公开(公告)号：DK142160B

公开(公告)日：1980-09-08

申请号：DK599467

申请日：1967-11-30

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLF JOHN ,  WILLIAMSON JOHN DUFF ,  POLICHETTE JOSEPH NICHOLAS

IPC: C23C18/16 ,  C23C18/20 ,  H01B1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/42

公开(公告)号：DK141823B

公开(公告)日：1980-06-23

申请号：DK151570

申请日：1970-03-24

Applicant: PHOTOCIRCUITS CORP

Inventor： POLICHETTE JOSEPH NICHOLAS

IPC: C09J161/06 ,  C09J163/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  G03C1/62 ,  G03C1/695 ,  G03F7/00 ,  G03F7/004 ,  G03F7/04 ,  G03F7/26 ,  H05K3/18 ,  H05K3/38 ,  C23C3/02

Abstract: An adhesive system which provides adhesive compositions to be applied to an insulating base and form printed images thereon. The adhesive compositions include agents which render them photosensitive, and receptive to electroless metals.