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公开(公告)号：EP4067854A3
公开(公告)日：2023-01-04
申请号：EP22165418.9
申请日：2022-03-30
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： POTASEK, David P. , JONSSON, Ulf J.
Abstract: A pressure sensor includes a housing (20), an isolator (26) positioned at a first end (22) of the housing, and a first cavity (28) formed between the first end of the housing and the isolator. The pressure sensor further includes a second cavity (42) formed in the housing and a channel (48) with a first end (50) fluidly connected to the first cavity and a second end (52) fluidly coupled to the second cavity. A pressure sensor chip (62) is positioned in the second cavity and includes a first diaphragm (68) positioned at a top side of the pressure sensor chip laterally outwards from the second end of the channel.
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公开(公告)号：EP4067854A2
公开(公告)日：2022-10-05
申请号：EP22165418.9
申请日：2022-03-30
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： POTASEK, David P. , JONSSON, Ulf J.
Abstract: A pressure sensor includes a housing (20), an isolator (26) positioned at a first end (22) of the housing, and a first cavity (28) formed between the first end of the housing and the isolator. The pressure sensor further includes a second cavity (42) formed in the housing and a channel (48) with a first end (50) fluidly connected to the first cavity and a second end (52) fluidly coupled to the second cavity. A pressure sensor chip (62) is positioned in the second cavity and includes a first diaphragm (68) positioned at a top side of the pressure sensor chip laterally outwards from the second end of the channel.
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公开(公告)号：EP3315935A2
公开(公告)日：2018-05-02
申请号：EP17198026.1
申请日：2017-10-24
Applicant: Rosemount Aerospace Inc.
Inventor： POTASEK, David P.
CPC classification number: B81C3/001 , B81B3/0021 , B81B2201/0264 , B81B2207/012 , B81B2207/07 , B81C2201/013 , B81C2201/019 , B81C2203/0172 , G01L9/0042 , G01L19/148
Abstract: A MEMS device with electronics integration places integrated circuit components on a topping wafer (120A) of a sensing die to conserve space, minimize errors and reduce cost of the device as a whole. The topping wafer is bonded to a sensing wafer (118) and secured in a housing (138).
Abstract translation: 具有电子集成的MEMS器件将集成电路组件放置在感测芯片的顶部晶片（120A）上以节省空间，最小化错误并降低器件整体的成本。 顶部晶片结合到感测晶片（118）并固定在壳体（138）中。
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4.发明公开
公开(公告)号：EP3196617A1
公开(公告)日：2017-07-26
申请号：EP17150950.8
申请日：2017-01-11
Applicant: Rosemount Aerospace Inc.
Inventor： ZHANG, Weibin , POTASEK, David P.
CPC classification number: B81B3/0021 , B81B2203/0127 , B81C1/00158 , B81C2201/0132 , B81C2201/0133 , G01L9/0048 , G01L19/0618
Abstract: A method for producing a silicon based MEMS pressure sensor includes forming a cavity in a first (100) surface of a silicon wafer with first and second parallel (100) surfaces wherein the angle between the walls of the first cavity and the first (100) surface where they intersect the first (100) surface are greater than 90 degrees and the remaining material between the bottom of the cavity and the second parallel (100) surface comprises a flexible diaphragm. The method also includes forming a backing wafer, having a through hole, and bonding the silicon wafer to the backing wafer such that the hole in the backing wafer matches up with the cavity in the second side of the (100) silicon wafer. A dielectric layer is formed on the second side of the (100) silicon wafer and a sensing element is formed on the dielectric layer to detect pressure induced deflection of the silicon diaphragm.
Abstract translation: 一种用于制造硅基MEMS压力传感器的方法包括：在具有第一和第二平行（100）表面的硅晶片的第一（100）表面中形成空腔，其中第一空腔的壁和第一（100） 它们与第一（100）表面相交的表面大于90度，并且腔体的底部和第二平行（100）表面之间的剩余材料包括柔性隔膜。 该方法还包括形成具有通孔的背衬晶片，并且将硅晶片结合到背衬晶片，使得背衬晶片中的孔与（100）硅晶片的第二侧中的空腔匹配。 在（100）硅晶片的第二侧上形成介电层，并且在介电层上形成感测元件以检测硅膜的压力引起的偏转。
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公开(公告)号：EP4063816A1
公开(公告)日：2022-09-28
申请号：EP22163304.3
申请日：2022-03-21
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： POTASEK, David P. , PHILLIPS, Richard William
Abstract: A temperature sensor assembly for measuring a gas temperature in a gas flow stream includes a first substrate having a first surface configured to be connected to a thermally conductive structure in a gas path, a first temperature sensor mounted to the first substrate a first distance from the first surface, and a second temperature sensor mounted to the first substrate a second distance from the first surface. The second distance is less than the first distance. The first and second temperature sensors are arranged along a temperature gradient.
