公开(公告)号：JPH08106096A

公开(公告)日：1996-04-23

申请号：JP24311994

申请日：1994-10-06

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TAMAI MASAJI ,  OKAWA YUICHI ,  YAMASHITA WATARU ,  YAMAGUCHI TERUHIRO

IPC: G02F1/1337 ,  C08G73/10

Abstract: PURPOSE: To provide a liquid crystal oriented film with which the seizing can be reduced and a good orientational property of a liquid crystal can be obtained by using a polyamide having a specified structural unit as the major component of the oriented film. CONSTITUTION: This liquid crystal oriented film contains a polyamide having a structural unit represented by the formula as its major component. In this formula, each of X and Y is a hydrogen atom, alkyl group having 1 to 3 carbon atoms, fluorine atom, chlorine atom or trifluoromethyl group and X and Y are the same or different, wherein the position of each of these substituents X and Y may be an ortho or meta position. To improve the adhesion of the oriented film to a substrate, an amino silicone or diamino silicone compound can be added to this oriented film. The oriented film is provided on the substrate by coating the substrate with a 0.1 to 30wt.% polyamide solution that is prepared by dissolving the polyamide in a solvent such as diglyme, butyl cellosolve, ethyl 'Carbitol(R)', etc., through using a coating method such as spraying, printing, etc., to form a coating film.

公开(公告)号：JPH08100122A

公开(公告)日：1996-04-16

申请号：JP18401295

申请日：1995-07-20

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TAKUMA HIROSUKE ,  KIYONO KAZUHIRO ,  MISAWA TSUTAYOSHI ,  TAMAI MASAJI ,  YAMASHITA WATARU

IPC: G02B5/20 ,  C08L79/08 ,  G02B5/22 ,  G02F1/1335

Abstract: PURPOSE: To obtain the subject composition having high heat resistance and excellent transparent colorlessness and useful for an optical filter to effectively cut visible light and near infrared light by compounding a polyimide resin containing perfluoroalkyl groups with a specific coloring matter. CONSTITUTION: This composition is composed of (A) a polyimide resin preferably consisting of a recurring unit of formula I (A is a tetracarboxylic acid residue; B is a diamine residue; X and Y are each a perfluoroalkyl; (l) is an integer of 0-6; (m) is an integer of 0-4: l+m=1-10), e.g. a polyimide resin of formula II and (B) at least one of a coloring matter having an absorption band in a visible region and/or a near infrared region (preferably, a coloring matter selected from anthraquinone pigments, azo pigments, qulnophthalone pigments and phthalocyanine pigments) soluble in the component A. Further, the component B is preferably 1-50wt.% based on the component A. The perfluoroalkyl is preferably trifluoromethyl.

公开(公告)号：JPH0841198A

公开(公告)日：1996-02-13

申请号：JP18221494

申请日：1994-08-03

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TAMAI MASAJI ,  SHIBUYA ATSUSHI ,  YAMAGUCHI TERUHIRO

IPC: C09J179/08 ,  C08G73/10

Abstract: PURPOSE:To obtain a polyimide for a heat-resistant adhesive by reacting adding a specified diaminosiloxane compound to bis (aminophenoxydimethylbenzyl) benzenes and reacting the mixture with a tetracarboxylic acid dianhydride. CONSTITUTION:This polyimide is made by reacting under heating a diamine component containing 0.005-0.1mol of a diaminosiloxane compound of the formula (wherein n is 0-7) per mol of 1,3-and/or 1,4-bis [4-(4-aminophenoxy)-alpha,beta- dimethy]benzyl lbenzens with a tetracarboxylic acid dianhydride component such as pyromellitic acid in the presence of a dicarboxylic acid anhydride and/or a monoamino compound. When this polyimide is used for a heat-resistant adhesive, it is desirable that 0.95-1.05 mol of the diamine mixture is used per mol of the tetracarboxylic acid dianhydride. It is desirable that the acid anhydride and the monoamine both of which are used for termination are phthalic anhydride and an aniline derivative, respectively. When a heat-resistant adhesive solution comprising a solution of the polyimide is applied and dried, sufficient peeling adhesive strength can be attained even at low & temperature and pressure.

公开(公告)号：JPH07189134A

公开(公告)日：1995-07-25

申请号：JP32685693

申请日：1993-12-24

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TAMAI MASAJI ,  KAWASHIMA SABURO ,  OKAWA YUICHI ,  YAMAGUCHI TERUHIRO

IPC: C08G73/10 ,  D06M15/37 ,  D06M15/643 ,  D06M101/00 ,  D06M101/40

Abstract: PURPOSE:To obtain a surface modifier for carbon fiber raising adhesiveness to thermoplastic matrix resins, containing a polyimide produced by reaction between a mixture of a specific biphenyl and a diamino compound and a tetracarboxylic dianhydride. CONSTITUTION:A solution of a surface modifier for carbon fibers containing a polyimide is obtained by reaction under heating in an organic solvent system such as dimethylformamide between a mixture of one mol of 4,4'-bis(3- aminophenoxy)biphenyl and 0.10-0.005mol of a diaminosiloxane compound of the formula (n is 0-7) and a tetracarboxylic dianhydride (e.g. pyromellitic dianhydride, benzophenonetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, diphenyl ether tetracarboxylic dianhydride). Using this solution, the surface of carbon fibers is modified through imidation by heating. The modified carbon fibers obtained raise the adhesiveness to a matrix resin; therefore, by filling such modified carbon fibers in a highly heat-resistant engineering resin, the mechanical strength of this resin can markedly be improved.

