Abstract:
A galvanic-isolated coupling of circuit portions is accomplished on the basis of a stacked chip configuration. The semiconductor chips (200A,200B) thus can be fabricated on the basis of any appropriate process technology, thereby incorporating one or more coupling elements (220A,220B), such as primary or secondary coils of a micro transformer, wherein the final characteristics of the micro transformer are adjusted during the wafer bond process.
Abstract:
The wireless galvanic isolator device is formed by a transmitter circuit (31), a receiver circuit (32), and a wireless coupling structure, arranged between the transmitter circuit and the receiver circuit (32). The wireless coupling structure is formed by a pair of antennas (33a, 33b) each arranged on an own die (25, 26) and integrated together with the respective transmitter and receiver circuit (31, 32). The two dice can be arranged adjacent to each other in a planar configuration or arranged on top of each other and bonded together.