公开(公告)号：AU2003304052A8

公开(公告)日：2004-11-19

申请号：AU2003304052

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  LIAN KE ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT

IPC: B81B7/00 ,  H01P1/10

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

公开(公告)号：AU2003304052A1

公开(公告)日：2004-11-19

申请号：AU2003304052

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

IPC: B81B7/00

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

公开(公告)号：WO2004095508A3

公开(公告)日：2005-05-06

申请号：PCT/US0340468

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

IPC: B81B7/00 ,  H01P1/10

CPC classification number: B81C1/00333 ,  H01H2001/0073

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

Abstract translation: 用于微机的中尺度微机电系统（MEMS）封装。 中等尺寸的微型机器同时形成在印刷电路板（10）上并且与中等尺寸的微型机器包装材料相同。 微机和封装均具有第一金属层（12,16），形成在第一金属层上的绝缘构件（22,26）和位于绝缘层上的第二金属层（32,36）。 该包装由围绕微机的周边壁和低流量封盖粘合剂层（40）组成。 微机和封装的第一金属层以相同的工艺顺序形成，微机和封装的绝缘层以相同的工艺顺序形成，并且两者的第二金属层 微机和封装以相同的工艺顺序形成。 低流量封盖粘合剂将可选的盖（46）固定在包装上以提供环境密封。

公开(公告)号：EP1576690A4

公开(公告)日：2006-05-10

申请号：EP03816486

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

IPC: H01P1/12 ,  B81B7/00

CPC classification number: B81C1/00333 ,  H01H2001/0073

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.