公开(公告)号：WO2012170639A1

公开(公告)日：2012-12-13

申请号：PCT/US2012/041266

申请日：2012-06-07

Applicant: TESSERA, INC. ,  SAKUMA, Kazuo ,  DAMBERG, Philip ,  HABA, Belgacem

Inventor： SAKUMA, Kazuo ,  DAMBERG, Philip ,  HABA, Belgacem

IPC: H01L23/498

CPC classification number: H01L21/4853 ,  H01L23/3142 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/01 ,  H01L24/15 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/002 ,  H05K2201/0166 ,  H01L2924/00

Abstract: An interconnection substrate (10) includes a plurality of electrically conductive elements (14) of at least one wiring layer (11) defining first and second lateral directions. Electrically conductive projections for bonding to electrically conductive contacts of at least one component external to the substrate, extend from the conductive elements above the at least one wiring layer. The conductive projections have end portions (30) remote from the conductive elements and neck portions (20) between the conductive elements and the end portions. The end portions have lower surfaces (32) extending outwardly from the neck portions in at least one of the lateral directions. The substrate further includes a dielectric layer (40) overlying the conductive elements and extending upwardly along the neck portions at least to the lower surfaces. At least portions (46) of the dielectric layer between the conductive projections are recessed below a height of the lower surfaces.

Abstract translation: 互连衬底（10）包括限定第一和第二横向方向的至少一个布线层（11）的多个导电元件（14）。 导电突起，用于粘合到基板外部的至少一个部件的导电触点，从导电元件延伸到至少一个布线层之上。 导电突起具有远离导电元件的端部（30）和导电元件与端部之间的颈部（20）。 端部具有在至少一个横向上从颈部部分向外延伸的下表面（32）。 衬底还包括覆盖导电元件并且沿颈部至少向下表面向上延伸的电介质层（40）。 导电突起之间的电介质层的至少部分（46）在下表面的高度之下凹陷。

公开(公告)号：WO2008141481A1

公开(公告)日：2008-11-27

申请号：PCT/CN2007/001678

申请日：2007-05-24

Applicant: 巨擎科技股份有限公司 ,  杨之光

Inventor： 杨之光

IPC: H05K3/04 ,  H05K3/24 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/048 ,  H05K1/0219 ,  H05K3/0041 ,  H05K3/107 ,  H05K3/244 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/09809 ,  H05K2203/095

Abstract: A multilayered metal wiring board and a method for manufacturing the same are provided, suitable for manufacturing a metal wiring used as coaxial conductor. The method includes: coating a photo resist layer (304) on a dielectric layer of the multilayered board (300) and exposing the photo resist layer (304) in order to define a predetermined position of the metal wiring; stripping the photo resist layer (304) on the predetermined position; after forming the metal wiring (302) on the predetermined position , forming at least one upper covering metal layer (306) on the surface of the metal wiring (302). It's possible to form a covering metal layer on the upper surface, the sides, and even the bottom surface of the metal wiring by only one photo mask process.

公开(公告)号：WO2007146546A2

公开(公告)日：2007-12-21

申请号：PCT/US2007069212

申请日：2007-05-18

Applicant: PPG IND OHIO INC

Inventor： WANG ALAN E ,  OLSON KEVIN C

IPC: H05K1/05 ,  H05K3/44 ,  H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：WO02024592A1

公开(公告)日：2002-03-28

申请号：PCT/US2001/005839

申请日：2001-02-22

IPC: B23Q11/10 ,  C03C25/10 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0366 ,  C03C25/47 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/0769 ,  H05K2203/127 ,  Y10T428/249971 ,  Y10T428/2933

Abstract: The present invention provides an at least partially coated fiber strand (10) comprising a plurality of fibers (12) having a resin compatible coating composition (14) on at least a portion (17) of a surface (16) of at least one of the fibers (23), the resin compatible coating composition (14) comprising: a) a plurality of discrete particles (18) comprising a silicate having a high affinity for metal ions; and b) at least one film-forming material.

Abstract translation: 本发明提供了至少部分涂覆的纤维束（10），其包括在至少一个表面（16）的至少一部分（17）上具有树脂相容性涂料组合物（14）的多个纤维（12） 纤维（23），树脂相容性涂料组合物（14），其包含：a）多个离散颗粒（18），其包含对金属离子具有高亲和力的硅酸盐; 和b）至少一种成膜材料。

公开(公告)号：WO01063985A2

公开(公告)日：2001-08-30

申请号：PCT/US2001/005729

申请日：2001-02-22

IPC: B32B5/28 ,  B23Q11/10 ,  B32B27/18 ,  C03C25/10 ,  H05K1/03 ,  H05K3/00 ,  C08K3/00 ,  C08K3/34

CPC classification number: H05K1/0373 ,  C03C25/47 ,  H05K1/036 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/029 ,  H05K2201/068 ,  H05K2201/0769 ,  H05K2203/127 ,  Y10T442/20 ,  Y10T442/30 ,  Y10T442/3455

Abstract: The present invention provides an electronic support (10) comprising: (A) at least one woven fiber reinforcement material (20) formed from at least one fiber free of basalt glass; and (B) at least one matrix material (16) in contact with at least a portion of the at least one reinforcement material (20), the at least one matrix material (16) comprising at least one non-fluorinated polymer and at least one inorganic filler (18), wherein the at least one inorganic filler (18) comprises at least one non-hydratable, lamellar inorganic solid lubricant having a high electrical resistivity and wherein the at least one inorganic filler (18) comprises at least 6 weight percent of a total combined weight of the at least one inorganic filler (18) and the at least one matrix material (16) on a total solids basis.

