-
公开(公告)号：US09097654B2
公开(公告)日：2015-08-04
申请号：US13130878
申请日：2009-11-30
Applicant: Neville John Freeman , Andrew Raymond Mount , Anthony John Walton , Jonathan Gordon Terry
CPC classification number: G01N27/307 , B81B2201/02 , B81B2203/04 , C25B11/02
Abstract: The present invention relates to an electrode assembly having a laminate structure comprising: a first insulating capping layer; a first conducting layer capped by the first insulating capping layer and substantially sandwiched by at least the first insulating capping layer such as to leave exposed only an electrical contact lip of the first conducting layer; and an array of etched voids extending through at least the first insulating capping layer and the first conducting layer, wherein each void is partly bound by a surface of the first conducting layer which acts as an internal submicron electrode.
Abstract translation: 本发明涉及具有层叠结构的电极组件，包括：第一绝缘覆盖层; 第一导电层被第一绝缘覆盖层覆盖，并且至少基本上被第一绝缘覆盖层夹持，以便仅露出第一导电层的电接触唇; 以及延伸穿过至少第一绝缘覆盖层和第一导电层的蚀刻空隙的阵列，其中每个空隙部分地由作为内部亚微米电极的第一导电层的表面结合。
-
92.发明申请MICROELECTROMECHANICAL DEVICE WITH PROTECTION FOR BONDING AND PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL DEVICE 审中-公开具有用于制造微电子设备的粘合和工艺保护的微电子器件公开(公告)号：US20150102434A1
公开(公告)日：2015-04-16
申请号：US14511002
申请日：2014-10-09
Applicant: STMicroelectronics S.r.l.
Inventor： Luca Maggi , Sebastiano Conti
CPC classification number: B81B7/0048 , B81B3/0027 , B81B2201/02 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81C1/00238 , B81C1/00269 , B81C1/00825 , B81C3/001 , B81C2203/032 , H01L24/26 , H04R19/005
Abstract: A microelectromechanical device includes: a substrate; a semiconductor die, bonded to the substrate and incorporating a microstructure; an adhesive film layer between the die and the substrate; and a protective layer between the die and the adhesive film layer. The protective layer has apertures, and the adhesive film layer adheres to the die through the apertures of the protective layer.
Abstract translation: 微机电装置包括：基板; 半导体管芯，结合到衬底并结合微结构; 模具和基板之间的粘合膜层; 以及模具和粘合膜层之间的保护层。 保护层具有孔，并且粘合剂膜层通过保护层的孔附着到管芯。
-
93.发明申请公开(公告)号：US20130214876A1
公开(公告)日：2013-08-22
申请号：US13668760
申请日：2012-11-05
Applicant: Moon Chul Lee , Duck Hwan Kim , In Sang Song , Jea Shik Shin
Inventor： Moon Chul Lee , Duck Hwan Kim , In Sang Song , Jea Shik Shin
IPC: H03H9/00
CPC classification number: G01N27/04 , B81B2201/02 , H03H3/0072 , H03H3/0077 , H03H9/2463 , H03H2009/02346 , H03H2009/0244
Abstract: A nano scale resonator, a nano scale sensor, and a fabrication method thereof are provided. The nano scale resonator includes a resonance unit of nano scale configured to resonate based on an applied signal, and an anchor on a substrate, the anchor being configured to support the resonance unit, the anchor having an air gap within boundaries of the anchor, the resonance unit, and the substrate, the air gap being configured to reflect a vertical wave occurring in the resonance unit.
Abstract translation: 提供了纳米级谐振器，纳米级传感器及其制造方法。 所述纳米级谐振器包括纳米级的谐振单元，其被配置为基于所施加的信号而谐振，并且所述锚固件被构造成支撑所述谐振单元，所述锚固件在所述锚的边界内具有气隙， 谐振单元和基板，气隙被配置为反映在谐振单元中发生的垂直波。
-
公开(公告)号：US12067448B2
公开(公告)日：2024-08-20
申请号：US17958620
申请日：2022-10-03
Applicant: ENDOTRONIX, INC.
Inventor： Balamurugan Sundaram , Michael Nagy , Douglas Nielsen , Suresh Sundaram , Harry Rowland
CPC classification number: G06K7/10425 , A61B5/0031 , A61B5/0215 , A61B90/98 , G06K7/10386 , H04Q9/00 , A61B5/318 , A61F2250/0002 , B81B2201/02 , B81B2201/06 , G16H10/65 , H04Q2209/00 , H04Q2209/47 , H04Q2209/50 , H04Q2209/86
Abstract: Disclosed are a reader device, system, and method for communicating with a wireless sensor. The reader device may be configured to analyze the strength of a response signal transmitted from the wireless sensor in response to an excitation pulse generated by the reader device. In one embodiment, the reader device may be configured to engage be placed in a plurality of modes to allow the reader to transmit a signal, such as a short pulse of energy or a short burst of radio frequency energy to cause the wireless sensor to output a resonant signal. The reader device may receive the resonant signal from the wireless sensor and evaluate it against predetermined values. The evaluated signals may be used to assess the strength and the proximity of the reader device relative to the wireless sensor as it is implanted in a patient.
-
公开(公告)号：US11897761B2
公开(公告)日：2024-02-13
申请号：US17832904
申请日：2022-06-06
Applicant: Amkor Technology Singapore Holding Pte. Ltd.
