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公开(公告)号：US20160021750A1
公开(公告)日：2016-01-21
申请号：US14332776
申请日：2014-07-16
Applicant: International Business Machines Corporation
Inventor： Ai Kiar Ang , Michael Lauri
CPC classification number: H05K1/11 , H01L21/4839 , H01L23/49537 , H01L23/49555 , H01L23/49565 , H01L23/49575 , H01L25/105 , H01L25/50 , H01L2225/1029 , H01L2924/181 , H05K1/0313 , H05K1/144 , H05K1/18 , H05K1/181 , H05K3/328 , H05K3/341 , H05K3/3421 , H05K3/3426 , H05K2201/10015 , H05K2201/10227 , H05K2201/10515 , H05K2201/1053 , H05K2201/10962 , Y02P70/613 , H01L2924/00012
Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
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公开(公告)号：US08642892B2
公开(公告)日：2014-02-04
申请号：US13235451
申请日：2011-09-18
Applicant: Hai-Qing Zhou
Inventor： Hai-Qing Zhou
IPC: H05K1/03
CPC classification number: G06F1/186 , H05K1/02 , H05K2201/09063 , H05K2201/10227 , H05K2201/10409
Abstract: The circuit board includes a main body, at least one handle, and at least one connecting element. The main body defines at least one through hole. One end of each of the at least one handle defines a positioning portion. The positioning portion of each of the at least one handle extends through a corresponding one of the at least one through hole and is engaged with one of the at least one connecting elements.
Abstract translation: 电路板包括主体，至少一个把手和至少一个连接元件。 主体限定至少一个通孔。 所述至少一个手柄中的每一个的一端限定定位部分。 所述至少一个手柄中的每一个的定位部分延伸穿过所述至少一个通孔中的对应的一个，并且与所述至少一个连接元件中的一个接合。
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公开(公告)号：US20240314926A1
公开(公告)日：2024-09-19
申请号：US18122891
申请日：2023-03-17
Applicant: Infineon Technologies Austria AG
Inventor： Luca Peluso , Kushal Kshirsagar , Paul Yeaman , Anil Jeswani , Marco Pennetti , Kok Yau Chua
CPC classification number: H05K1/0262 , H01L23/50 , H05K1/0201 , H05K1/111 , H05K1/181 , H05K2201/1003 , H05K2201/10053 , H05K2201/10227
Abstract: A voltage regulator module includes: a substrate having power input and output terminals; a power stage package mounted to the substrate and having first and second pads at a side facing away from the substrate, the power stage package configured to receive an input voltage from the power input terminal and output a phase current at the first pad; an inductor having a vertical conductor embedded in a magnetic core, the vertical conductor having a first end attached to the first pad of the power stage package and an opposite second end; and a metallic clip attached to each of the second end of the vertical conductor, the power output terminal, and the second pad of the power stage package. The second pad of the power stage package does not carry any of the phase current.
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公开(公告)号：US20240292515A1
公开(公告)日：2024-08-29
申请号：US18572728
申请日：2022-06-23
Applicant: Tesla, Inc.
Inventor： Rameez Hasan , Christopher Tilton , Jonathan Frydman
CPC classification number: H05K1/0213 , H01R12/52 , H01R12/585 , H05K2201/10227
Abstract: Press-fit fasteners for securing components together are provided. In one aspect, an electronic system assembly includes a first component comprising a first hole, a second component comprising a second hole, and a press-fit fastener configured to be inserted into the first hole and the second hole in a single motion. The press-fit fastener is configured to at least contribute to securing the second component to the first component after insertion into the first and second holes. Related press-fit fasteners and methods of manufacture are disclosed.
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公开(公告)号：US20230217594A1
公开(公告)日：2023-07-06
申请号：US17864562
申请日：2022-07-14
Inventor： CHIA-KANG WU , KUN-YANG CHENG
IPC: H05K1/14
CPC classification number: H05K1/14 , H05K2201/10227 , H05K2201/2027 , H05K2201/09063
Abstract: A guiding device includes a first telescopic member, a second telescopic member, and an elastic member. The first telescopic member includes a main body with a sliding cavity. The second telescopic member includes a connecting portion and a guiding portion connected to the connecting portion. The guiding portion is slidably inserted into the sliding cavity. Opposite ends of the elastic member are respectively connected to the connecting portion and the main body. The elastic member pushes the main body in a direction away from the connecting portion. The disclosure also provides a mainboard connection structure having the above guiding device.