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Patent Agency Ranking
公开(公告)号：EP3800661A1
公开(公告)日：2021-04-07
申请号：EP19215405.2
申请日：2019-12-11
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： BACKMAN, Roger Alan , POTASEK, David P.
IPC: H01L23/525 , H01L23/31 , H01L27/01 , H01L23/055 , H01L23/10 , B81B7/00 , B81C1/00
Abstract: A micro-fuse assembly includes a substrate (42), a number of thin-film micro-fuses on the substrate (42), and a topping wafer (70) configured to sealingly engage to at least one of the substrate or the thin-film micro-fuses to define a cavity therebetween. The cavity is configured to encapsulate the thin-film micro-fuses within an inert environment sealed within the cavity. A method of encapsulating a micro-fuse assembly within an inert environment using a topping wafer is also disclosed.
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公开(公告)号：EP3364165A2
公开(公告)日：2018-08-22
申请号：EP18152565.0
申请日：2018-01-19
Applicant: Rosemount Aerospace Inc.
Inventor： GOLLY, Timothy Thomas , POTASEK, David P. , HUYNH, Cuong Tho
Abstract: A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.
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8.发明公开
公开(公告)号：EP2990376A1
公开(公告)日：2016-03-02
申请号：EP15180898.7
申请日：2015-08-13
Applicant: Rosemount Aerospace Inc.
Inventor： POTASEK, David P.
IPC: B81B7/00
CPC classification number: B81C1/00873 , B81B7/0048 , B81B7/0061 , B81C1/00492
Abstract: A MEMS sensor includes a sensor die (101) configured to generate a sensor signal and a pedestal layer (103) disposed on the sensor die (101). The pedestal layer (103) includes a channel (107) defined therein about a pedestal (105) of the pedestal layer (103). The pedestal (105) is configured to be mounted to a housing. A method for manufacturing MEMS sensors can include disposing a pedestal layer (103) on a sensor layer, wherein the sensor layer defines a plurality of sensor dies (101) to be cut therefrom. The method further includes defining a respective channel (107) in the pedestal layer (103) for each sensor die (101), thereby creating a pedestal (105) for each sensor die (101).
Abstract translation: MEMS传感器包括被配置为产生传感器信号的传感器管芯（101）和设置在传感器管芯（101）上的基座层（103）。 基座层（103）包括围绕基座层（103）的基座（105）限定的通道（107）。 基座（105）构造成安装到壳体。 用于制造MEMS传感器的方法可以包括在传感器层上设置基座层（103），其中传感器层限定要从其切割的多个传感器模具（101）。 该方法还包括为每个传感器模具（101）定义基座层（103）中的相应通道（107），从而为每个传感器模具（101）创建基座（105）。
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公开(公告)号：EP3772641A1
公开(公告)日：2021-02-10
申请号：EP19215614.9
申请日：2019-12-12
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： POTASEK, David P. , BACKMAN, Roger Alan
Abstract: A micromechanical pressure sensor for measuring a pressure differential includes a diaphragm having an inner region and two edge regions, one opposite the other with respect to the inner region. Two or more piezoresistive resistance devices are on the diaphragm, at least one in each of the inner and edge region, and are configured to be electrically connected in a bridge circuit. The micromechanical pressure sensor is configured so that an operating temperature of the one or more piezoresistive resistance devices in the inner region is substantially the same as an operating temperature of the one or more piezoresistive resistance devices in at least one of the edge regions throughout a full operating range such that an error of the micromechanical pressure sensor output resulting from self-heating is less than if the micromechanical pressure sensor were not configured to maintain the operating temperatures substantially the same.
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公开(公告)号：EP3392194A3
公开(公告)日：2019-01-09
申请号：EP18167588.5
申请日：2018-04-16
Applicant: Rosemount Aerospace Inc.
Inventor： GOLDEN, Jim , POTASEK, David P. , CHILDRESS, Marcus Allen
IPC: B81C99/00
Abstract: A method of testing sensors (40) includes providing a test sheet (60) that includes a plurality of sensor assemblies (18), a plurality of test pads (64), and traces (66) extending from the sensor assemblies (18) to the plurality of test pads (64). A sensor (40) is positioned on each sensor assembly (18). Each sensor (40) is connected to the sensor assembly (18) with wire bonds (44A, 44B). An enclosure (60) is formed over the plurality of sensor assemblies (18). An electrical signal is detected from each of the plurality of sensor assemblies (18) at the test pads (64).
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