Abstract translation: 本发明提供了一种电子支撑件（10），包括：（A）由至少一种不含玄武岩纤维的纤维形成的至少一种编织纤维增强材料（20） 和（B）与所述至少一种增强材料（20）的至少一部分接触的至少一种基质材料（16），所述至少一种基质材料（16）包含至少一种非氟化聚合物，并且至少 一种无机填料（18），其中所述至少一种无机填料（18）包含至少一种具有高电阻率的不可水合的层状无机固体润滑剂，并且其中所述至少一种无机填料（18）包含至少6重量 所述至少一种无机填料（18）和至少一种基质材料（16）的总组合重量的百分比为总固体量。

公开(公告)号：WO0109054A9

公开(公告)日：2001-08-16

申请号：PCT/US0020459

申请日：2000-07-28

Applicant: PPG IND OHIO INC

Inventor： NOVICH BRUCE E ,  LAMMON-HILINSKI KAMI ,  ROBERTSON WALTER J ,  WU XIANG ,  VELPARI VEDAGIRI ,  LAWTON ERNEST L ,  RICE WILLIAM B

IPC: C03C25/10 ,  C03C25/00 ,  C03C25/48 ,  C08J5/08 ,  D06M15/507 ,  D06M15/564 ,  D06M15/59 ,  D06M101/00 ,  H05K1/03 ,  H05K3/00

CPC classification number: C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and lamellar particles having a thermal conductivity of at least 1 Watt per meter K at a temperature of 300K. The present invention also provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and non-hydratable, lamellar particles. The present invention further provides an at least partially coated fiber strand comprising a plurality of fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said fibers, the resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention also provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.

Abstract translation: 本发明提供包含多根纤维的至少部分涂覆的纤维束，所述涂层包含有机组分和在300K的温度下具有至少1瓦/米K的热导率的层状颗粒。 本发明还提供包含多根纤维的至少部分涂覆的纤维束，所述涂层包含有机组分和不可水合的层状颗粒。 本发明还提供至少部分涂覆的纤维束，其包含多种纤维，所述纤维束在至少一种所述纤维的至少一部分表面上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含：（a） 由选自非热膨胀性有机材料，无机聚合物材料，非热膨胀性复合材料及其混合物的材料形成的多个离散颗粒，所述颗粒具有足以使纤维束湿润的平均粒度; （b）不同于所述多个离散颗粒的至少一种润滑材料; 和（c）至少一种成膜材料。 本发明还提供至少部分涂覆的纤维束，其包含多种玻璃纤维，所述纤维束在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含： ）具有不超过所述玻璃纤维的莫氏硬度值的莫氏硬度值的多个层状无机颗粒; 和（b）至少一种聚合物材料。 本发明进一步提供一种至少部分涂覆的纤维束，其包含多种玻璃纤维，所述玻璃纤维在至少一种所述玻璃纤维的表面的至少一部分上具有树脂相容性涂料组合物，所述树脂相容性涂料组合物包含： ）多个中空非热膨胀性有机颗粒; 和（b）至少一种不同于至少一种中空有机颗粒的润滑材料。

公开(公告)号：WO00072643A1

公开(公告)日：2000-11-30

申请号：PCT/US2000/014243

申请日：2000-05-24

IPC: B29B15/12 ,  B29C37/00 ,  B29C70/50 ,  H05K1/03 ,  H05K3/02

CPC classification number: B29C37/0075 ,  B29B15/122 ,  B29B15/125 ,  B29C70/50 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0166 ,  H05K2201/0287

Abstract: The present invention provides a method of forming unidirectional laminate prepreg, comprising the steps of: providing a support table; advancing a plurality of strands oriented generally parallel to each other along at least a portion of the table; positioning a removable carrier material between the strands and the table to support and move with the strands along at least a portion of the table; coating at least a portion of the strands with a resin matrix material to form a pre-cured prepreg; establishing a uniform thickness for the pre-cured prepreg; at least partially curing the matrix material of the pre-cured prepeg to form an at least partially cured prepreg; and accumulating the at least partially cured prepreg. In one nonlimiting embodiment of the invention, the strands comprise a plurality of glass fibers, the carrier material is plastic, the removing step includes the step of positioning an edge of a doctor blade in contact with an upper surface of the pre-cured prepreg to establish the thickness of the pre-cure prepreg, and the at least partially curing step includes the step of passing the pre-cured prepreg through at least one curing and drying oven.

