Abstract:
A driver circuit has an input stage (2) with an input node for receiving a control signal (DRIVE-IN). A capacitor circuit (4) is connected to the input node and a first power supply (VRAMP) and is arranged to be charged up by said first power supply (VRAMP) under the control of the control signal (DRIVE-IN). The driver circuit also has an output stage (6) connected to a second power supply (Vpp) and is arranged to provide a driver signal (POUT) in dependence on the charge stored at the capacitor circuit (4). A buffer circuit (8) is connected between the capacitor circuit (4) and the output stage (6).
Abstract:
Apparatus for setting up the tuning frequency of a phase locked loop is provided which utilises the voltage controlled oscillator of the phase locked loop itself. The apparatus includes signal translation circuitry which can provide a control voltage to the VCO of the phase locked loop dependent on a tuning voltage which is alterable in response to the frequency of the signal output by the VCO.
Abstract:
A semiconductor device comprising a silicon substrate (2,10), an oxide layer (4) on the silicon substrate, a doped polysilicon region (6) disposed on the oxide layer, a dielectric layer (14) which has been deposited over the doped polysilicon region (6) and the silicon substrate, a contact hole (16) which is formed in the dielectric layer (14) and extends over respective laterally adjacent portions of the doped polysilicon region (6) and the silicon substrate (2,10) and a contact (20) which has been selectively deposited in the contact hole which electrically connects the said portions together. The invention also provides a method of fabricating a semiconductor device incorporating a refractory metal contact, the method comprising the steps of:- a) providing a semiconductor substrate (2,10) having an oxide layer (4) thereon and a doped polysilicon region (6) disposed on the oxide layer; (b) depositing a dielectric layer (14) over the doped polysilicon region and over the silicon substrate; (c) forming a contact hole (16) in the dielectric layer which exposes a portion of the doped polysilicon region and a laterally adjacent portion of the silicon substrate; and (d) selectively depositing a contact (20) into the contact hole thereby electrically to connect together the doped polysilicon region and the silicon substrate.
Abstract:
A memory circuit comprises a plurality of memory cells (2) arranged in rows and columns, the cells in each row being connected to a common word line (4) and the cells in each column being connected between a pair of bit lines (6,8) across which a voltage differential is developed when a memory cell is accessed to be read; and a timing circuit (16) for producing a timing signal to control further circuitry in dependence on said voltage differential achieving a predetermined value. The memory circuit has a dummy bit line connected to a column of dummy cells, each dummy cell having the same structure as a memory cell. A plurality of said dummy cells (22) has a bit value stored therein and is connected to a dummy word line and the remainder of said dummy cells are rendered inactive, whereby on addressing of the dummy wordline simultaneously with the wordline of an accessed cell, a predetermined number of dummy cells discharges via the dummy bit line so that the voltage developed on the dummy bit line is a fixed multiple of the voltage differential developed between the bit lines of the accessed cell. The timing circuit (16) is connected to receive the voltage differential on the dummy bit line (18).
Abstract:
A method of fabricating a tungsten contact in a semiconductor device, which method comprises the steps of:- (a) providing an oxide layer (34) on a region of a silicon substrate; (b) depositing a sealing dielectric layer (44) over the oxide layer; (c) depositing an interlevel dielectric layer (46) over the sealing layer; (d) etching through the interlevel dielectric layer, the sealing dielectric layer and the oxide layer as far as the substrate thereby to form a contact hole and to expose the said region; (e) implanting a dopant into the said region whereby the implanted dopant is self-aligned to the contact hole; (f) thermally annealing the substrate; (g) selectively depositing tungsten in the contact hole; and (h) depositing an interconnect layer over the deposited tungsten contact. The invention also provides a semiconductor device.
Abstract:
A current sensing amplifier has two crosscoupled input p-channel transistors, two load transistors connected respectively to the input transistors and a switch element. Output voltages are developed across the load transistors. The amplifier senses differences in currents supplied to the input transistors and drives the output voltages in opposite directions in a sense dependent on the sense of the difference of the currents.
Abstract:
A computer device comprises a processor (2) for executing a plurality of concurrent processes each comprising a sequence of instructions, memory (4) including RAM, at least one message link (10) having input and output pins (12) for connection to a device separate from said computer device and for transmitting message packets sequentially between the computer device and said separate device, and communication control circuitry (6) coupled to said processor, to said memory, and to said message link. The memory provides a plurality of addressable virtual communication links. The communication control circuitry is operable:
(i) in response to execution of a message instruction by said processor to address a selected one of said virtual communication links and load into the selected one information regarding the message to be effected via the virtual communication link; and (ii) to control sequential transmission through said one message link of message packets relating to a plurality of virtual communication links.
A network of such computer devices and a method of operation is also described. The provision of virtual links enables several messages to be multiplexed down a single message link of the microcomputer.