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    101.
    发明专利
    失效

    公开(公告)号：JPH05310917A

    公开(公告)日：1993-11-22

    申请号：JP11354292

    申请日：1992-05-06

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： KATAOKA TOSHIYUKI ,  KOGA NOBUSHI ,  OIKAWA HIDEAKI ,  YAMAGUCHI TERUHIRO

    IPC: C08G69/32 ,  C08K7/02 ,  C08L77/00 ,  C08L77/10

    Abstract: PURPOSE:To obtain a composition useful as a member for precision machine, etc., having excellent heat resistance, dimensional stability and mechanical characteristics and improved processability and low water absorption by subjecting a specific diamine and an aromatic dicarboxylic acid to polycondensation in an organic solvent. CONSTITUTION:An aromatic polyamide of formula I (X is

    THERMOSETTING RESIN COMPOSITION
    105.
    发明专利
    THERMOSETTING RESIN COMPOSITION 失效

    公开(公告)号：JPH0411649A

    公开(公告)日：1992-01-16

    申请号：JP33525490

    申请日：1990-11-30

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OBA MASAYUKI ,  TSUBOI HIKOTADA ,  KOGA NOBUSHI

    IPC: C08K5/16 ,  C08F20/52 ,  C08F222/40 ,  C08G59/40 ,  C08G59/56 ,  C08G73/12 ,  C08L33/24 ,  C08L35/00

    Abstract: PURPOSE:To obtain the title compsn. having a low m.p., an increased solubility in an org. solvent, and improved fast curing properties by compounding a specific maleimide compd., an aliph. maleimide having an ether bond, and an amino compd. CONSTITUTION:A maleimide mixture comprising 2-99wt.% maleimide compd. selected from the group consisting of an N-alkenylphenylmaleimide of formula I[wherein R1 to R6 are each H, halogen, (branched) 1-10C alkyl, phenyl, R7O-, formula II or III, OH, or cyanated phenyl; X is H, halogen, COOH, OH, R7O-, formula II or III, or cyano; m1 to m4 are each 0-4 provided that m1+m2+m3=5; and R7 is (branched) 1-5C alkyl or halogenated phenyl], a dimer thereof, and a polymer thereof and 98-1wt.% aliph. maleimide having an ether bond is compounded with an amino compd. in a ratio of the number of maleimide groups in the mixture to the amino groups of the amino compd. (shown by formula IV) of 1 or lower.

    THERMOSETTING RESIN COMPOSITION
    106.
    发明专利
    THERMOSETTING RESIN COMPOSITION 失效

    公开(公告)号：JPS6348334A

    公开(公告)日：1988-03-01

    申请号：JP19056386

    申请日：1986-08-15

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： YAMATANI NORIMASA ,  KOGA NOBUSHI ,  OOTA MASAHIRO ,  YAMAGUCHI TERUHIRO

    IPC: C08G73/12

    Abstract: PURPOSE:To obtain a thermosetting resin composition excellent in heat resistance, impact resistance and flexibility and suitable for use in electronic components, etc., by reacting, by heating, N,N'-4,4'-diphenylmethane-bismaleimide with a specified diamine compound. CONSTITUTION:N,N'-4,4'-Diphenylmethanebismaleimide (A) reprented by formula I is mixed with a diamine compound (B) represented by formula II (wherein R is a group of formula III or IV, X is a direct bond, a 1-10C bivalent hydrocarbon, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl or oxide group), e.g., 4,4'-bis(3-aminophenoxy) biphenyl in a molar ratio of 10:1-1:1.2, and the mixture is reacted by heating to obtain the purpose thermosetting resin composition. Component A can be obtained by condensing 4,4'-diamine- diphenylmethane with maleic anhydride.

    PRODUCTION OF NOVEL POLYAMIDE POLYMER
    107.
    发明专利
    PRODUCTION OF NOVEL POLYAMIDE POLYMER 失效

    公开(公告)号：JPS62292819A

    公开(公告)日：1987-12-19

    申请号：JP13627286

    申请日：1986-06-13

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： BABA KENICHI ,  OSAWA MASANORI ,  JINNO MASAHIRO ,  MIZUTANI KAZUMI ,  YAMATANI NORIMASA ,  KOGA NOBUSHI

    IPC: C08G69/32 ,  C08G18/34 ,  C08G69/40

    Abstract: PURPOSE:To produce the title polymer excellent in heat resistance, heat- insulating property, radiation resistance, hot dimensional stability, moldability, etc., by reacting a specified dicarboxylic acid with a diisocyanate. CONSTITUTION:At most 75mol% dicarboxylic acid or formula I (wherein X is a bivalent aliphatic group, -S-, -O-, -SO2-, -C- or a direct bond and Y is a bivalent aliphatic or aromatic group) and, optionally, terephthalic acid or isophthalic acid of formula II are reacted with a diisocyanate of formula III (wherein R is a bivalent organic group of formula IV or V, R2 is H or methyl, and Z is a bivalent aliphatic group, -S-, -O-, -SO2-, formula IV or a direct bond) at a molar ratio of 0.70-1.30 at 20-250 deg.C for 1-20hr in the presence of a catalyst (e.g., metal alkoxide) in an anhydrous organic polar solvent (e.g., N,N- dimethylacetamide) in an inert gas atmosphere to obtain a polyamide polymer of an initial heat decomposition temperature Td >=360 deg.C and a melt viscosity P at a an initial heat decomposition temperature of minus 80 deg.C.

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