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    MICROENCAPSULATED CURING AGENT, PRODUCTION THEREOF, THERMOSETTING RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL
    94.
    发明专利
    MICROENCAPSULATED CURING AGENT, PRODUCTION THEREOF, THERMOSETTING RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL 失效

    公开(公告)号：JPH07304968A

    公开(公告)日：1995-11-21

    申请号：JP4547095

    申请日：1995-03-06

    Applicant: TORAY INDUSTRIES

    Inventor： SAWAOKA RYUJI ,  KAWACHI SHINJI ,  MURAKI TOSHIO

    IPC: B29B11/16 ,  B01J13/12 ,  C08G59/18 ,  C08G59/50 ,  C08G73/00 ,  C08J5/24 ,  C08L101/00

    Abstract: PURPOSE:To obtain the agent which has good room-temperature storage stability and can provide a thermosetting resin composition and a prepreg excellent in heat resistance after being cured by coating a curing agent with a specified resin. CONSTITUTION:This agent essentially consists of a curing agent (A) for a thermosetting resin and a thermoplastic resin (B) soluble in the thermosetting resin when heated, is in the form of particles each of which is composed of component A, and a layer mainly made from component B and coating component A and has an average particle diameter of 0.1-20mum. It is desirable that both of components A and B are insoluble in water and soluble in a hydrophobic organic solvent having a boiling point of 100 deg.C or below. Particularly desirable examples of component A include an aromatic amide, an imidazole compound and an imidazole compound/ glycidyl compound adduct. This agent is obtained by dissolving components A and B in an organic solvent, emulsifying the solution in water, and removing the organic solvent from the emulsion.

    PREPREG
    95.
    发明专利
    PREPREG 失效

    公开(公告)号：JPH07228716A

    公开(公告)日：1995-08-29

    申请号：JP2037794

    申请日：1994-02-17

    Applicant: TORAY INDUSTRIES

    Inventor： SAWAOKA RYUJI ,  NODA SHUNSAKU ,  MURAKI TOSHIO ,  TAKAGISHI HIROYUKI

    IPC: B29B11/16 ,  B29B15/10 ,  C08G59/14 ,  C08G59/50 ,  C08J5/04 ,  C08J5/24 ,  C08L63/00

    Abstract: PURPOSE:To prepare a prepreg, having excellent storage stability and other properties, which can provide a composite material having excellent impact strength. CONSTITUTION:A carbon fiber having a tensile elongation of not less than 1.7% is impregnated with a bisphenol A epoxy resin having an epoxy equivalent of 140 to 250 and/or a resin compsn., having a viscosity at 80 deg.C of 20 to 300 P, comprising, as indispensable ingredients, a mixture A of a bisphenol F epoxy resin A1 having an epoxy equivalent 140 to 250 and a bisphenol A epoxy resin A2 having an epoxy equivalent of 350 to 1000 in a A1 to A2 wt. ratio of 0.3 to 3, a reaction product B between a liquid butadiene/acrylonitrile copolymer, having a carboxyl group on its both molecular ends and an acrylonitrile content of 10 to 30wt.%, and an epoxy resin Al, and a dicyandiamide and/or curing accelerator C.

    EPOXY RESIN COMPOSITION FOR PREPREG AND PREPREG
    96.
    发明专利
    EPOXY RESIN COMPOSITION FOR PREPREG AND PREPREG 失效

    公开(公告)号：JPH0776616A

    公开(公告)日：1995-03-20

    申请号：JP16197294

    申请日：1994-07-14

    Applicant: TORAY INDUSTRIES

    Inventor： TAKAGISHI HIROYUKI ,  NODA SHUNSAKU ,  MURAKI TOSHIO ,  IZUMI HIROYUKI

    IPC: C08G59/38 ,  C08G59/40 ,  C08J5/24 ,  C08L63/00

    Abstract: PURPOSE:To provide the composition comprising a specific epoxy resin component, a guanidine compound, a reaction product, etc., capable of being cured at low temperatures, and excellent in heat resistance and rapid curability. CONSTITUTION:This composition comprises (A) 100 pts.wt. of a mixture comprising a bisphenol type epoxy resin preferably in an amount of 60-90wt.% and a novolak epoxy resin preferably in an amount of 10-40wt.%, (B) (i) a guanidine compound such as dicyandiamide preferably in an amount of 0.3-10 pts.wt. and (ii) a curing accelerator such as N-(3-chloro-4-methoxyphenyl)-N,N'- dimethylurea of the formula (X, Y are H, chlorine, bromine, methyl, nitro, etc.; R1, R2 are alkyl, allyl, alkoxy, etc.) preferably in an amount of 0.3-20 pts.wt., and (C) the reaction product of an epoxy compound with an imidazole compound preferably in an amount of 5-30 pts.wt.

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