公开(公告)号：EP3770111A1

公开(公告)日：2021-01-27

申请号：EP19212914.6

申请日：2019-12-02

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： DOSEV, Dosi ,  POTASEK, David P. ,  CHILDRESS, Marcus Allen

IPC: B81B3/00

Abstract: A MEMS device includes a first layer (36), a second layer (38) connected to the first layer, a first mooring portion (40), a second mooring portion (42), and a MEMS device body (44). The MEMS device body is connected to the first mooring portion and the second mooring portion. The MEMS device body further includes a first cantilever (78) attached to the first mooring portion, a second cantilever (82) attached to the second mooring portion, and a spring (80). The spring is in operable communication with the first cantilever and the second cantilever.

公开(公告)号：EP3392194A3

公开(公告)日：2019-01-09

申请号：EP18167588.5

申请日：2018-04-16

Applicant: Rosemount Aerospace Inc.

Inventor： GOLDEN, Jim ,  POTASEK, David P. ,  CHILDRESS, Marcus Allen

IPC: B81C99/00

Abstract: A method of testing sensors (40) includes providing a test sheet (60) that includes a plurality of sensor assemblies (18), a plurality of test pads (64), and traces (66) extending from the sensor assemblies (18) to the plurality of test pads (64). A sensor (40) is positioned on each sensor assembly (18). Each sensor (40) is connected to the sensor assembly (18) with wire bonds (44A, 44B). An enclosure (60) is formed over the plurality of sensor assemblies (18). An electrical signal is detected from each of the plurality of sensor assemblies (18) at the test pads (64).

公开(公告)号：EP3392194A2

公开(公告)日：2018-10-24

申请号：EP18167588.5

申请日：2018-04-16

Applicant: Rosemount Aerospace Inc.

Inventor： GOLDEN, Jim ,  POTASEK, David P. ,  CHILDRESS, Marcus Allen

IPC: B81C99/00

CPC classification number: G01R1/0416 ,  B81B2201/0264 ,  B81C99/004

Abstract: A method of testing sensors (40) includes providing a test sheet (60) that includes a plurality of sensor assemblies (18), a plurality of test pads (64), and traces (66) extending from the sensor assemblies (18) to the plurality of test pads (64). A sensor (40) is positioned on each sensor assembly (18). Each sensor (40) is connected to the sensor assembly (18) with wire bonds (44A, 44B). An enclosure (60) is formed over the plurality of sensor assemblies (18). An electrical signal is detected from each of the plurality of sensor assemblies (18) at the test pads (64).