公开(公告)号：JPH07166148A

公开(公告)日：1995-06-27

申请号：JP31779893

申请日：1993-12-17

Applicant: MITSUI TOATSU CHEMICALS

Inventor： YAMASHITA WATARU ,  OKAWA YUICHI ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

IPC: C08G73/10 ,  C09J5/06 ,  C09J179/08

Abstract: PURPOSE:To conduct a bonding for high-performance materials such as aerospace equipment requiring heat resistance and mechanical strength, by coating an adhesive surface with a solution containing solvent-soluble, thermoplastic polyimide(s) followed by desolvation. CONSTITUTION:This bonding is carried out by desolvation after coating an adhesive surface with a solution containing thermoplastic polyimide(s) (mixture) of formula I [(m) and (n) are each 0 or 1; R is of formula II (R1-R4 are each H, a halogen, an 1-8C alkyl, an aryl, etc.), etc.; Ar is a 6-27C monocyclic or condensed polycyclic aromatic group, etc.] soluble to such solvents as halohydrocarbon solvents like dichloromethane, amide solvents like DMF and phenolic solvents. The terminals of this polyimide may have essentially no substituents or may be aromatic rings substituted with group(s) inert to amines or dicarboxylic anhydrides.

公开(公告)号：JPH07118526A

公开(公告)日：1995-05-09

申请号：JP26203693

申请日：1993-10-20

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TAMAI MASAJI ,  YAMASHITA WATARU ,  IIYAMA KATSUAKI ,  KOGA NOBUSHI ,  YAMAGUCHI TERUHIRO

IPC: C08K7/02 ,  C08L79/08

Abstract: PURPOSE:To obtain a polyimide resin compsn. which is melt moldable, e.g. injection moldable, and excellent in fatigue properties by compounding a polyimide resin with another polyimide resin and a fibrous filler such as a carbon fiber, and to obtain an injection molded article from the compsn. CONSTITUTION:A polyimide resin compsn. comprises 100 pts.wt. polyimide resin having repeating structural units of formula I (X is a direct bond, isopropylidene, hexafluoroisopropylidene, carbonyl, thio, or sulfonyl; and R is a tetravalent group of formula II), 3-45 pts.wt. polyimide resin having repeating structural units of formula III and a logarithmic viscosity of 0.7dl/g or higher, and 5-65 pts.wt. at least one fibrous filler selected from the group consisting of a carbon fiber, a glass fiber, an aramid fiber, and a potassium titanate fiber. The former polyimide resin is obtd. by reacting a specific diamine [e.g. 4,4'-bis(3-aminophenoxy)biphenyl] with at least one tetracarboxylic dianhydride.

公开(公告)号：JPH0774443A

公开(公告)日：1995-03-17

申请号：JP15458794

申请日：1994-07-06

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OTA MASAHIRO ,  KAWASHIMA SABURO ,  SONOBE YOSHIO ,  TAMAI MASAJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI TERUHIRO

IPC: C08G73/10 ,  B32B15/08 ,  B32B15/088 ,  C09J179/08 ,  H05K1/00 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38

Abstract: PURPOSE:To prevent lowering of binding force with a copper foil at a high temperature by directly jointing a film of polyimide able flowable at a high temperature and constituting of a repeating unit expressed by a specific formula with the copper foil with no adhesive agent. CONSTITUTION:A film of polyimide flowable at a high temperature and consisting of a repeating unit expressed by a formula is directly jointed with a copper foil with no adhesive agent. Here, in the formula, R expresses a radical of quadrivalence selected from a group consisting of a fat group radical, a ring fat group radical, a monocyclic aromatic group radical, a contraction polycyclic aromatic radical and a non-condensation polycyclic aromatic radical where aromatic radicals are directly or by a cross-linking member each other linked. Further, X expresses a formula II. That is, flowable polyimide obtained from a special diamine and acid dianhyaride is excellent in heat resistance and has a strong in binding force at a high temperature with a copper foil.

公开(公告)号：JPH0678487B2

公开(公告)日：1994-10-05

申请号：JP14686987

申请日：1987-06-15

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OOTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI MASAJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI TERUHIRO

IPC: C08L79/08 ,  C08L81/02

公开(公告)号：JPH069936A

公开(公告)日：1994-01-18

申请号：JP10436993

申请日：1993-04-30

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OTA MASAHIRO ,  KAWASHIMA SABURO ,  SONOBE YOSHIO ,  TAMAI MASAJI ,  YAMAGUCHI TERUHIRO

IPC: C08G73/10 ,  C09J179/08

Abstract: PURPOSE:To provide a heat-resistant adhesive which is prepd. from a polymer having a specified molecular structure and has a high adhesive strength and such a high heat resistance that the adhesive strength during and after the use at a high temp. is kept undegraded. CONSTITUTION:A heat-resistant adhesive is prepd. from a polymer comprising repeating units of formula I and repeating units of formula II. In formulas I and II, Z1 and Z2 are each independently a group of formula III wherein R is a tetravalent group selected from the group consisting of a 2C or higher aliph. group, an alicyclic group, a monocyclic arom. group, a condensed polycyclic arom. group, and a noncondensed polycyclic arom. group comprising arom. groups combined to each other directly or through a crosslinking member. In formula II, Y is a group selected from the group consisting of a divalent hydrocarbon, hexafluoroisopropylidene, carbonyl, thio, sulfinyl, sulfonyl, and oxide groups.

公开(公告)号：JPH0530851B2

公开(公告)日：1993-05-11

申请号：JP2693686

申请日：1986-02-12

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OIKAWA HIDEAKI ,  OOTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI MASAJI ,  SONOBE YOSHIO ,  YAMAGUCHI TERUHIRO

IPC: C08G73/00 ,  C08G73/10 ,  C09J5/06 ,  C09J179/08