公开(公告)号：US20160379931A1

公开(公告)日：2016-12-29

申请号：US15257921

申请日：2016-09-07

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Ling Lin ,  Chih-Sen Huang ,  Ching-Wen Hung ,  Jia-Rong Wu ,  Tsung-Hung Chang ,  Yi-Hui Lee ,  Yi-Wei Chen

IPC: H01L23/528 ,  H01L21/8234 ,  H01L27/06 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L23/5283 ,  H01L21/76816 ,  H01L21/76829 ,  H01L21/76832 ,  H01L21/76897 ,  H01L21/823475 ,  H01L23/53261 ,  H01L23/53266 ,  H01L27/0629

Abstract: A method for fabricating semiconductor device is disclosed. First, a substrate is provided, in which the substrate includes a first metal gate and a second metal gate thereon, a first hard mask on the first metal gate and a second hard mask on the second metal gate, and a first interlayer dielectric (ILD) layer around the first metal gate and the second metal gate. Next, the first hard mask and the second hard mask are used as mask to remove part of the first ILD layer for forming a recess, and a patterned metal layer is formed in the recess, in which the top surface of the patterned metal layer is lower than the top surfaces of the first hard mask and the second hard mask.

Abstract translation: 公开了半导体器件的制造方法。 首先，提供基板，其中基板包括第一金属栅极和第二金属栅极，第一金属栅极上的第一硬掩模和第二金属栅极上的第二硬掩模，以及第一层间电介质（ILD ）层围绕第一金属栅极和第二金属栅极。 接下来，将第一硬掩模和第二硬掩模用作掩模以去除用于形成凹部的第一ILD层的一部分，并且在凹部中形成图案化金属层，其中图案化金属层的顶表面为 低于第一硬掩模和第二硬掩模的顶表面。

公开(公告)号：US09530778B1

公开(公告)日：2016-12-27

申请号：US14834439

申请日：2015-08-25

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chao-Hung Lin ,  Chih-Kai Hsu ,  Li-Wei Feng ,  Shih-Hung Tsai ,  Chien-Ting Lin ,  Jyh-Shyang Jenq ,  Ching-Wen Hung ,  Jia-Rong Wu ,  Yi-Hui Lee ,  Ying-Cheng Liu ,  Yi-Kuan Wu ,  Chih-Sen Huang ,  Yi-Wei Chen

IPC: H01L21/00 ,  H01L27/092 ,  H01L29/51 ,  H01L21/8238

CPC classification number: H01L21/823842 ,  H01L21/28088 ,  H01L27/092 ,  H01L27/0922 ,  H01L29/511 ,  H01L29/517

Abstract: Semiconductor devices having metal gate include a substrate, a first nFET device formed thereon, and a second nFET device formed thereon. The first nFET device includes a first n-metal gate, and the first n-metal gate includes a third bottom barrier metal layer and an n type work function metal layer. The n type work function metal layer directly contacts the third bottom barrier layer. The second nFET device includes a second n-metal gate and the second n-metal gate includes a second bottom barrier metal layer, the n type work function metal layer, and a third p type work function metal layer sandwiched between the second bottom barrier metal layer and the n type work function metal layer. The third p type work function metal layer of the second nFET device and the third bottom barrier metal layer of the first nFET device include a same material.

Abstract translation: 具有金属栅极的半导体器件包括衬底，其上形成的第一nFET器件和形成在其上的第二nFET器件。 第一nFET器件包括第一n型金属栅极，并且第一n型金属栅极包括第三底部阻挡金属层和n型功函数金属层。 n型功函数金属层直接接触第三底层阻挡层。 第二nFET器件包括第二n型金属栅极，第二n型金属栅极包括第二底部阻挡金属层，n型功函数金属层和夹在第二底部阻挡金属之间的第三p型功函数金属层 层和n型功函数金属层。 第二nFET器件的第三p型功函数金属层和第一nFET器件的第三底阻挡金属层包括相同的材料。