Abstract translation: 本发明提供一种形成单向层压预浸料的方法，包括以下步骤：提供支撑台; 沿着桌子的至少一部分推进大致平行彼此定向的多根股线; 将可移除的载体材料定位在股线和桌子之间，以沿着桌子的至少一部分沿着股线支撑和移动; 用树脂基质材料涂覆至少一部分股线以形成预固化的预浸料坯; 为预固化预浸料制定均匀的厚度; 至少部分地固化预固化的预浸料的基质材料以形成至少部分固化的预浸料; 并积聚至少部分固化的预浸料。 在本发明的一个非限制性实施例中，线束包括多个玻璃纤维，载体材料是塑料，去除步骤包括将刮刀的边缘与预固化的预浸料坯的上表面接触的步骤 确定预固化预浸料的厚度，并且至少部分固化步骤包括使预固化的预浸料通过至少一个固化和干燥炉的步骤。

公开(公告)号：WO00010370A1

公开(公告)日：2000-02-24

申请号：PCT/US1999/000942

申请日：1999-01-15

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K1/02 ,  H05K3/00 ,  H05K3/38 ,  H05K3/40 ,  H01L23/538

CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/388 ,  H05K3/4076 ,  H05K2201/0166 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H01L2924/00

Abstract: A flexible circuit includes a flexible non-conductive substrate (12) having a first surface and a second surface. A first electrically conductive trace (18) is provided on the first surface and a second electrically conductive trace (20) is provided on the second surface. A passage (22) extends through the substrate from an end of the first trace to an end of the second trace. The passage includes a beveled opening (26) of a first size formed in the first side and axially aligned with a second beveled opening (28) of the first size formed in the second side. The first and second openings are interconnected by an aperture axially aligned therewith and being of a second size less than the first size. An electrically conductive surface is provided on the passage for electrically interconnecting the first trace and the second trace.

Abstract translation: 柔性电路包括具有第一表面和第二表面的柔性非导电基底（12）。 第一导电迹线（18）设置在第一表面上，第二导电迹线（20）设置在第二表面上。 通道（22）从第一迹线的末端延伸穿过基底到第二迹线的末端。 通道包括形成在第一侧的第一尺寸的斜切开口（26），并且与形成在第二侧的第一尺寸的第二斜切开口（28）轴向对准。 第一和第二开口通过与其轴向对齐的孔并且具有小于第一尺寸的第二尺寸而相互连接。 在通道上设置导电表面，用于电连接第一迹线和第二迹线。

公开(公告)号：WO2016092718A1

公开(公告)日：2016-06-16

申请号：PCT/JP2015/004080

申请日：2015-08-17

Applicant: 互応化学工業株式会社

Inventor： 酒井　善夫

IPC: G03F7/004 ,  G03F7/029 ,  G03F7/031

CPC classification number: G03F7/031 ,  G03F7/0042 ,  G03F7/0043 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/20 ,  G03F7/2006 ,  G03F7/26 ,  G03F7/322 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/068

Abstract: 本発明に係る感光性樹脂組成物は、（Ａ）光重合性モノマーと光重合性オリゴマーとのうち少なくとも一方を含む光重合性化合物、（Ｂ）酸化チタン及び（Ｃ）光重合開始剤を含有する。（Ｃ）成分が、（Ｃ１）アシルフォスフィンオキサイド系光重合開始剤及び（Ｃ２）フェニルグリオキシレート系光重合開始剤を含有する。

Abstract translation: 根据本发明的感光性树脂组合物包含（A）含有光聚合性单体和光聚合性低聚物中的至少一种的光聚合性化合物，（B）氧化钛和（C）光聚合引发剂。 （C）成分含有（C1）酰基氧化膦光聚合引发剂和（C2）苯基乙醛酸酯光聚合引发剂。

公开(公告)号：WO2015097340A1

公开(公告)日：2015-07-02

申请号：PCT/FI2014/050919

申请日：2014-11-27

Applicant: NOKIA TECHNOLOGIES OY

Inventor： ALLEN, Mark ,  COTTON, Darryl ,  BOWER, Chris ,  ANDREW, Piers

IPC: H05K1/02 ,  H05K3/12

CPC classification number: H05K1/0283 ,  H05K3/1208 ,  H05K2201/0166 ,  H05K2203/308

Abstract: A method comprising forming a substrate scaffold structure for use in the fabrication of a reversibly deformable circuit board, the substrate scaffold structure comprising a predefined waveform topography onto which one or more scaffold-conforming thin film layers can be deposited for use in forming electronic circuit elements of the reversibly deformable circuit board, the waveform topography of the substrate scaffold structure predefined to facilitate operational reversible deformation of the circuit board.

Abstract translation: 一种方法，包括形成用于制造可逆变形的电路板的基底支架结构，所述基底支架结构包括预定义的波形形貌，一个或多个基于支架的薄膜层可以沉积在其上以用于形成电子电路元件 的可逆变形电路板，预定义的基板支架结构的波形形状，以便于电路板的操作可逆变形。