公开(公告)号：DK136840B

公开(公告)日：1977-11-28

申请号：DK397365

申请日：1965-08-02

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLF JOHN ,  WILLIAMSON JOHN DUFF ,  POLICHETTE JOSEPH

IPC: C23C18/16 ,  C23C18/40 ,  H05K3/18 ,  H05K1/02

Abstract: Method for metallizing basic insulation materials, characterized in that it comprises the adhesive bond to the surfaces of the basic material of solid particles of a catalytic agent for the reception of non-electrolytic copper, and the subsequent immersion of the basic material in an alkaline deposit of non-electrolytic copper comprising water, a water soluble cupric salt, an alkali metal hydroxide, a complexing agent for the cupric ion, formaldehyde, and a complexing agent for the cuprous ion, to thereby establish a ductile layer and copper adherent deposited electrolytically in the places where the catalytic agent is exposed to the bath. (Machine-translation by Google Translate, not legally binding)

公开(公告)号：DK142160B

公开(公告)日：1980-09-08

申请号：DK599467

申请日：1967-11-30

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLF JOHN ,  WILLIAMSON JOHN DUFF ,  POLICHETTE JOSEPH NICHOLAS

IPC: C23C18/16 ,  C23C18/20 ,  H01B1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/42

公开(公告)号：CH468477A

公开(公告)日：1969-02-15

申请号：CH938366

申请日：1966-06-27

Applicant: PHOTOCIRCUITS CORP

Inventor： FREDERICK WILLIAM SCHNEBLE JR ,  MACCORMACK JOHN F ,  HEIGHTS ROSLYN ,  ZEBLISKY RUDOLPH J ,  WILLIAMSON JOHN DUFF

IPC: C23C18/40 ,  C23C3/02

公开(公告)号：GB1121282A

公开(公告)日：1968-07-24

申请号：GB2627465

申请日：1965-06-22

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK W ,  ZEBLISKY RUDOLPH J ,  MCCORMACK JOHN F ,  WILLIAMSON JOHN DUFF

IPC: C23C18/31 ,  C23C18/36 ,  C23C18/40 ,  C23C18/52

Abstract: In the electroless deposition of e.g. Cu, Ni, Co, Cd, and Sn, a cyanide compound is added in an amount less than 500 milligrams/1. The substrate may be paper, glass, ceramic, synthetic resins or a metal, e.g. Ni, Co, Fe, steel, Pd, Pt, Au, Cu, brass, Mn, Cr, W, Ti, Sn, Ag or Mo. An oxidizing agent, e.g. borohydrides, amine boranes, hydrazines, hypophosphites, hydrosulphites, hydroxyl amines, and formaldehyde may be added. A sequestering agent e.g. ethylene diamine, diethylene triamine, triethylene tetramine, E.D.T.A., citric and tartaric acid, ammonia, Rochelle salts, nitrilo triacetic acid, gluconic acid and gluconates, and triethanolamine, and a surfactant e.g. organic phosphate esters or oxyethylated sodium salts may also be added. Noncatalytic surfaces may be sensitized with stannous chloride and a precious metal salt.