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Patent Agency Ranking
公开(公告)号：US20180248092A1
公开(公告)日：2018-08-30
申请号：US15900685
申请日：2018-02-20
Applicant: Jen-You Liang
Inventor： Jen-You Liang
CPC classification number: H01L33/62 , H01L33/486 , H01L33/60 , H05K1/03 , H05K1/05 , H05K1/181 , H05K3/0052 , H05K2201/09745 , H05K2201/10106 , H05K2201/10227 , H05K2201/10522 , H05K2201/1053
Abstract: A light sensor lead frame substrate may comprise a plurality of lead frame substrates formed on a metal substrate through a series of processing including chemical etching, plasma etching and stamping. The lead frame substrates are connected through a plurality of connecting sections, and each of the lead frame substrates is connected to the metal substrate through the connecting section. Each of the connecting sections has two pre-cut sections respectively formed at two ends of the connecting section. After molding, the lead frame substrates are configured to pass through a series of processing including electroplating, injection and desmear to enable each of the lead frame substrates to have a first insulating layer, a reflector cup and a second insulating layer, and with the pre-cut sections, the connecting sections are adapted to be easily washed down by a punch in the punching process.
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公开(公告)号：US20180206344A1
公开(公告)日：2018-07-19
申请号：US15867911
申请日：2018-01-11
Applicant: Tyco Electronics (Shanghai) Co. Ltd. , Measurement Specialities (Chengdu) Ltd. , TE Connectivity Corporation
Inventor： Yingcong Deng , Lan Gong , Qian Ying , Dandan Zhang , Lvhai Hu , Yun Liu , Lin Ye , Yong Yan , Roberto Francisco-Yi Lu , Qinglong Zeng
CPC classification number: H05K3/325 , H01R12/515 , H01R43/0256 , H01R43/0263 , H05K1/111 , H05K1/117 , H05K3/301 , H05K3/303 , H05K3/3405 , H05K3/3421 , H05K2201/10227 , H05K2201/10287 , H05K2203/0165 , H05K2203/0278 , H05K2203/167
Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.
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公开(公告)号：US09974162B2
公开(公告)日：2018-05-15
申请号：US15447374
申请日：2017-03-02
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Tsukasa Obinata , Yusuke Karasawa , Hideyuki Tako , Goshi Imai , Suguru Yamato
CPC classification number: H05K1/0266 , G06K19/06028 , H05K1/0269 , H05K1/113 , H05K3/429 , H05K3/4602 , H05K2201/0959 , H05K2201/10227
Abstract: An interconnection substrate having a barcode includes a core layer, an interconnection layer over a first surface of the core layer, an insulating layer to cover the interconnection layer, and one or more additional interconnection layers over the insulating layer, wherein the barcode includes cells arranged at spaced intervals, and a cell pattern is made by forming penetrating holes through the core layer in some of the cells but not in remaining ones of the cells, wherein the penetrating holes are filled with resin, and an end face of the resin is exposed on the same side as the first surface such that the interconnection layer is situated in a surrounding area of the end face but not over the end face, and wherein a number of interconnection layers over the end face is smaller than a number of interconnection layers in the surrounding area of the end face.
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公开(公告)号：US09913375B2
公开(公告)日：2018-03-06
申请号：US15276073
申请日：2016-09-26
Applicant: International Business Machines Corporation
Inventor： Ai Kiar Ang , Michael Lauri
IPC: H01L23/02 , H05K1/11 , H05K1/18 , H05K3/32 , H05K3/34 , H05K1/14 , H01L23/495 , H01L25/10 , H01L25/00 , H01L21/48 , H05K1/03
CPC classification number: H05K1/11 , H01L21/4839 , H01L23/49537 , H01L23/49555 , H01L23/49565 , H01L23/49575 , H01L25/105 , H01L25/50 , H01L2225/1029 , H01L2924/181 , H05K1/0313 , H05K1/144 , H05K1/18 , H05K1/181 , H05K3/328 , H05K3/341 , H05K3/3421 , H05K3/3426 , H05K2201/10015 , H05K2201/10227 , H05K2201/10515 , H05K2201/1053 , H05K2201/10962 , Y02P70/613 , H01L2924/00012
Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
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公开(公告)号：US09844146B2
公开(公告)日：2017-12-12
申请号：US15152218
申请日：2016-05-11
Applicant: Flextronics Automotive GmbH & Co. KG
Inventor： Peter Lutz , Kevin Buermann
CPC classification number: H05K1/189 , H05K3/288 , H05K3/305 , H05K3/328 , H05K2201/05 , H05K2201/0929 , H05K2201/10037 , H05K2201/10227 , H05K2201/1031 , H05K2201/10931 , H05K2203/0278 , H05K2203/04 , H05K2203/16
Abstract: The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.
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