-
公开(公告)号：WO2007135955A9
公开(公告)日：2008-02-14
申请号：PCT/JP2007060148
申请日：2007-05-17
Applicant: SUMITOMO ELECTRIC INDUSTRIES , UNIV KYOTO , MISHIMA HIDEHIKO , OKUDA YASUHIRO , SAKABE SHUJI , HASHIDA MASAKI , SHIMIZU SEIJI
Inventor： MISHIMA HIDEHIKO , OKUDA YASUHIRO , SAKABE SHUJI , HASHIDA MASAKI , SHIMIZU SEIJI
IPC: B23K26/38 , B23K26/18 , B23K101/42 , H05K3/00
CPC classification number: H05K3/0032 , B23K26/009 , B23K26/18 , B23K26/382 , B23K26/40 , B23K2203/14 , B23K2203/42 , B23K2203/50 , H05K2203/1383 , Y10T428/24273
Abstract: A processing method for forming a through-hole in a workpiece (1) by using a pulse laser beam. The method has a step of forming a detachable sacrificial layer (la) on the workpiece (1), a step of forming the through-hole (5) in the workpiece by a laser beam with the sacrificial layer (la) formed on the workpiece, and a step of removing the sacrificial layer (5) from the workpiece after the through-hole forming step.
Abstract translation: 一种用于通过使用脉冲激光束在工件（1）上形成通孔的处理方法。 该方法具有在工件（1）上形成可拆卸的牺牲层（1a）的步骤，通过激光束在工件上形成通孔（5）的步骤，其中牺牲层（1a）形成在工件 以及在通孔形成步骤之后从工件去除牺牲层（5）的步骤。
-
公开(公告)号：CA2578033A1
公开(公告)日：2006-03-02
申请号：CA2578033
申请日：2005-07-11
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HAYASHI FUMIHIRO , IDOMOTO YUICHI , FUJITA TARO , MASUDA YASUHITO , UENOYAMA MAYO , OKUDA YASUHIRO
Abstract: A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
-
公开(公告)号：CA2559772A1
公开(公告)日：2005-09-09
申请号：CA2559772
申请日：2004-02-27
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HAYASHI FUMIHIRO , NAKATA MOTOMI , OKUDA YASUHIRO
Abstract: A composite structure comprising two porous PTFE layers and, interposed therebetween, a framing structural member having multiple gaps or open space s, the porous PTFE layers bonded and integrated together through the gaps or op en spaces of the framing structural member, the porous PTFE layers integrated with the framing structural member in such a fashion that the porous PTFE layers adhere to the surface of structural elements composing the framing structural member along the surface and so as to enclose the structural elements. There is further provided a process for producing the same, characterized in that the process includes the step of applying compressive force through the intermediary of powder.
-
公开(公告)号：CA2527241A1
公开(公告)日：2004-12-16
申请号：CA2527241
申请日：2004-06-04
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： IDOMOTO YUICHI , MASUDA YASUHITO , OKUDA YASUHIRO , FUJITA TARO , UENOYAMA MAYO , HAYASHI FUMIHIRO , HAGA TSUYOSHI
Abstract: A method of manufacturing a drilled porous resin base material with conducti ve drilled inner wall surfaces, comprising a step 1 for penetrating liquid or solution into the porous structure of the porous resin base material, a step 2 for forming solid matter from the penetrated liquid or solution, a step 3 fo r forming a plurality of drilled holes passed from the first surface to the second surface of the porous resin base material having the solid matter in the porous structure, and a step 4 for melting or dissolving the solid matte r and removing it from the porous structure. The method also comprises the ste p for selectively adhering catalysts to only the inner wall surfaces of the drilled holes and adhering a conductive metal to the inner wall surfaces.
-
公开(公告)号：CA2522239C
公开(公告)日：2011-01-04
申请号：CA2522239
申请日：2004-03-12
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： MASUDA YASUHITO , OKUDA YASUHIRO , HAYASHI FUMIHIRO , HAGA TSUYOSHI
IPC: H01R11/01 , G01R1/04 , G01R31/28 , H01L21/48 , H01L23/482 , H01L23/498 , H01R43/00 , H05K3/40
Abstract: The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.
