公开(公告)号：FR2629666A1

公开(公告)日：1989-10-06

申请号：FR8900715

申请日：1989-01-20

Applicant: TOSHIBA KK

Inventor： YAMADA HIROSHI ,  OHUCHI MASAYUKI ,  SAITO MASAYUKI ,  HONGU AKINORI

IPC: B42D15/10 ,  G06K19/077 ,  H01L23/538 ,  H05K1/02 ,  H05K1/18

Abstract: An IC card is disclosed which comprises a card-shaped main substrate having a surface on which recess portions are formed and an edge portion having a connector layer with an external connector terminal pattern formed thereon, circuit modules embedded in the recess portions in main substrate, each module having electronic components including IC chips, a chip capacitor and a thin D.C. battery unit, and a double-layered wiring structure for providing electric connection between the electronic components and the connector terminal pattern. The double-layered wiring structure comprises a first wiring layer formed on the main substrate to cover the circuit modules and a second wiring layer formed insulatively above the former wiring layer. The first wiring layer has a first wiring pattern that extends in a first direction of the main substrate to be coupled to the electronic components. The second wiring layer has a second wiring pattern that extends in a second direction of the main substrate to be coupled to the first wiring pattern and the connector terminal pattern.

公开(公告)号：DE3663433D1

公开(公告)日：1989-06-22

申请号：DE3663433

申请日：1986-03-11

Applicant: TOSHIBA KK

Inventor： SAITO MASAYUKI ,  OODAIRA HIROSI

IPC: H01C17/065 ,  H01C17/242 ,  H05K1/03 ,  H05K1/05 ,  H05K1/09 ,  H05K1/16 ,  H01C17/24

Abstract: There is disclosed a wiring substrate comprising a wiring circuit pattern (4) formed on a metal substrate (1) with an insulating resinous layer (2) interposed therebetween. In this wiring substrate (1), the insulating resinous layer (2) is formed of a high molecular composition comprising thermosetting 1,2- polybutadiene containing 5 to 30% by weight of a high molecular softening agent such as hydrogenated polybutadiene. A method of manufacturing such a wiring substrate is also disclosed, wherein a light-reflecting pigment is included in the insulating resinous layer (2) for the convenience of the subsequent laser trimming.

公开(公告)号：JP2955322B2

公开(公告)日：1999-10-04

申请号：JP7723690

申请日：1990-03-27

Applicant: TOSHIBA KK

Inventor： MORI MIKI ,  SAITO MASAYUKI

IPC: G02F1/1345 ,  C12N15/09 ,  G02F1/133 ,  H05K1/14

公开(公告)号：JP2966918B2

公开(公告)日：1999-10-25

申请号：JP32011690

申请日：1990-11-22

Applicant: TOSHIBA KK

Inventor： YAMADA HIROSHI ,  MOTOMYA AKINORI ,  SAITO MASAYUKI

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/822 ,  H01L23/522 ,  H01L27/04

公开(公告)号：JP2918668B2

公开(公告)日：1999-07-12

申请号：JP25844090

申请日：1990-09-27

Applicant: TOSHIBA KK

Inventor： YAMADA HIROSHI ,  SAITO MASAYUKI

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60

公开(公告)号：JP2786734B2

公开(公告)日：1998-08-13

申请号：JP25905690

申请日：1990-09-28

Applicant: TOSHIBA KK

Inventor： MORI MIKI ,  SAITO MASAYUKI ,  KAO MIN TAI ,  SAKAMOTO TSUGIO ,  AZUMA MICHA

IPC: H01L21/60

公开(公告)号：JP2755696B2

公开(公告)日：1998-05-20

申请号：JP16319689

申请日：1989-06-26

Applicant: TOSHIBA KK

Inventor： SAITO MASAYUKI ,  MORI MIKI

IPC: H01L21/52 ,  H01L21/60

公开(公告)号：JP2892117B2

公开(公告)日：1999-05-17

申请号：JP20454190

申请日：1990-08-01

Applicant: TOSHIBA KK

Inventor： MORI MIKI ,  SAITO MASAYUKI ,  KAO MIN TAI ,  SAKAMOTO TSUGIO ,  AZUMA MICHA

IPC: H01L21/56

公开(公告)号：JP2892055B2

公开(公告)日：1999-05-17

申请号：JP29437189

申请日：1989-11-13

Applicant: TOSHIBA KK

Inventor： YAMADA HIROSHI ,  SAITO MASAYUKI ,  YAMAMOTO YOSHE ,  SUDO TOSHIO

IPC: H01L21/60 ,  H01L21/321 ,  H01L23/12 ,  H01L23/29 ,  H01L23/31

公开(公告)号：JP2721223B2

公开(公告)日：1998-03-04

申请号：JP1778489

申请日：1989-01-30

Applicant: TOSHIBA KK

Inventor： YAMADA HIROSHI ,  SAITO MASAYUKI

IPC: H05K1/18 ,  H01L25/00 ,  H01L25/04 ,  H01L25/18 ,  H05K1/00