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公开(公告)号:US12061421B2
公开(公告)日:2024-08-13
申请号:US17629053
申请日:2020-07-17
Applicant: ASML Netherlands B.V.
Inventor: Arie Jeffrey Den Boef , Kaustuve Bhattacharyya , Keng-Fu Chang , Simon Gijsbert Josephus Mathijssen
IPC: G03F7/00
CPC classification number: G03F7/70633
Abstract: Methods and systems for determining information about a target structure are disclosed. In one arrangement, a value of an asymmetry indicator for the target structure is obtained. The value of the asymmetry indicator represents an amount of an overlay independent asymmetry in the target structure. An error in an initial overlay measurement performed on the target structure at a previous time is estimated. The estimation is performed using the obtained value of the asymmetry indicator and a relationship between values of the asymmetry indicator and overlay measurement errors caused at least partially by overlay independent asymmetries. An overlay in the target structure is determined using the initial overlay measurement and the estimated error.
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公开(公告)号:US12013647B2
公开(公告)日:2024-06-18
申请号:US17419648
申请日:2019-12-24
Applicant: ASML Netherlands B.V.
Inventor: Simon Gijsbert Josephus Mathijssen , Marc Johannes Noot , Kaustuve Bhattacharyya , Arie Jeffrey Den Boef , Grzegorz Grzela , Timothy Dugan Davis , Olger Victor Zwier , Ralph Timotheus Huijgen , Peter David Engblom , Jan-Willem Gemmink
CPC classification number: G03F7/70633 , G01N21/47 , G06T7/0004 , G01N2021/4735 , G06T2207/30148
Abstract: A method provides the steps of receiving an image from a metrology tool, determining individual units of said image and discriminating the units which provide accurate metrology values. The images are obtained by measuring the metrology target at multiple wavelengths. The discrimination between the units, when these units are pixels in said image, is based on calculating a degree of similarity between said units.
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公开(公告)号:US11947269B2
公开(公告)日:2024-04-02
申请号:US17497087
申请日:2021-10-08
Applicant: ASML NETHERLANDS B.V.
Inventor: Anagnostis Tsiatmas , Paul Christiaan Hinnen , Elliott Gerard McNamara , Thomas Theeuwes , Maria Isabel De La Fuente Valentin , Mir Homayoun Shahrjerdy , Arie Jeffrey Den Boef , Shu-jin Wang
CPC classification number: G03F7/70633 , G03F7/70625 , G03F7/70683 , G06T7/0006 , G03F7/20 , G06T2207/30148
Abstract: A method including: obtaining a detected representation of radiation redirected by each of a plurality of structures from a substrate additionally having a device pattern thereon, wherein each structure has an intentional different physical configuration of the respective structure than the respective nominal physical configuration of the respective structure, wherein each structure has geometric symmetry at the respective nominal physical configuration, wherein the intentional different physical configuration of the structure causes an asymmetric optical characteristic distribution and wherein a patterning process parameter measures change in the physical configuration; and determining a value, based on the detected representations and based on the intentional different physical configurations, to setup, monitor or correct a measurement recipe for determining the patterning process parameter.
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公开(公告)号:US11940739B2
公开(公告)日:2024-03-26
申请号:US17562446
申请日:2021-12-27
Applicant: ASML Netherlands B.V.
Inventor: Nitesh Pandey , Arie Jeffrey Den Boef , Duygu Akbulut , Marinus Johannes Maria Van Dam , Hans Butler , Hugo Augustinus Joseph Cramer , Engelbertus Antonius Fransiscus Van Der Pasch , Ferry Zijp , Jeroen Arnoldus Leonardus Johannes Raaymakers , Marinus Petrus Reijnders
IPC: G03F7/20 , G01N21/956 , G03F7/00
CPC classification number: G03F7/70625 , G01N21/956 , G03F7/7015 , G03F7/70633
Abstract: A metrology tool for determining a parameter of interest of a structure fabricated on a substrate, the metrology tool comprising: an illumination optical system for illuminating the structure with illumination radiation under a non-zero angle of incidence; a detection optical system comprising a detection optical sensor and at least one lens for capturing a portion of illumination radiation scattered by the structure and transmitting the captured radiation towards the detection optical sensor, wherein the illumination optical system and the detection optical system do not share an optical element.
