公开(公告)号：EP4324785A1

公开(公告)日：2024-02-21

申请号：EP23183560.4

申请日：2023-07-05

Applicant: STMicroelectronics S.r.l.

Inventor： ALLEGATO, Giorgio ,  NICOLI, Silvia ,  ALESSANDRI, Anna ,  GARAVAGLIA, Matteo

IPC: B81B7/00 ,  H01L23/552

Abstract: Electronic device including: a MEMS sensor device (20; 120) including a functional structure (45;144,145) which transduces a chemical or physical quantity into a corresponding electrical quantity; a cap (21) including a semiconductive substrate (2); and a bonding dielectric region (19), which mechanically couples the cap (21) to the MEMS sensor device (20;120). The cap (21) further includes a conductive region (10;110), which extends between the semiconductive substrate (2) and the MEMS sensor device (20;120) and includes: a first portion (12;112), which is arranged laterally with respect to the semiconductive substrate (2) and is exposed, so as to be electrically coupleable to a terminal at a reference potential (69,77) by a corresponding wire bonding (58); and a second portion (13;113), which contacts the semiconductive substrate (2).

公开(公告)号：EP4273091A1

公开(公告)日：2023-11-08

申请号：EP23167983.8

申请日：2023-04-14

Applicant: STMicroelectronics S.r.l.

Inventor： AZPEITIA URQUIA, Mikel ,  DUQI, Enri ,  NICOLI, Silvia ,  CAMPEDELLI, Roberto ,  VARISCO, Igor ,  TENTORI, Lorenzo

IPC: B81B3/00 ,  B81C1/00

Abstract: MEMS structure (1), comprising: a semiconductor body (30); a cavity (20) buried in the semiconductor body (30); a membrane (10) suspended on the cavity (20); and at least one antistiction bump (11) completely contained in the cavity (20) with the function of preventing the side of the membrane internal to the cavity from sticking to the opposite side, which delimits the cavity downwardly.

公开(公告)号：EP4144687A1

公开(公告)日：2023-03-08

申请号：EP22190201.8

申请日：2022-08-12

Applicant: STMicroelectronics S.r.l.

Inventor： FERRARI, Paolo ,  CORSO, Lorenzo ,  VILLA, Flavio Francesco ,  NICOLI, Silvia ,  LAMAGNA, Luca

IPC: B81B7/02 ,  B81C1/00

Abstract: Method for manufacturing a micro-electro-mechanical system, MEMS, (50) integrating a first MEMS device (51) and a second MEMS device (52). The first MEMS device is a capacitive pressure sensor and the second MEMS device is an inertial sensor. The steps of manufacturing the first and second MEMS devices are, at least partly, shared with each other, resulting in a high degree of integration on a single die, and allowing to implement a manufacturing process with high yield and controlled costs.

公开(公告)号：EP4140942A1

公开(公告)日：2023-03-01

申请号：EP22190178.8

申请日：2022-08-12

Applicant: STMicroelectronics S.r.l.

Inventor： FERRARI, Paolo ,  VILLA, Flavio Francesco ,  CAMPEDELLI, Roberto ,  LAMAGNA, Luca ,  DUQI, Enri ,  AZPEITIA URQUIA, Mikel ,  NICOLI, Silvia ,  TURI, Maria Carolina

IPC: B81C1/00

Abstract: Method for manufacturing a micro-electro-mechanical device (30; 30'), comprising the steps of: forming, on a substrate (2), a first protection layer (5) of crystallized aluminum oxide, impermeable to HF; forming, on the first protection layer (5), a sacrificial layer (8, 8') of silicon oxide removable with HF; forming, on the sacrificial layer (8, 8'), a second protection layer (15) of crystallized aluminum oxide; exposing a sacrificial portion (8') of the sacrificial layer (8, 8'); forming, on the sacrificial portion (8'), a first membrane layer (20) of a porous material, permeable to HF; forming a cavity (22) by removing the sacrificial portion (8') through the first membrane layer (20); and sealing pores of the first membrane layer (20) by forming a second membrane layer (24) on the first membrane layer (20).