公开(公告)号：DK136840B

公开(公告)日：1977-11-28

申请号：DK397365

申请日：1965-08-02

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLF JOHN ,  WILLIAMSON JOHN DUFF ,  POLICHETTE JOSEPH

IPC: C23C18/16 ,  C23C18/40 ,  H05K3/18 ,  H05K1/02

Abstract: Method for metallizing basic insulation materials, characterized in that it comprises the adhesive bond to the surfaces of the basic material of solid particles of a catalytic agent for the reception of non-electrolytic copper, and the subsequent immersion of the basic material in an alkaline deposit of non-electrolytic copper comprising water, a water soluble cupric salt, an alkali metal hydroxide, a complexing agent for the cupric ion, formaldehyde, and a complexing agent for the cuprous ion, to thereby establish a ductile layer and copper adherent deposited electrolytically in the places where the catalytic agent is exposed to the bath. (Machine-translation by Google Translate, not legally binding)

公开(公告)号：DK142160B

公开(公告)日：1980-09-08

申请号：DK599467

申请日：1967-11-30

Applicant: PHOTOCIRCUITS CORP

Inventor： SCHNEBLE FREDERICK WILLIAM JR ,  MCCORMACK JOHN FRANCIS ,  ZEBLISKY RUDOLF JOHN ,  WILLIAMSON JOHN DUFF ,  POLICHETTE JOSEPH NICHOLAS

IPC: C23C18/16 ,  C23C18/20 ,  H01B1/00 ,  H05K1/03 ,  H05K3/28 ,  H05K3/42