Abstract:
A semiconductor light emitter device, comprising a substrate (102), an active layer (108) made of Germanium, which is configured to emit light under application of an operating voltage to the semiconductor light emitter device, wherein a gap (106) is arranged on the substrate, which extends between two bridgeposts (104) laterally spaced from each other, the active layer (108) is arranged on the bridgeposts and bridges the gap, and wherein the semiconductor light emitter device comprises a stressor layer (110), which induces a tensile strain in the active layer above the gap.
Abstract:
A method of fabricating a substrate for a semipolar Ill-nitride device, comprising patterning and forming one or more mesas on a surface of a semipolar III- nitride substrate or epilayer, thereby forming a patterned surface of the semipolar III- nitride substrate or epilayer including each of the mesas with a dimension / along a direction of a threading dislocation glide, wherein the threading dislocation glide results from a Ill-nitride layer deposited heteroepitaxially and coherently on a non- patterned surface of the substrate or epilayer.
Abstract:
A GaN edge emitting laser is provided comprising a semi-polar GaN substrate, an active region, an N-side waveguiding layer, a P-side waveguiding layer, an N-type cladding layer, and a P-type cladding layer. The GaN substrate defines a 2021 crystal growth plane and a glide plane. The N-side and P-side waveguiding layers comprise a GalnN/GaN or GalnN/GalnN superlattice (SL) waveguiding layers. The superlattice layers of the N-side and P-side SL waveguiding layers define respective layer thicknesses that are optimized for waveguide planarity, the layer thicknesses being between approximately 1 nm and approximately 5 nm. In accordance with another embodiment of the present disclosure, planarization can be enhanced by ensuring that the N-side and P-side GaN-based waveguiding layers are grown at a growth rate that exceeds approximately 0.09 nm/s, regardless of whether the N-side and P-side GaN-based waveguiding layers are provided as a GalnN/GaN or GalnN/GalnN SL or as bulk waveguiding layers. In still further embodiments, planarization can be enhanced by selecting optimal SL layer thicknesses and growth rates. Additional embodiments are disclosed and claimed.
Abstract:
Vorliegend wird ein optoelektronischer Halbleiterchip (1) mit einer nicht planaren Aufwachsschicht (2), die mindestens ein erstes Nitridverbindungshalbleitermaterial enthält, sowie einer aktiven Zone (5), die mindestens ein zweites Nitridverbindungshalbleitermaterial enthält und auf der Aufwachsschicht (2) angeordnet ist, und einer Deckschicht (7), die auf der aktiven Zone (5) angeordnet ist, beschrieben, wobei die Aufwachsschicht (2) an einer der aktiven Zone (5) zugewandten Aufwachsoberfläche (3) Strukturelemente (4) aufweist.
Abstract:
The method of growing non-polar epitaxial heterostructures for light-emitting diodes producing white emission and lasers, on the basis of compounds and alloys in AlGaInN system, comprising the step of vapor-phase deposition of one or multiple heterostructures layers described by the formula Al x Ga 1-x N(0 3 N structures using (a)-langasite (La 3 Ga 5 SiO 14 ) substrates is applied for the purposes of reducing the density of defects and mechanical stresses in heterostructures.
Abstract:
An object of the present invention is to provide a Group III nitride semiconductor light-emitting device with high emission efficiency. The inventive Group III nitride semiconductor light-emitting device has an n-type layer, a light-emitting layer and a p-type layer composed of a Group III nitride semiconductor on a substrate, with the light-emitting layer sandwiched between the n-type layer and p-type layer, wherein the range for Δa as the ratio of the difference between the a-axis lattice constant of the layer between the light-emitting layer and substrate (or in the case of multiple layers with different compositions between the light-emitting layer and substrate, where each layer is grouped according to composition, the a-axis lattice constant of the group having the maximum thickness considering all of the layers belonging to the group) a1 and the a-axis lattice constant of the light-emitting layer (or if the light-emitting layer has a multiple quantum well structure, the a-axis lattice constant determined from the zero-order peak representing the average composition of the well layers and barrier layers) a2, represented by the following formula (I), is -0.05 ≤ Δa ≤ 0.05 (unit: %).Δa = 100(a 1 -a 2 )/a 1 (I)
Abstract translation:本发明的目的是提供一种发光效率高的III族氮化物半导体发光元件。 本发明的III族氮化物半导体发光器件在衬底上具有n型层,发光层和由III族氮化物半导体构成的p型层,其中发光层夹在n型层之间, 型层和p型层,其中λa的范围作为发光层和衬底之间的层的a轴晶格常数之间的差的比率(或者在具有不同组成的多层之间的差异之间的比率 发光层和基板,其中每个层根据组成分组,考虑属于该组的所有层的具有最大厚度的组的a轴晶格常数a1和a轴晶格常数 发光层(或者如果发光层具有多重量子阱结构,则从表示阱层和阻挡层的平均组成的零级峰值确定的a轴晶格常数a2,repr 由下式(I)表示,为-0.05 =αa = 0.05(单位:%).a a = 100(a 1 -a 2)/ a (I)
Abstract:
A laser system having migration enhanced epitaxy grown substantially flat layers proximate to quantum wells of an active region. The flat layers may be grown at low temperature. This growth may result in flatter interfaces in the nitrogen containing quantum wells within the active region as well as lower trap densities in adjacent material. This may achieve a reduced trap density as well as reduced segregation resulting in a spectral luminescence profile revealing a single narrow peak with a high level of photoluminescence.