公开(公告)号：EP4108462A1

公开(公告)日：2022-12-28

申请号：EP22179954.7

申请日：2022-06-20

Applicant: STMicroelectronics S.r.l.

Inventor： GIUSTI, Domenico ,  GULLI', Gianluca ,  FERRARIO, Francesco ,  MAERNA, Davide ,  TENTORI, Lorenzo

IPC: B41J2/14 ,  B41J2/16 ,  B05B1/24 ,  B05B1/14

Abstract: A microfluidic device (1) has a chamber (17); a fluidic access channel (20) in fluidic connection with the chamber; a plurality of nozzle apertures (34) in fluidic connection with the chamber; and an actuator (18), operatively coupled to the fluid containment chamber and configured to cause ejection of drops of fluid through the nozzle apertures in an operating condition of the microfluidic device. The chamber (17) has an elongated shape, with a length and a maximum width, wherein an aspect ratio between the length and the maximum width of the chamber is at least 3:1. The nozzle apertures (34) are configured to generate, in use, a plurality of drops having a total drop volume, wherein a ratio total drop volume to a chamber volume is at least 15%.

公开(公告)号：EP3725531A1

公开(公告)日：2020-10-21

申请号：EP20169708.3

申请日：2020-04-15

Applicant: STMicroelectronics S.r.l.

Inventor： GIUSTI, Domenico ,  PRELINI, Carlo Luigi ,  TENTORI, Lorenzo

IPC: B41J2/14 ,  B41J2/16

Abstract: An ejection device (1) for a fluid (6), comprising: a first semiconductor wafer (2), housing, on a first side thereof, a piezoelectric actuator (3) and an outlet channel (33) for the fluid (6) alongside the piezoelectric actuator (3); a second semiconductor wafer (4) having, on a first side thereof, a recess (10) and, on a second side thereof opposite to the first side, at least one inlet channel (9) for said fluid (6) fluidically coupled to the recess (10); and a dry-film (8) coupled to a second side, opposite to the first side, of the first wafer. The first and the second wafers are coupled together so that the piezoelectric actuator and the outlet channel are set directly facing, and completely contained in, the recess (10) that forms a reservoir for the fluid (6). The dry-film has an ejection nozzle (13).

公开(公告)号：EP4183490A1

公开(公告)日：2023-05-24

申请号：EP22206037.8

申请日：2022-11-08

Applicant: STMicroelectronics S.r.l.

Inventor： GIUSTI, Domenico ,  FERRERA, Marco ,  TENTORI, Lorenzo

IPC: B06B1/06

Abstract: MEMS ultrasonic transducer, MUT, device (1), comprising a semiconductor body (3) with a first (3A) and a second (3B) main surface and including: a first chamber (15) extending into the semiconductor body (3) at a distance from the first main surface (3A); a membrane (18) formed by the semiconductor body (3) between the first main surface (3A) and the first chamber (15); a piezoelectric element (19) on the membrane (18); a second chamber (20) extending into the semiconductor body (3) between the first chamber (15) and the second main surface (3B); a central fluidic passage (22) extending into the semiconductor body (3) from the second main surface (3B) to the first chamber (15) and traversing the second chamber (20); and one or more lateral fluidic passages (21) extending into the semiconductor body (3) from the second main surface (3B) to the second chamber (20). The one or more lateral fluidic passages (21), the central fluidic passage (22) and the second chamber (20) define a fluidic recirculation path that fluidically connects the first chamber (15) with the outside of the semiconductor body (3).

公开(公告)号：EP4109509A3

公开(公告)日：2023-04-19

申请号：EP22179407.6

申请日：2022-06-16

Applicant: STMicroelectronics S.r.l.

Inventor： AZPEITIA URQUIA, Mikel ,  TENTORI, Lorenzo

IPC: H01L21/78 ,  B81C1/00

Abstract: The semiconductor device comprises a die including a sidewall (150; 228; 238, 240, 242, 244; 258) having a uniform surface (186; 230; 238, 240; 260, 262) and an irregular surface (188: 232; 242, 244; 264),. The irregular surface has a more irregular texture as compared to the uniform surface. The die is obtained by pre-forming a cavity in a substrate and forming a multilayer structure on the substrate. The multilayer structure includes an active area that is aligned with and overlies the cavity. At least one recess is formed extending into the multilayer structure to the cavity. Forming the recess forms a die structure suspended above the cavity and an extension extending from the die structure to a suspension structure surrounding the die structure. The die structure is released from the die suspension structure by breaking the extension.

公开(公告)号：EP4273091A1

公开(公告)日：2023-11-08

申请号：EP23167983.8

申请日：2023-04-14

Applicant: STMicroelectronics S.r.l.

Inventor： AZPEITIA URQUIA, Mikel ,  DUQI, Enri ,  NICOLI, Silvia ,  CAMPEDELLI, Roberto ,  VARISCO, Igor ,  TENTORI, Lorenzo

IPC: B81B3/00 ,  B81C1/00

Abstract: MEMS structure (1), comprising: a semiconductor body (30); a cavity (20) buried in the semiconductor body (30); a membrane (10) suspended on the cavity (20); and at least one antistiction bump (11) completely contained in the cavity (20) with the function of preventing the side of the membrane internal to the cavity from sticking to the opposite side, which delimits the cavity downwardly.

公开(公告)号：EP4109509A2

公开(公告)日：2022-12-28

申请号：EP22179407.6

申请日：2022-06-16

Applicant: STMicroelectronics S.r.l.

Inventor： AZPEITIA URQUIA, Mikel ,  TENTORI, Lorenzo

IPC: H01L21/78 ,  B81C1/00

Abstract: The semiconductor device comprises a die including a sidewall (150; 228; 238, 240, 242, 244; 258) having a uniform surface (186; 230; 238, 240; 260, 262) and an irregular surface (188: 232; 242, 244; 264),. The irregular surface has a more irregular texture as compared to the uniform surface. The die is obtained by pre-forming a cavity in a substrate and forming a multilayer structure on the substrate. The multilayer structure includes an active area that is aligned with and overlies the cavity. At least one recess is formed extending into the multilayer structure to the cavity. Forming the recess forms a die structure suspended above the cavity and an extension extending from the die structure to a suspension structure surrounding the die structure. The die structure is released from the die suspension structure by breaking the extension.

公开(公告)号：EP3533569A1

公开(公告)日：2019-09-04

申请号：EP19154620.9

申请日：2019-01-30

Applicant: STMicroelectronics S.r.l.

Inventor： GIUSTI, Domenico ,  TENTORI, Lorenzo

IPC: B25J15/08 ,  B25J7/00

Abstract: The MEMS manipulation device (1) has a first and a second manipulation arms (40, 41) carrying respective mutually facing gripping elements (6, 7). The first manipulation arm (40) is formed by a driving arm (2) and by an articulated arm (4) hinged together through an articulation structure (10). The first driving arm (2) comprises a first beam element (20) and a first piezoelectric region (29), on the first beam element. The first articulation structure (10) comprises a first constraint element (31) not deformable in the thickness direction, and a first hinge structure (32), interposed between the first driving arm (2), the first articulated arm (4), and the first constraint element (31).