公开(公告)号：US20160315171A1

公开(公告)日：2016-10-27

申请号：US14727853

申请日：2015-06-01

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yu-Hsiang Hung ,  Chao-Hung Lin ,  Chih-Kai Hsu ,  Ssu-I Fu ,  Jyh-Shyang Jenq ,  Jun-Jie Wang ,  En-Chiuan Liou ,  Chih-Wei Yang ,  Chih-Sen Huang ,  Ching-Wen Hung ,  Hung-Chan Lin ,  Yu-Hsiang Lin

IPC: H01L29/66 ,  H01L29/49 ,  H01L29/423 ,  H01L21/28

CPC classification number: H01L29/66545 ,  H01L21/28088 ,  H01L21/28114 ,  H01L21/823842 ,  H01L27/092 ,  H01L29/42376 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/6653

Abstract: A method for manufacturing a semiconductor device having a metal gate includes forming a filling layer and a high-K gate dielectric layer in the first recess between a pair of spacers, wherein the high-K gate dielectric layer and the filling layer are stacked in the first recess sequentially, and an exposed top surface of the high-K gate dielectric layer and a top surface of the filling layer are lower than a top surface of each spacer; and removing a part of each spacer and widening the first recess on the top surface of the filling layer to form a second recess, wherein a width of the second recess is larger than a width of the first recess.

Abstract translation: 一种具有金属栅极的半导体器件的制造方法包括在一对间隔物之间​​的第一凹部中形成填充层和高K栅极电介质层，其中高K栅极介电层和填充层堆叠在 第一凹部，高K栅极电介质层的露出顶表面和填充层的顶表面比每个间隔物的顶表面低; 并且移除每个间隔物的一部分并加宽填充层的顶表面上的第一凹部以形成第二凹部，其中第二凹部的宽度大于第一凹部的宽度。

公开(公告)号：US09466521B2

公开(公告)日：2016-10-11

申请号：US14494607

申请日：2014-09-24

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Ling Lin ,  Chih-Sen Huang ,  Ching-Wen Hung ,  Jia-Rong Wu ,  Tsung-Hung Chang ,  Yi-Hui Lee ,  Yi-Wei Chen

IPC: H01L21/70 ,  H01L21/768

CPC classification number: H01L23/5283 ,  H01L21/76816 ,  H01L21/76829 ,  H01L21/76832 ,  H01L21/76897 ,  H01L21/823475 ,  H01L23/53261 ,  H01L23/53266 ,  H01L27/0629

Abstract: A semiconductor device is disclosed. The semiconductor device includes: a substrate; a first metal gate on the substrate; a first hard mask on the first metal gate; an interlayer dielectric (ILD) layer on top of and around the first metal gate; and a patterned metal layer embedded in the ILD layer, in which the top surface of the patterned metal layer is lower than the top surface of the first hard mask.

Abstract translation: 公开了一种半导体器件。 半导体器件包括：衬底; 基板上的第一金属栅极; 第一个金属门上的第一个硬掩模; 在第一金属栅极的顶部和周围的层间绝缘层（ILD）层; 以及嵌入ILD层中的图案化金属层，其中图案化金属层的顶表面比第一硬掩模的顶表面低。

公开(公告)号：US09455227B1

公开(公告)日：2016-09-27

申请号：US14935456

申请日：2015-11-09

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung ,  Jia-Rong Wu ,  Yi-Hui Lee ,  Ying-Cheng Liu ,  Chih-Sen Huang ,  Chun-Hsien Lin

IPC: H01L29/94 ,  H01L23/535 ,  H01L29/66 ,  H01L21/768 ,  H01L21/28 ,  H01L29/06 ,  H01L29/78

CPC classification number: H01L21/28123 ,  H01L21/28088 ,  H01L21/28518 ,  H01L21/76805 ,  H01L21/76834 ,  H01L21/76837 ,  H01L21/76843 ,  H01L21/76855 ,  H01L21/76883 ,  H01L21/76895 ,  H01L21/76897 ,  H01L29/0653 ,  H01L29/4966 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/7851

Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming a first gate structure on the substrate; forming a first contact plug adjacent to the first gate structure; and performing a replacement metal gate (RMG) process to transform the first gate structure into metal gate.

