公开(公告)号：AU2003304052A1

公开(公告)日：2004-11-19

申请号：AU2003304052

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

IPC: B81B7/00

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

公开(公告)号：AU2003304052A8

公开(公告)日：2004-11-19

申请号：AU2003304052

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  LIAN KE ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT

IPC: B81B7/00 ,  H01P1/10

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

公开(公告)号：AU2002309978A1

公开(公告)日：2003-02-24

申请号：AU2002309978

申请日：2002-05-17

Applicant: MOTOROLA INC

Inventor： LEMPKOWSKI ROBERT

IPC: H01L21/8258 ,  H01Q21/24 ,  H04B14/00 ,  G02F1/015

Abstract: Polarization modulator devices can be formed to take advantage of multi-layered semiconductor structures. High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.

公开(公告)号：WO03014812A2

公开(公告)日：2003-02-20

申请号：PCT/US0215933

申请日：2002-05-17

Applicant: MOTOROLA INC

Inventor： LEMPKOWSKI ROBERT

IPC: H01L21/8258 ,  H01Q21/24 ,  H04B14/00 ,  G02F1/015

CPC classification number: H01L21/8258 ,  H01Q21/24 ,  H04B14/008

Abstract: Polarization modulator devices (300) can be formed to take advantage of multi-layered semiconductor structures. High quality epitaxial layers (26) of monocrystalline materials can be grown overlying monocrystalline substrates (22) such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer (24) comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer (28) of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.

Abstract translation: 可以形成极化调制器装置（300）以利用多层半导体结构。 通过形成用于生长单晶层的柔性衬底，可以将单晶材料的高质量外延层（26）生长在覆盖单晶衬底（22），例如大硅晶片上。 容纳缓冲层（24）包括通过氧化硅的非晶界面层（28）与硅晶片隔开的单晶氧化物层。 非晶界面层消耗应变并允许高质量单晶氧化物容纳缓冲层的生长。 容纳缓冲层与下面的硅晶片和上覆的单晶材料层晶格匹配。 通过非晶界面层处理容纳缓冲层和底层硅衬底之间的任何晶格失配。

公开(公告)号：WO2004095508A3

公开(公告)日：2005-05-06

申请号：PCT/US0340468

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

IPC: B81B7/00 ,  H01P1/10

CPC classification number: B81C1/00333 ,  H01H2001/0073

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

Abstract translation: 用于微机的中尺度微机电系统（MEMS）封装。 中等尺寸的微型机器同时形成在印刷电路板（10）上并且与中等尺寸的微型机器包装材料相同。 微机和封装均具有第一金属层（12,16），形成在第一金属层上的绝缘构件（22,26）和位于绝缘层上的第二金属层（32,36）。 该包装由围绕微机的周边壁和低流量封盖粘合剂层（40）组成。 微机和封装的第一金属层以相同的工艺顺序形成，微机和封装的绝缘层以相同的工艺顺序形成，并且两者的第二金属层 微机和封装以相同的工艺顺序形成。 低流量封盖粘合剂将可选的盖（46）固定在包装上以提供环境密封。

公开(公告)号：EP1576690A4

公开(公告)日：2006-05-10

申请号：EP03816486

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

IPC: H01P1/12 ,  B81B7/00

CPC classification number: B81C1/00333 ,  H01H2001/0073

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.