公开(公告)号：WO2008057519A3

公开(公告)日：2008-10-02

申请号：PCT/US2007023337

申请日：2007-11-01

Applicant: CHROMA ATE INC

Inventor： TSENG I-SHIH

IPC: H05K7/20

CPC classification number: H01L23/467 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: It s a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(?u m d)/µ=2,500; with ? being the fluid density, u m being the free- stream fluid velocity, d being the pipe distance or diameter, µ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract translation: 它是一种顶部安装表面气流散热器，利用由气隙隔开的上部顶壁，与加热装置（微处理器）的上表面一起产生气流。 这是一种简单的设备，使用雷诺方程Re =（？u m D d）/μ= 2,500，成本低廉; 与？ 作为流体密度，u> m是自由流体流速，d是管道距离或直径，μ是流体粘度。 由于气流产生空气湍流，导致空气中频繁的热交换。 它也会导致不同层次空气中明显的温度变化。 因此，它大大增加了散热的效率。 它只需要空气的输入。 操作简单，可以使用更高的发热装置。 因此，它可以在电路板组件的安装中促进该顶部安装散热装置的替代使用。

公开(公告)号：WO2008057518A2

公开(公告)日：2008-05-15

申请号：PCT/US2007023336

申请日：2007-11-01

Applicant: CHROMA ATE INC

Inventor： TSENG I-SHIH

IPC: H05K7/20

CPC classification number: H01L23/467 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(?u m d)/µ=2,500; with p being the fluid density, u m being the free-stream fluid velocity, d being the pipe distance or diameter, µ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract translation: 它是一种顶部安装表面气流散热器，利用由气隙隔开的上部顶壁，与加热装置（微处理器）的上表面一起产生气流。 这是一种简单的设备，使用雷诺方程Re =（？u m D d）/μ= 2,500，成本低廉; 其中p是流体密度，u是自由流体流速，d是管道距离或直径，μ是流体粘度。 由于气流产生空气湍流，导致空气中频繁的热交换。 它也会导致不同层次空气中明显的温度变化。 因此，它大大增加了散热的效率。 它只需要空气的输入。 操作简单，可以使用更高的发热装置。 因此，它可以在电路板组件的安装中促进该顶部安装散热装置的替代使用。

公开(公告)号：EP4006561B1

公开(公告)日：2025-03-05

申请号：EP21208608.6

申请日：2021-11-16

Inventor： Yang, Kao-Shan ,  Lin, Ching-Li

IPC: G01R31/28 ,  G01R1/073

公开(公告)号：EP4354187A1

公开(公告)日：2024-04-17

申请号：EP23197237.3

申请日：2023-09-13

Applicant: Chroma ATE Inc.

Inventor： Hsieh, Cheng Chih ,  Wu, Tien Chi ,  Lee, Ming-Long ,  Lin, Yu-Hsuan ,  Lin, Tsung-I ,  Ma, Chien-Hao

IPC: G02B5/04 ,  G01B11/26 ,  G01B11/27

CPC classification number: G02B5/04 ,  G01B11/26 ,  G01B11/27

Abstract: The present invention relates to six-degree-of-freedom error correction method and apparatus. The apparatus comprises a six-axis correction stage, an auto-collimation measurement device, a light splitter, a telecentric image measurement device, and a controller. The six-axis correction stage is used for carrying a device under test; the auto-collimation measurement device is arranged above the six-axis correction stage along a measurement optical axis; the light splitter is arranged on the measurement optical axis and is interposed between the six-axis correction stage and the auto-collimation measurement device; the telecentric image measurement device is arranged on one side of the measurement optical axis and corresponds to the light splitter. The method controls the six-axis correction stage to correct rotation errors in at least two degrees of freedom of the device under test according to a measurement result of the auto-collimation measurement device, and controls the six-axis correction stage to correct translation and yaw errors in at least three degrees of freedom of the device under test according to a measurement result of the telecentric image measurement device by means of the controller.

公开(公告)号：EP4394357A1

公开(公告)日：2024-07-03

申请号：EP23220701.9

申请日：2023-12-29

Applicant: Chroma ATE Inc.