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公开(公告)号:US11828585B2
公开(公告)日:2023-11-28
申请号:US17692974
申请日:2022-03-11
Applicant: ASML Netherlands B.V.
Inventor: Henricus Petrus Maria Pellemans , Arie Jeffrey Den Boef
CPC classification number: G01B11/24 , G03F7/7085 , G03F7/70191 , G03F7/70633
Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.
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公开(公告)号:US11703772B2
公开(公告)日:2023-07-18
申请号:US17124758
申请日:2020-12-17
Applicant: ASML NETHERLANDS B.V.
Inventor: Arie Jeffrey Den Boef , Timothy Dugan Davis , Peter David Engblom , Kaustuve Bhattacharyya
CPC classification number: G03F9/7069 , G01B11/272 , G03F7/70633
Abstract: A method including: determining recipe consistencies between one substrate measurement recipe of a plurality of substrate measurement recipes and each other substrate measurement recipe of the plurality of substrate measurement recipes; calculating a function of the recipe consistencies; eliminating the one substrate measurement recipe from the plurality of substrate measurement recipes if the function meets a criterion; and reiterating the determining, calculating and eliminating until a termination condition is met. Also disclosed herein is a substrate measurement apparatus, including a storage configured to store a plurality of substrate measurement recipes, and a processor configured to select one or more substrate measurement recipes from the plurality of substrate measurement recipes based on recipe consistencies among the plurality of substrate measurement recipes.
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97.
公开(公告)号:US11644428B2
公开(公告)日:2023-05-09
申请号:US16719107
申请日:2019-12-18
Applicant: ASML Netherlands B.V.
Inventor: Arie Jeffrey Den Boef
IPC: G01B11/00 , G01N21/956 , G03F7/20
CPC classification number: G01N21/95607 , G03F7/7015 , G03F7/70633
Abstract: Systems, methods, and apparatus are provided for determining overlay of a pattern on a substrate with a mask pattern defined in a resist layer on top of the pattern on the substrate. A first grating is provided under a second grating, each having substantially identical pitch to the other, together forming a composite grating. A first illumination beam is provided under an angle of incidence along a first horizontal direction. The intensity of a diffracted beam from the composite grating is measured. A second illumination beam is provided under the angle of incidence along a second horizontal direction. The second horizontal direction is opposite to the first horizontal direction. The intensity of the diffracted beam from the composite grating is measured. The difference between the diffracted beam from the first illumination beam and the diffracted beam from the second illumination beam, linearly scaled, results in the overlay error.
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公开(公告)号:US11429029B2
公开(公告)日:2022-08-30
申请号:US17081325
申请日:2020-10-27
Applicant: ASML NETHERLANDS B.V.
Inventor: Maurits Van Der Schaar , Patrick Warnaar , Youping Zhang , Arie Jeffrey Den Boef , Feng Xiao , Martin Ebert
Abstract: A method includes projecting an illumination beam of radiation onto a metrology target on a substrate, detecting radiation reflected from the metrology target on the substrate, and determining a characteristic of a feature on the substrate based on the detected radiation, wherein a polarization state of the detected radiation is controllably selected to optimize a quality of the detected radiation.
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公开(公告)号:US11327410B2
公开(公告)日:2022-05-10
申请号:US16826479
申请日:2020-03-23
Applicant: ASML Netherlands B.V.
Abstract: A metrology apparatus for and a method of determining a characteristic of interest relating to at least one structure on a substrate. The metrology apparatus comprises a sensor and an optical system. The sensor is for detecting characteristics of radiation impinging on the sensor. The optical system comprises an illumination path and a detection path. The optical system is configured to illuminate the at least one structure with radiation received from a source via the illumination path. The optical system is configured to receive radiation scattered by the at least one structure and to transmit the received radiation to the sensor via the detection path.
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100.
公开(公告)号:US11307024B2
公开(公告)日:2022-04-19
申请号:US16817552
申请日:2020-03-12
Applicant: ASML Netherlands B.V.
Inventor: Henricus Petrus Maria Pellemans , Arie Jeffrey Den Boef
Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.
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