Abstract translation: 公开了半导体器件的制造方法。 该方法包括以下步骤：提供衬底; 在所述基板上形成第一栅极结构; 形成与所述第一栅极结构相邻的第一接触插塞; 并执行替换金属栅极（RMG）处理，以将第一栅极结构转换成金属栅极。

公开(公告)号：US20160240540A1

公开(公告)日：2016-08-18

申请号：US14620212

申请日：2015-02-12

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung ,  Jia-Rong Wu ,  Yi-Hui Lee ,  Chih-Sen Huang ,  Yi-Wei Chen

IPC: H01L27/11 ,  H01L29/06 ,  H01L23/535 ,  H01L29/78

CPC classification number: H01L27/1104 ,  H01L21/823821 ,  H01L21/845 ,  H01L27/0924 ,  H01L27/1211 ,  H01L27/3223 ,  H01L29/0649 ,  H01L29/66545

Abstract: A semiconductor structure is provided, including a substrate, a plurality of first semiconductor devices, a plurality of second semiconductor devices, and a plurality of dummy slot contacts. The substrate has a device region, wherein the device region includes a first functional region and a second functional region, and a dummy region is disposed therebetween. The first semiconductor devices and a plurality of first slot contacts are disposed in the first functional region. The second semiconductor devices and a plurality of second slot contacts are disposed in the second functional region. The dummy slot contacts are disposed in the dummy region.

Abstract translation: 提供一种半导体结构，包括基板，多个第一半导体器件，多个第二半导体器件和多个虚拟插槽触点。 衬底具有器件区域，其中器件区域包括第一功能区域和第二功能区域，并且虚设区域设置在其间。 第一半导体器件和多个第一时隙触点设置在第一功能区域中。 第二半导体器件和多个第二槽触点设置在第二功能区域中。 虚拟插槽触点设置在虚拟区域中。

公开(公告)号：US09401358B1

公开(公告)日：2016-07-26

申请号：US14611843

申请日：2015-02-02

Applicant: United Microelectronics Corp.

Inventor： Ching-Wen Hung ,  Chih-Sen Huang ,  Yi-Wei Chen

IPC: H01L29/00 ,  H01L27/08 ,  H01L27/06

CPC classification number: H01L27/0802 ,  H01L27/0629 ,  H01L27/0647 ,  H01L28/20

Abstract: A semiconductor device structure having at least one thin-film resistor structure is provided. Through the metal plug(s) or metal wirings located on different layers, a plurality of stripe segments of the thin-film resistor structure is electrically connected to ensure the thin-film resistor structure with the predetermined resistance and less averting areas in the layout design.

Abstract translation: 提供具有至少一个薄膜电阻器结构的半导体器件结构。 通过位于不同层上的金属插头或金属布线，薄膜电阻器结构的多个条形段电连接，以确保具有预定电阻的薄膜电阻器结构和布局设计中较少的避免区域 。

公开(公告)号：US09349639B2

公开(公告)日：2016-05-24

申请号：US14510100

申请日：2014-10-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung ,  Chih-Sen Huang

IPC: H01L21/44 ,  H01L21/768

CPC classification number: H01L23/485 ,  H01L21/76897 ,  H01L27/1104 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for manufacturing contact structure includes the steps of: providing a substrate having the semiconductor device and an interlayer dielectric thereon, wherein the semiconductor device includes a gate structure and a source/drain region; forming a patterned mask layer with a stripe hole on the substrate, and concurrently forming a stripe-shaped mask layer on the substrate; forming a patterned photoresist layer with a plurality of slot holes on the substrate, wherein at least one of the slot holes is disposed right above the source/drain region; and forming a contact hole in the interlayer dielectric by using the patterned mask layer, the stripe-shaped mask layer and the patterned photoresist layer as an etch mask, and the source/drain region is exposed from the bottom of the contact hole when the step of forming the contact hole is completed.

