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    MESO-MICROELECTROMECHANICAL SYSTEM PACKAGE
    1.
    发明专利
    MESO-MICROELECTROMECHANICAL SYSTEM PACKAGE 未知

    公开(公告)号：AU2003304052A1

    公开(公告)日：2004-11-19

    申请号：AU2003304052

    申请日：2003-12-18

    Applicant: MOTOROLA INC

    Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

    IPC: B81B7/00

    Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

    Micro electro-mechanical system apparatus and method
    2.
    发明专利
    Micro electro-mechanical system apparatus and method 未知

    公开(公告)号：AU2003234772A8

    公开(公告)日：2003-11-11

    申请号：AU2003234772

    申请日：2003-04-29

    Applicant: MOTOROLA INC

    Inventor： JONNALAGADDA KRISHNA ,  ELIACIN MANES ,  LANE SPENCER A

    IPC: B81B3/00 ,  H01H59/00 ,  B81B7/04 ,  B81C5/00

    Abstract: A meso-scale MEMS device having a movable member (51) is formed using standard printed wiring board and high density interconnect technologies and practices. In one embodiment, sacrificial material disposed about the movable member (51) is removed through openings (101, 102) as formed through a cover (91) to form a cavity (121) that retains and limits the freedom of movement of the movable member (51). The movable member can support a reflective surface (224) to thereby provide a mechanism that will support a projection display and/or image scanner (such as a bar code scanner).

    ORGANIC SEMICONDUCTOR DEVICE AND METHOD
    4.
    发明专利
    ORGANIC SEMICONDUCTOR DEVICE AND METHOD 未知

    公开(公告)号：AU2003251297A1

    公开(公告)日：2003-12-12

    申请号：AU2003251297

    申请日：2003-05-13

    Applicant: MOTOROLA INC

    Inventor： ELIACIN MANES ,  LIAN KE KERYN ,  CROSWELL ROBERT T ,  TUNGARE AROON

    IPC: H01L21/316 ,  H01L25/04 ,  H01L27/28 ,  H01L51/05 ,  H05K1/18

    Abstract: An organic semiconductor device ( 11 ) can be embedded within a printed wiring board ( 10 ). In various embodiments, the embedded device ( 11 ) can be accompanied by other organic semiconductor devices ( 31 ) and/or passive electrical components ( 26 ). When so embedded, conductive vias ( 41, 42, 43 ) can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.

    Meso-microelectromechanical system package
    6.
    发明专利
    Meso-microelectromechanical system package 未知

    公开(公告)号：AU2003304052A8

    公开(公告)日：2004-11-19

    申请号：AU2003304052

    申请日：2003-12-18

    Applicant: MOTOROLA INC

    Inventor： ELIACIN MANES ,  LIAN KE ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT

    IPC: B81B7/00 ,  H01P1/10

    Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

    MICRO ELECTRO-MECHANICAL SYSTEM WITH ONE OR MORE MOVING PARTS METHOD AND APPARATUS
    8.
    发明专利
    MICRO ELECTRO-MECHANICAL SYSTEM WITH ONE OR MORE MOVING PARTS METHOD AND APPARATUS 未知

    公开(公告)号：AU2003234772A1

    公开(公告)日：2003-11-11

    申请号：AU2003234772

    申请日：2003-04-29

    Applicant: MOTOROLA INC

    Inventor： ELIACIN MANES ,  LANE SPENCER A ,  JONNALAGADDA KRISHNA

    IPC: B81B3/00 ,  H01H59/00

    Abstract: A meso-scale MEMS device having a movable member (51) is formed using standard printed wiring board and high density interconnect technologies and practices. In one embodiment, sacrificial material disposed about the movable member (51) is removed through openings (101, 102) as formed through a cover (91) to form a cavity (121) that retains and limits the freedom of movement of the movable member (51). The movable member can support a reflective surface (224) to thereby provide a mechanism that will support a projection display and/or image scanner (such as a bar code scanner).

    MESO-MICROELECTROMECHANICAL SYSTEM PACKAGE
    9.
    发明公开
    MESO-MICROELECTROMECHANICAL SYSTEM PACKAGE 审中-公开
    MESO-MIKROELEKTROMECHANISCHE SYSTEMKAPSELUNG

    公开(公告)号：EP1576690A4

    公开(公告)日：2006-05-10

    申请号：EP03816486

    申请日：2003-12-18

    Applicant: MOTOROLA INC

    Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

    IPC: H01P1/12 ,  B81B7/00

    CPC classification number: B81C1/00333 ,  H01H2001/0073

    Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

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