Inventor： CHU, Chien-Hsun

IPC: G01N21/27 ,  G01N21/64

CPC classification number: G01N21/278 ,  G01N21/6456 ,  G01N2021/641720130101 ,  G01N2201/062620130101 ,  G01N2201/062720130101

Abstract: A composite calibration plate (100) includes a control board (1), a light detection board (2), a diffusion board (3), a light-emitting sheet (4), and a fluorescent sheet (5). The control board (1) has a first setting surface (11) and a second setting surface (12). The light detection board (2) is stacked on the first setting surface (11). The diffusion board (3) is stacked on the light detection board (2). The light-emitting sheet (4) is stacked on the second setting surface (12) and includes a plurality of self-luminous sources (412). The fluorescent sheet (5) is optionally stacked on the light-emitting sheet (4) or the diffusion board (3), and has a plurality of fluorescent chips (52). When calibrating a lighting device (201), the fluorescent sheet (5) is disposed on the light-emitting sheet (4); and, when calibrating an imaging device (202), the fluorescent sheet (5) is disposed on the light-emitting sheet (4), such that the fluorescent sheet (5) is located at a focus position (FP) of an optical imaging path (IP).

公开(公告)号：EP3922366B1

公开(公告)日：2023-07-26

申请号：EP21178866.6

申请日：2021-06-10

Inventor： LEE, Jih-Hsing ,  WANG, Yu-Kuang ,  CHUANG, Ming-Ju ,  CHANG, Wen-Chuan

IPC: B08B1/00

公开(公告)号：EP4386398A1

公开(公告)日：2024-06-19

申请号：EP23209656.0

申请日：2023-11-14

Applicant: Chroma ATE Inc.

Inventor： CHUANG, Yu-Wei ,  WU, Xin-Yi ,  CHOU, Jui-Che

IPC: G01R31/28

CPC classification number: G01R31/2874 ,  G01R31/2855

Abstract: A multiphase thermal interface component (T), a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component (T) includes a thermal interface solid element (2) and a thermal interface fluid material (3). The thermal conductive surface of the thermal interface solid element (2) has an accommodation space (S), and the thermal interface fluid material (3) is accommodated in the accommodation space (S). Therefore, the multiphase thermal interface component (T) combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material (3) can completely fill up the air gaps between the thermal interface solid element (2) and the thermal control device (Mt)/the temperature-controlled component (Oc), so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.

公开(公告)号：MY192563A

公开(公告)日：2022-08-29

申请号：MYPI2018700649

申请日：2018-02-20

Applicant: CHROMA ATE INC

Inventor： WU CHI-CHEN ,  CHENG YUN-JUI ,  CHEN CHIEN-MING

IPC: B21D43/05 ,  B30B15/00 ,  G01R1/04 ,  G01R31/28 ,  H01L21/673 ,  H01L21/677 ,  H01L23/32 ,  H01R13/629

Abstract: A modular pressing device (1) capable of generating stage downward forces is provided. The modular pressing device (1) comprises a non-exchangeable pressing module (2) and an exchangeable pressing module (3). The non-exchangeable pressing module (2) includes a first downward force generating unit (21). The exchangeable pressing module (3) includes a second downward force generating unit (31). The first downward force generating unit (21) applies a first downward force to at least one of a testing seat (S) and an electronic device (C) through the exchangeable pressing module (3). The second downward force generating unit (31) applies a second downward force to the electronic device (C). Thereby, the modular pressing device (1) is capable to generate two different downward forces to reduce the downward surge force. In addition, as the exchangeable pressing module (3) is worn, the exchangeable pressing module (3) can be replaced quickly such that the maintenance cost can be effectively reduced and the stability of the apparatus can be enhanced. (FIG. 1)

公开(公告)号：SG194333A1

公开(公告)日：2013-11-29

申请号：SG2013033956

申请日：2013-05-02

Applicant: CHROMA ATE INC

Inventor： CHIEN-MING CHEN ,  MENG-KUNG LU

Abstract: A test device is provided for testing a bottom chip of a package-on package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts isinstalled on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.

公开(公告)号：MY170414A

公开(公告)日：2019-07-29

申请号：MYPI2013700711

申请日：2013-05-02

Applicant: CHROMA ATE INC

Inventor： CHIEN-MING CHEN ,  MENG-KUNG LU

Abstract: A test device is provided for testing a bottom chip ( 5) of a package-on-package (PoP) stacked-chip. An upper surface (51) of the bottom chip (5) has a plurality of soldering points (511) for electrically connecting a plurality of corresponding soldering points (222) of a top chip (221) of the PoP stacked-chip. The test device includes a test head (22) and a plurality of test contacts (224). The test head (22) has the top chip (221) installed inside. The plurality of test contacts (224)is installed on a lower surface (225) of the test head (22) and electrically connected to the plurality of corresponding soldering points (222) of the top chip (221)inside the test head (22). When the lower surface (225) of the test head (22) contacts the upper surface (51) of the bottom chip (5), the plurality of test contacts (224)is electrically connected to the plurality of soldering points (511) for testing the bottom chip (5). Figure 4