Abstract:
Die Erfindung betrifft ein elektrisch leitfähiges Kontaktelement (1). Das Kontaktelement (1) weist einen Klemm-Abschnitt (3) zum Festhalten und elektrischen Kontaktieren eines Drahtes (8) auf. Das Kontaktelement (1) weist auch einen flach ausgebildeten Lötabschnitt (7) auf, wobei der Lötabschnitt (7) eine Lötfläche (10) aufweist. Die Lötfläche (10) ist ausgebildet, mit einer Leiterplatte (9, 23) mittels Löten elektrisch verbunden zu werden. Das Kontaktelement (1) weist auch einen federnd ausgebildeten Federabschnitt auf (12, 14, 15, 16), welcher den Lötabschnitt (7) mit dem Klemm-Abschnitt (3) verbindet. Erfindungsgemäß ist das Kontaktelement (1) der eingangs genannten Art ausgebildet, auf der Lötfläche (10) selbstständig, insbesondere hilfsmittelfrei, zu stehen. Bevorzugt weist das Kontaktelement (1) einen Schwerpunkt auf, dessen Lotgerade (20) beim Stellen des Kontaktelements (1) auf die Lötfläche (10) durch die Lötfläche (10) verläuft.
Abstract:
Die Erfindung betrifft eine elektrische Schaltungsanordnung, umfassend eine eine elektrische Leiterbahnstruktur tragende Platine (1, 1‘) sowie ein oder mehrere elektrisch leitende und elektrisch leitend mit der Leiterbahnstruktur der Platine verbundene Stanzgitter (2, 2‘). Bei einer solchen elektrischen Schaltungsanordnung, die insbesondere geeignet zum Ausbilden einer Zentralelektrik für ein Kraftfahrzeug ist, ist das technische Problem zu lösen, die elektrischen Verbindungen zwischen einem oder mehreren Stanzgittern und der Platine entsprechend den gewünschten Anforderungen und dabei mit geringem Aufwand und bei einfacher Handhabung herzustellen. Dies gelingt erfindungsgemäss zum einen dadurch, dass das zumindest eine Stanzgitter (2, 2‘) zum elektrischen Verbinden desselben mit einer Leiterbahn der Platine (1, 1‘) über zumindest ein Steckkontaktelement (4, 5, 9) und die Platine (1, 1‘) über ein mit dem zumindest einen Steckkontaktelement (4, 5, 9) des Stanzgitters (2, 2‘) zusammenwirkendes Steckkontaktelement (3, 8)verfügt. Zum anderen gelingt die Lösung erfindungsgemäss auch dadurch, dass sowohl das zumindest eine Stanzgitter als auch die Platine zum elektrischen Verbinden dieser beiden Elemente miteinander über jeweils zumindest ein Steckkontaktelement verfügen und diese Steckkontaktelemente miteinander durch ein elektrisches, mit diesen Steckkontaktelementen zusammenwirkendes Steckverbindungselement verbunden sind.
Abstract:
A highly reliable electronic part module mounted on a motherboard is realized by various means. Specifically, a structure for holding pins is provided to prevent the pins from being bend, the pinsare commonly used to reduce the man-hour of the pin planting process, a build-up layer is exploited to reduce the man-hour of the soldering process, an interlayer connection structure is provided in the layer bonding structure so as to ensure the interlayer connnection, and a socket structure is provided in a conversion board, thus realizing an extremely-simple highly-reliable electronic part module.
Abstract:
An integrated circuit chip package comprising a substrate having first and second mutually parallel sides and a preselected thickness and a space on the first side for the mounting thereon of an electronic component having a body with a flat surface. The substrate further includes at least one elongated thermal conductive member having a head portion adapted to be in contact with the flat surface of the electronic component. The member further has an elongated body portion of a preselected length greater than the thickness of the substrate. The thermal conductive member extends through a preselected hole in the substrate whereby heat may be conducted from the flat surface of the component through the thermal conductive member to the other side of the substrate.
Abstract:
An improved method and construction for positioning a plurality of socket terminals (34) on an electrical circuit board (22) in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material (30, 30a) is provided with a plurality of holes (32, 32a) in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head (50) including an intermediate groove (68) such that the heads extend into the holes (32, 32a) and are adapted for frictional snap engagement with the sheet (30, 30a). The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the boards. Thereafter, the sheet may be removed. The enlarged head (50) of the circuit terminal is provided with leading edge sheet contacting surface (66) to enable the terminals to be push positioned into the holes without injuring the sheet.
Abstract:
[Problem] To provide a printed circuit board in which it is possible to decrease generation of heat in a terminal block mounted on the printed circuit board. [Solution] A printed circuit board (10) comprising: a printed wiring (11); a terminal block (13) configured by folding a solderable plate member having a foot (31); a soldered part (14) for connecting the printed wiring (11) and the terminal block (13) arranged on the printed wiring; and a through-hole (12) provided to the soldered part (14), for insertion of the foot (31); the foot (31) being inserted into the through-hole (12) and connected by soldering; the printed circuit board comprising a solderable metal wire (17) arranged on the soldered part (14) along the terminal block (13); the soldered part (14), the terminal block (13), and the metal wire (17) being integrally soldered during soldering by solder fed through the through-hole (12).
Abstract:
A connector includes a housing (10) and a surface mount contact (20). The surface mount contact (20) includes a cylindrical portion (21) formed in a cylindrical shape, into which only a core wire of an electrical wire is inserted. In an intermediate portion of the cylindrical portion (21), a lance (22) is provided, which bites into the core wire of the electrical wire inserted into the cylindrical portion (21) for connecting to the electrical wire, and stopping removal of the electrical wire. At both ends of the cylindrical portion (21), a pair of the surface mount soldering portions (24, 25) are provided for solder connection to a substrate. Each of the pair of the surface mount soldering portions (24, 25) extends in a direction orthogonal to the axial direction and from an end of the cylindrical portion (21).
Abstract:
A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.
Abstract:
A circuit board(1) which comprises at least one mounting hole(10) for coupling a welding screw is provided At least one notch(100) for filling solder is formed in the inner wall of the mounting hole Thus,defects in filling solder are overcomed with enhanced soldering quality.