Abstract translation: 制造接触结构的方法包括以下步骤：提供其上具有半导体器件和层间电介质的衬底，其中所述半导体器件包括栅极结构和源极/漏极区; 在基板上形成具有条纹孔的图案化掩模层，并且在基板上同时形成条形掩模层; 在所述基板上形成具有多个槽孔的图案化光致抗蚀剂层，其中所述槽孔中的至少一个设置在所述源极/漏极区域正上方; 并且通过使用图案化掩模层，条形掩模层和图案化光致抗蚀剂层作为蚀刻掩模在层间电介质中形成接触孔，并且当步骤 形成接触孔。

公开(公告)号：US20160104646A1

公开(公告)日：2016-04-14

申请号：US14514374

申请日：2014-10-14

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Wen Hung ,  Tsung-Hung Chang ,  Jia-Rong Wu ,  Ching-Ling Lin ,  Yi-Hui Lee ,  Chih-Sen Huang ,  Yi-Wei Chen

IPC: H01L21/8234 ,  H01L21/311 ,  H01L21/285 ,  H01L21/768

CPC classification number: H01L21/823475 ,  H01L21/31144 ,  H01L21/76816 ,  H01L21/76897 ,  H01L21/823431

Abstract: A manufacturing method for forming a semiconductor device includes: first, a substrate is provided, a fin structure is formed on the substrate, and a plurality of gate structures are formed on the fin structure, next, a hard mask layer and a first photoresist layer are formed on the fin structure, an first etching process is then performed on the first photoresist layer, afterwards, a plurality of patterned photoresist layers are formed on the remaining first photoresist layer and the remaining hard mask layer, where each patterned photoresist layer is disposed right above each gate structure, and the width of each patterned photoresist is larger than the width of each gate structure, and the patterned photoresist layer is used as a hard mask to perform an second etching process to form a plurality of second trenches.

Abstract translation: 一种半导体器件的制造方法，其特征在于，首先，在基板上形成有基板，在所述散热片结构上形成有多个栅极结构，然后将硬掩模层和第一光致抗蚀剂层 形成在鳍结构上，然后在第一光致抗蚀剂层上进行第一蚀刻工艺，然后在剩余的第一光致抗蚀剂层和剩余的硬掩模层上形成多个图案化的光致抗蚀剂层，其中每个图案化的光致抗蚀剂层被设置 每个栅极结构的正上方，并且每个图案化的光致抗蚀剂的宽度大于每个栅极结构的宽度，并且图案化的光致抗蚀剂层用作硬掩模以执行第二蚀刻工艺以形成多个第二沟槽。

公开(公告)号：US09306032B2

公开(公告)日：2016-04-05

申请号：US14062909

申请日：2013-10-25

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Ling Lin ,  Chih-Sen Huang ,  Po-Chao Tsao ,  Ching-Wen Hung ,  Jia-Rong Wu ,  Chien-Ting Lin

IPC: H01L21/3205 ,  H01L29/66

CPC classification number: H01L29/66477 ,  H01L21/28247 ,  H01L21/76834 ,  H01L21/76897 ,  H01L29/66545 ,  H01L29/66628 ,  H01L29/7848

Abstract: A method for manufacturing a semiconductor device includes following steps. A substrate having at least a transistor embedded in an insulating material formed thereon is provided. The transistor includes a metal gate. Next, an etching process is performed to remove a portion of the metal gate to form a recess and to remove a portion of the insulating material to form a tapered part. After forming the recess and the tapered part of the insulating material, a hard mask layer is formed on the substrate to fill up the recess. Subsequently, the hard mask layer is planarized.

Abstract translation: 一种制造半导体器件的方法包括以下步骤。 提供了至少具有嵌入在其上形成绝缘材料的晶体管的衬底。 晶体管包括金属栅极。 接下来，进行蚀刻处理以去除金属栅极的一部分以形成凹部并且去除绝缘材料的一部分以形成锥形部分。 在形成凹部和绝缘材料的锥形部分之后，在基板上形成硬掩模层以填充凹部。 随后，硬掩模层被平坦化。