公开(公告)号：AU2003304052A8

公开(公告)日：2004-11-19

申请号：AU2003304052

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  LIAN KE ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT

IPC: B81B7/00 ,  H01P1/10

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

公开(公告)号：AU2003304052A1

公开(公告)日：2004-11-19

申请号：AU2003304052

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

IPC: B81B7/00

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

公开(公告)号：AT362305T

公开(公告)日：2007-06-15

申请号：AT00950932

申请日：2000-08-02

Applicant: MOTOROLA INC

Inventor： ANDERSON DAVID ,  KLOSOWIAK TOMASZ

IPC: H05K1/03 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00

Abstract: A flexible circuit board and a method for making a flexible circuit board. The flexible circuit board (10) is formed from a substantially rigid material and includes a first portion (12) and a second portion (14) coupled by a bend region (16). The bend region (16) includes at least one bend (40, 52) having a radius less than 120 mils.

公开(公告)号：AU2003296904A1

公开(公告)日：2004-05-04

申请号：AU2003296904

申请日：2003-09-05

Applicant: MOTOROLA INC

Inventor： QI JING ,  DANVIR JANICE ,  KLOSOWIAK TOMASZ

IPC: H01L21/60 ,  H01L21/301 ,  H01L21/304 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

Abstract: A method for providing an underfill material on an integrated circuit chip at the wafer level. The wafer (10) typically contains one or more integrated circuit chips (12), and each integrated circuit chip typically has a plurality of solder bumps (34) on its active surface. The wafer is first diced (22) on the active surface side to form channels (38) that will ultimately define the edges (39) of each individual integrated circuit chip, the dicing being of such a depth that it only cuts part-way through the wafer. The front side (36) of the wafer is then coated (24) with an underfill material (40). Generally, a portion (45) of each solder bump remains uncoated, but in certain cases the bumps can be completely covered. The back side of the wafer is then lapped, ground, polished or otherwise treated (26) so as to remove material down to the level of the previously diced channels. This reduction in the thickness of the wafer causes the original diced channels to now extend completely from the front side to the back side of the wafer. The wafer is then singulated (28) by cutting the underfill material (92) that was deposited in the channels during the coating step, so that the integrated circuit chip (12) is released from the wafer, and the underfill material that was coated on the active side remains affixed to the active surface of each individual integrated circuit chip.

公开(公告)号：WO2004095508A3

公开(公告)日：2005-05-06

申请号：PCT/US0340468

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

IPC: B81B7/00 ,  H01P1/10

CPC classification number: B81C1/00333 ,  H01H2001/0073

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.

Abstract translation: 用于微机的中尺度微机电系统（MEMS）封装。 中等尺寸的微型机器同时形成在印刷电路板（10）上并且与中等尺寸的微型机器包装材料相同。 微机和封装均具有第一金属层（12,16），形成在第一金属层上的绝缘构件（22,26）和位于绝缘层上的第二金属层（32,36）。 该包装由围绕微机的周边壁和低流量封盖粘合剂层（40）组成。 微机和封装的第一金属层以相同的工艺顺序形成，微机和封装的绝缘层以相同的工艺顺序形成，并且两者的第二金属层 微机和封装以相同的工艺顺序形成。 低流量封盖粘合剂将可选的盖（46）固定在包装上以提供环境密封。

公开(公告)号：EP1576690A4

公开(公告)日：2006-05-10

申请号：EP03816486

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  KLOSOWIAK TOMASZ ,  LEMPKOWSKI ROBERT ,  LIAN KE

IPC: H01P1/12 ,  B81B7/00

CPC classification number: B81C1/00333 ,  H01H2001/0073

Abstract: A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.