公开(公告)号：DK136840B

公开(公告)日：1977-11-28

申请号：DK397365

申请日：1965-08-02

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLF JOHN ,  WILLIAMSON JOHN DUFF ,  POLICHETTE JOSEPH

IPC: C23C18/16 ,  C23C18/40 ,  H05K3/18 ,  H05K1/02

Abstract: Method for metallizing basic insulation materials, characterized in that it comprises the adhesive bond to the surfaces of the basic material of solid particles of a catalytic agent for the reception of non-electrolytic copper, and the subsequent immersion of the basic material in an alkaline deposit of non-electrolytic copper comprising water, a water soluble cupric salt, an alkali metal hydroxide, a complexing agent for the cupric ion, formaldehyde, and a complexing agent for the cuprous ion, to thereby establish a ductile layer and copper adherent deposited electrolytically in the places where the catalytic agent is exposed to the bath. (Machine-translation by Google Translate, not legally binding)

公开(公告)号：AU1833470A

公开(公告)日：1972-02-10

申请号：AU1833470

申请日：1970-08-03

Applicant: PHOTOCIRCUITS CORP A DIVISION

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLPH J

IPC: C23C18/40 ,  C23C3/00 ,  C23C3/02

Abstract: An improved method for enhancing the ductility of electroless metal deposits is provided in which an electroless metal bath contains an extraneous ion which has a preferential capacity for being coulombically adsorbed at the outer layer of an electric double layer present on an interface in contact with such bath on which said metal is electrolessly depositing, such ion being present in an amount sufficient to reduce the inclusion of hydrogen in the electrolessly deposited metal.

公开(公告)号：AU1833570A

公开(公告)日：1972-02-10

申请号：AU1833570

申请日：1970-08-03

Applicant: PHOTOCIRCUITS CORP A DIVISION

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLPH J

IPC: C23C18/40 ,  C23C3/02

公开(公告)号：DE1244897B

公开(公告)日：1967-07-20

申请号：DEP0026542

申请日：1961-02-08

Applicant: PHOTOCIRCUITS CORP

Inventor： JUN FREDERICK W SCHNEBLE ,  ZEBLISKY RUDOLPH J ,  MCCORMACK JOHN FRANCIS ,  POLICHETTE JOSEPH

IPC: C23C18/16 ,  C23C18/20 ,  H01B3/00 ,  H02K3/26 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18

Abstract: Process for making printing circuits, characterized by establishing an insulating base for an electrically conductive circuit component, comprising a solid electrically insulating material, at least one of whose surfaces comprises, uniformly distributed, finely divided cuprous oxide particles, present the cuprous oxide on said surface in an amount equivalent to that obtained by combining, by weight, 0.25 to 80% of cuprous oxide and 99.75 to 20% of solid insulating material, distributing it uniformly and fixing or curing the mixture . (Machine-translation by Google Translate, not legally binding)

公开(公告)号：DK142160B

公开(公告)日：1980-09-08

申请号：DK599467

申请日：1967-11-30

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLF JOHN ,  WILLIAMSON JOHN DUFF ,  POLICHETTE JOSEPH NICHOLAS

IPC: C23C18/16 ,  C23C18/20 ,  H01B1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/42

公开(公告)号：DE1268471B

公开(公告)日：1968-05-16

申请号：DE1268471

申请日：1964-09-08

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK WILLIAM ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLPH JOSEPH

IPC: C23C18/42 ,  C23C18/44 ,  C23C3/02