Inventor： Ki Yeul Yang , Kyung Han Ryu , Seok Hun Yun , Bora Baloglu , Hyun Cho , Ramakanth Alapati
CPC classification number: B81C1/00182 , B81B7/007 , B81C1/00158 , B81C1/00301 , H01L23/481 , B81B2201/02
Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
-
Patent Agency Ranking
公开(公告)号：US20190161340A1
公开(公告)日：2019-05-30
申请号：US16098230
申请日：2017-05-05
Applicant: ams AG
Inventor： Harald Etschmaier , Anderson Singulani
CPC classification number: B81B7/0048 , B81B3/0021 , B81B7/0058 , B81B2201/02 , B81B2201/0264 , B81B2201/0292 , B81B2203/0127 , B81B2203/051
Abstract: A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.
-
公开(公告)号：US20180328959A1
公开(公告)日：2018-11-15
申请号：US15775219
申请日：2016-11-14
Applicant: Robert Bosch GmbH
Inventor： Johannes Classen , Antoine Puygranier , Denis Gugel , Guenther-Nino-Carlo Ullrich , Markus Linck-Lescanne , Sebastian Guenther , Timm Hoehr
IPC: G01P15/125 , B81B5/00
CPC classification number: G01P15/125 , B81B5/00 , B81B2201/02 , B81B2203/04 , B81B2203/051 , G01P2015/0814 , G01P2015/0871
Abstract: A micromechanical structure for an acceleration sensor includes a movable seismic mass including electrodes, the seismic mass being attached to a substrate with the aid of an attachment element; first fixed counter electrodes attached to a first carrier plate; and second fixed counter electrodes attached to a second carrier plate, where the counter electrodes, together with the electrodes, are situated nested in one another in a sensing plane of the micromechanical structure, and where the carrier plates are situated nested in one another in a plane below the sensing plane, each being attached to a central area of the substrate with the aid of an attachment element.
-
公开(公告)号：US20180247095A1
公开(公告)日：2018-08-30
申请号：US15903809
申请日：2018-02-23
Applicant: ENDOTRONIX, INC.
Inventor： Balamurugan Sundaram , Michael Nagy , Douglas Nielsen , Suresh Sundaram , Harry Rowland
CPC classification number: G06K7/10425 , A61B5/0031 , A61B5/0215 , A61B5/0402 , A61B90/98 , A61F2250/0002 , B81B2201/02 , B81B2201/06 , G06K7/10386 , G16H10/65 , H04Q9/00 , H04Q2209/00 , H04Q2209/47 , H04Q2209/50 , H04Q2209/86
Abstract: Disclosed are a reader device, system, and method for communicating with a wireless sensor. The reader device may be configured to analyze the strength of a response signal transmitted from the wireless sensor in response to an excitation pulse generated by the reader device. In one embodiment, the reader device may be configured to engage be placed in a plurality of modes to allow the reader to transmit a signal, such as a short pulse of energy or a short burst of radio frequency energy to cause the wireless sensor to output a resonant signal. The reader device may receive the resonant signal from the wireless sensor and evaluate it against predetermined values. The evaluated signals may be used to assess the strength and the proximity of the reader device relative to the wireless sensor as it is implanted in a patient.
-
公开(公告)号：US20180127264A1
公开(公告)日：2018-05-10
申请号：US15668844
申请日：2017-08-04
Applicant: SILICON INTEGRATED SYSTEMS CORP.
Inventor： Ssu-Che YANG , Wen-Chi LIN , Keng-Nan CHEN
CPC classification number: B81B7/008 , B81B2201/02 , G01R17/04 , H02M3/07 , H04R3/04 , H04R2201/003 , H04R2410/00
Abstract: A sensing device includes a micro-electromechanical sensor, a source follower and an amplifier. The source follower includes a first output module including a first transistor and a second transistor. The micro-electromechanical sensor is configured to generate an input signal. A first terminal of the first transistor is configured to receive a first reference voltage. A second terminal and a control of the first transistor are electrically connected to the first output terminal and to a first current source respectively. A first terminal and a second terminal of the second transistor are electrically connected to the second terminal and the control terminal of the first transistor respectively. A control terminal of the second transistor is configured to receive the input signal. A first input terminal and a second input terminal of the amplifier are electrically connected to a first output terminal configured to receive a common-mode voltage respectively.
-
公开(公告)号：US20180074000A1
公开(公告)日：2018-03-15
申请号：US15808408
申请日：2017-11-09
Applicant: STMicroelectronics S.r.l.
Inventor： Pasquale Biancolillo , Angelo Recchia , Pasquale Franco , Antonio Cicero , Giuseppe Bruno
CPC classification number: G01N27/18 , B81B7/02 , B81B7/04 , B81B2201/02 , B81B2201/0278 , G01N30/66 , G01N33/0027
Abstract: A semiconductor gas sensor device includes a first cavity that is enclosed by opposing first and second semiconductor substrate slices. At least one conducting filament is provided to extend over the first cavity, and a passageway is provided to permit gas to enter the first cavity. The sensor device may further including a second cavity that is hermetically enclosed by the opposing first and second semiconductor substrate slices. At least one another conducting filament is provided to extend over the second cavity.
-
-
-
-
-
-
-
-
-
Search Results
166
records
(took 0.027 seconds)