-
Patent Agency Ranking
公开(公告)号：HK1115943A1
公开(公告)日：2008-12-12
申请号：HK08111750
申请日：2008-10-24
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： IDOMOTO YUICHI , OKUDA YASUHIRO
IPC: H01R20060101 , H05K20060101
Abstract: In a composite porous resin base material (1), a porous resin film (2) is provided with a functional section (3) whereupon an electrode (4) and/or a circuit is formed. On the periphery surrounding the functional section (3), a step (5) having a height different from that of the functional section (3) is formed, and a frame plate (6) is arranged on a plane of the step (5). Provided is the composite porous resin base material which has a structure wherein the frame plate having rigidity is attached to the porous resin base material whereupon the electrode and/or a circuit is formed without deteriorating characteristics such as elasticity and conductivity of the porous resin base material.
-
公开(公告)号：CA2652480A1
公开(公告)日：2007-11-29
申请号：CA2652480
申请日：2007-05-17
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HASHIDA MASAKI , OKUDA YASUHIRO , MISHIMA HIDEHIKO , SAKABE SHUJI , SHIMIZU SEIJI
IPC: H05K3/00 , B23K26/18 , B23K26/382
Abstract: A processing method for forming a through-hole in a workpiece (1) by usin g a pulse laser beam. The method has a step of forming a detachable sacrific ial layer (la) on the workpiece (1), a step of forming the through-hole (5) in the workpiece by a laser beam with the sacrificial layer (la) formed on t he workpiece, and a step of removing the sacrificial layer (5) from the work piece after the through-hole forming step.
-
公开(公告)号：CA2552554A1
公开(公告)日：2005-10-20
申请号：CA2552554
申请日：2005-04-07
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： OKUDA YASUHIRO , HAYASHI FUMIHIRO
IPC: A61F2/28 , C08J9/00 , A47C27/12 , A61L27/00 , B29C55/00 , B29C55/12 , B32B5/32 , B32B27/32 , C08L27/18 , C09K3/10 , H01B5/16 , H01R11/01
Abstract: A porous stretched polytetrafluoroethylene film which has a residual strain of 11.0% or lower as measured after a load necessary for pushing the front end of a rod into the porous film in the thickness direction at a strain rate of 10 0 %/min to a depth which is 20% of the film thickness is repeatedly imposed 20 times, the rod being a cylindrical rod which has an outer diameter of 2 mm o r larger and at least 1.9 times the film thickness, has a smooth and flat fron t- end surface perpendicular to the axis, and has a modulus in tension of 1.0.times.104 kgf/mm2 or higher. Also provided is a process for producing th e porous film, which includes the step of compressing a porous stretched polytetrafluoroethylene film having a high stretch ratio.
-
公开(公告)号：CA2551397A1
公开(公告)日：2005-07-28
申请号：CA2551397
申请日：2005-01-13
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： HAYASHI FUMIHIRO , OKUDA YASUHIRO , MASUDA YASUHITO
Abstract: A production method for a porous molding in which complicated and fine penetrated portions and recesses are pattern-worked. A pattern-worked porous molding or non-woven fabric in which a plated layer is selectively formed on the surfaces of penetrated portions and recesses. A mask having pattern-form penetrated portions is disposed on at least one surface of a porous molding or non-woven fabric, and fluid or fluid containing abrasive grains is sprayed over the mask to form penetrated portions or recesses or the both of them, t o which the opening shape of the mask~s penetrated portion is transferred, on the porous molding or non-woven fabric. A porous molding or non-woven fabric and an electric circuit components or the like in which a plated layer is selectively formed on the surfaces of penetrated portions or recesses or the both of them.
-
10.发明专利
公开(公告)号：CA2598056A1
公开(公告)日：2006-09-08
申请号：CA2598056
申请日：2006-02-23
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor： SHIMIZU SEIJI , SAKABE SHUJI , WATATANI KENICHI , HASHIDA MASAKI , OKUDA YASUHIRO , MASUDA YASUHITO , MISHIMA HIDEHIKO
IPC: B23K26/40
Abstract: In order to easily control the laser pulse width and perform high-precision processing, the method for processing a material by laser ablation according to the present invention is characterized in that the material having a region of which a double logarithmic chart shows a linearly-shaped line with a gradient of not more than 0.5, when a relationship between laser pulse width and ablation threshold is represented in the logarithmic chart with a laser pulse width in picosecond plotted along the horizontal axis and an ablation threshold in J/cm 2 plotted along the vertical axis, is processed by the pulsed laser beam having the laser pulse width within the region.
-
-
-
-
-
-
-
-
-
Search Results
70
records
(took 0.024 seconds)
