MEMS DEVICE HAVING AN IMPROVED STRESS DISTRIBUTION AND MANUFACTURING PROCESS THEREOF

    公开(公告)号:EP3984944A1

    公开(公告)日:2022-04-20

    申请号:EP21202712.2

    申请日:2021-10-14

    Abstract: The MEMS device (1) is formed by a body (5) of semiconductor material, which defines a support structure (10); by a pass-through cavity (15) in the body, which is surrounded by the support structure; by a movable structure (20) suspended in the pass-through cavity; by an elastic structure (25), which extends in the pass-through cavity between the support structure (10) and the movable structure (20). The elastic structure has a first portion (25A) and a second portion (25B) and is subject, in use, to mechanical stress. The MEMS device is further formed by a metal region (45), which extends on the first portion (25A) of the elastic structure (25), and by a buried cavity (30) in the elastic structure, wherein the buried cavity extends between the first and the second portions of the elastic structure.

    PIEZOELECTRIC TRANSDUCER AND METHOD OF MANUFACTURING THEREOF

    公开(公告)号:EP3742506A1

    公开(公告)日:2020-11-25

    申请号:EP20176147.5

    申请日:2020-05-22

    Abstract: A method for manufacturing a piezoelectric transducer (100) is disclosed, which comprises forming a bottom electrode (34, 40) on a semiconductor body (32), forming a piezoelectric element (36) on the bottom electrode, forming a protective layer (42) having a first opening (44) through which a portion of the piezoelectric element is exposed and a second opening (45) through which a portion of the bottom electrode is exposed, forming a conductive layer on the protective layer and within the first and second openings, and patterning the conductive layer to contextually form a top electrode (48) in electrical contact with the piezoelectric element at the first opening, a first biasing stripe (51) in electrical contact with the top electrode, and a second biasing stripe (52) in electrical contact with the bottom electrode at the second opening. A passivation layer (56) and metal contacts (61, 62) may be formed thereafter.

Patent Agency Ranking