas or liquid. The system may include a housing that has an entry port for the gas or liquid; a pressure sensor within the housing; and a baffle positioned between the entry port and the pressure sensor. The baffle may have one or more inlets oriented to receive gas or liquid that enters the entry port; one or more outlets oriented to deliver the received gas or liquid to the pressure sensor; and one or more sealed flow channels that prevent the gas or liquid from escaping from the baffle, other than through the one or more outlets. At least one of the outlets may be located within no more than one millimeter of a location on the pressure sensor. The pressure sensor and baffle may be made at the same time during a process of depositing, pattering, etching, wafer bonding, and/or wafer thinning a series of layers using microelectromechanical systems (MEMS) technology.
Abstract translation: 压力传感器系统可以感测气体或液体的压力。 该系统可以包括具有用于气体或液体的入口的壳体; 壳体内的压力传感器; 以及位于入口和压力传感器之间的挡板。 挡板可以具有一个或多个入口，其定向成接收进入入口的气体或液体; 一个或多个出口定向成将接收的气体或液体输送到压力传感器; 以及一个或多个密封的流动通道，其防止气体或液体从挡板逸出，而不是通过一个或多个出口。 出口中的至少一个可以位于压力传感器上的位置不超过一毫米处。 可以在使用微机电系统（MEMS）技术的沉积，图案化，蚀刻，晶片结合和/或晶片薄化一系列层的过程的同时制造压力传感器和挡板。
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公开(公告)号：WO2015148005A3
公开(公告)日：2015-12-03
申请号：PCT/US2015015810
申请日：2015-02-13
Applicant: MKS INSTR INC
Inventor： GU LEI , BART STEPHEN F , WENZEL OLE
IPC: G01L21/12
Abstract: Micro-Pirani gauge vacuum gauges are described that use low-thermal conductivity support elements. A micro-Pirani gauge or vacuum sensor can include a heating element operative to heat a gas and to produce a signal corresponding to the pressure of the gas; a platform configured to receive the heating element, with the platform having a first coefficient of thermal conductivity; and a support element connected to a substrate and configured to support the platform with the heating element within an aperture disposed in the substrate, with the support element having a second coefficient of thermal conductivity, where the second coefficient of thermal conductivity is less than the first coefficient of thermal conductivity. Multimode pressure sensing including a micro-Pirani gauge are also described.
Abstract translation: 描述了使用低导热性支撑元件的微皮拉尼真空计。 微型Pirani测量仪或真空传感器可以包括加热元件，其操作用于加热气体并产生对应于气体压力的信号; 平台，其被配置为接收所述加热元件，所述平台具有第一导热系数; 以及支撑元件，其连接到基板并且被配置为将所述平台与所述加热元件支撑在设置在所述基板内的孔内，所述支撑元件具有第二导热系数，其中所述第二导热系数小于所述第一导热系数 导热系数。 还描述了包括微型Pirani压力计的多模式压力感测。
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公开(公告)号：EP3253708A4
公开(公告)日：2018-08-01
申请号：EP16746948
申请日：2016-01-15
Applicant: MKS INSTR INC
Inventor： GU LEI , BART STEPHEN F
CPC classification number: B81B7/0048 , B81B2201/0264 , B81C1/00325 , B81C1/00547 , B81C2201/013 , H01L2224/48091 , H01L2924/00014
Abstract: Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.
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公开(公告)号：EP2962079A4
公开(公告)日：2016-11-02
申请号：EP14757769
申请日：2014-02-14
Applicant: MKS INSTR INC
Inventor： GU LEI , LUCAS PAUL D , BART STEPHEN F , SULLIVAN PHILIP W
CPC classification number: G01L19/0092 , G01L9/0072
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公开(公告)号：EP3001862A4
公开(公告)日：2017-04-12
申请号：EP14791513
申请日：2014-04-22
Applicant: MKS INSTR INC
Inventor： GU LEI , BART STEPHEN F
CPC classification number: F15D1/0005 , G01L19/0007 , G01L19/0636 , Y10T29/49
Abstract: A pressure sensor system may sense the pressure of a gas or liquid. The system may include a housing that has an entry port for the gas or liquid; a pressure sensor within the housing; and a baffle positioned between the entry port and the pressure sensor. The baffle may have one or more inlets oriented to receive gas or liquid that enters the entry port; one or more outlets oriented to deliver the received gas or liquid to the pressure sensor; and one or more sealed flow channels that prevent the gas or liquid from escaping from the baffle, other than through the one or more outlets. At least one of the outlets may be located within no more than one millimeter of a location on the pressure sensor. The pressure sensor and baffle may be made at the same time during a process of depositing, pattering, etching, wafer bonding, and/or wafer thinning a series of layers using microelectromechanical systems (MEMS) technology.
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Patent Agency Ranking
公开(公告)号：SG11201506305UA
公开(公告)日：2015-09-29
申请号：SG11201506305U
申请日：2014-04-22
Applicant: MKS INSTR INC
Inventor： GU LEI , BART STEPHEN F
Abstract: A pressure sensor system may sense the pressure of a gas or liquid. The system may include a housing that has an entry port for the gas or liquid; a pressure sensor within the housing; and a baffle positioned between the entry port and the pressure sensor. The baffle may have one or more inlets oriented to receive gas or liquid that enters the entry port; one or more outlets oriented to deliver the received gas or liquid to the pressure sensor; and one or more sealed flow channels that prevent the gas or liquid from escaping from the baffle, other than through the one or more outlets. At least one of the outlets may be located within no more than one millimeter of a location on the pressure sensor. The pressure sensor and baffle may be made at the same time during a process of depositing, pattering, etching, wafer bonding, and/or wafer thinning a series of layers using microelectromechanical systems (MEMS) technology.
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公开(公告)号：SG11201504941UA
公开(公告)日：2015-07-30
申请号：SG11201504941U
申请日：2014-02-14
Applicant: MKS INSTR INC
Inventor： GU LEI , LUCAS PAUL D , BART STEPHEN F , SULLIVAN PHILIP W
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公开(公告)号：SG11201607491UA
公开(公告)日：2016-10-28
申请号：SG11201607491U
申请日：2015-02-13
Applicant: MKS INSTR INC
Inventor： GU LEI , BART STEPHEN F , WENZEL OLE
IPC: G01L21/12
Abstract: Micro-Pirani gauge vacuum gauges are described that use low-thermal conductivity support elements. A micro-Pirani gauge or vacuum sensor can include a heating element operative to heat a gas and to produce a signal corresponding to the pressure of the gas; a platform configured to receive the heating element, with the platform having a first coefficient of thermal conductivity; and a support element connected to a substrate and configured to support the platform with the heating element within an aperture disposed in the substrate, with the support element having a second coefficient of thermal conductivity, where the second coefficient of thermal conductivity is less than the first coefficient of thermal conductivity. Multimode pressure sensing including a micro-Pirani gauge are also described.
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公开(公告)号：DK3001862T3
公开(公告)日：2021-10-11
申请号：DK14791513
申请日：2014-04-22
Applicant: MKS INSTR INC
Inventor： GU LEI , BART STEPHEN F
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公开(公告)号：SG10201906105RA
公开(公告)日：2019-08-27
申请号：SG10201906105R
申请日：2016-01-15
Applicant: MKS INSTR INC
Inventor： GU LEI , BART STEPHEN F
Abstract: STRESS RELIEF MEMS STRUCTURE AND PACKAGE Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor 5 having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support 10 member are configured to reduce stress produced by package-sensor interaction. FIG. 1 FIG.2
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