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公开(公告)号：EP1915888A2
公开(公告)日：2008-04-30
申请号：EP06844135.1
申请日：2006-06-05
Applicant: MOLECULAR IMPRINTS, INC.
Inventor： XU, Frank, Y.
IPC: H05B6/68
CPC classification number: B32B37/14 , B32B38/06 , B81C1/0046 , B81C2201/0153 , B82Y10/00 , B82Y40/00 , C08L59/00 , C09J5/00 , C09J2205/31 , C09J2451/00 , G03F7/0002 , Y10T156/10
Abstract: The present invention provides a method adhering a layer to a substrate that features defining first and second interfaces by having a composition present between the layer and the substrate that forms covalent bonds to the layer and adheres to the substrate employing one or more of covalent bonds, ionic bonds and Van der Waals forces. In this manner, the strength of the adhering force of the layer to the composition is assured to be stronger than the adhering force of the layer to the composition formed from a predetermined adhering mechanism, i.e., an adhering mechanism that does not include covalent bonding. Additionally, the present invention is directed to a composition of adhering together first and second materials. The composition features a multi-functional reactive compound that includes a backbone group and first and second functional groups; a cross-linker, and a catalyst. The first functional group is responsive to a first actinic energy to form cross-linked molecules and to adhere a subset of the cross-linked molecules to the first material. The second functional group is responsive to a second actinic energy, differing from the first actinic energy to adhere to the second material.
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102.发明公开Site-selectively modified micro-and nanostructures and the methods of their fabrication 审中-公开Verfahren zur Herstellung von stellenselektivgeändertenMikro- und Nanostrukturen
公开(公告)号：EP1820773A2
公开(公告)日：2007-08-22
申请号：EP07001038.4
申请日：2007-01-18
Applicant: HITACHI, LTD.
Inventor： Murao, Kenji, c/o Hitachi Ltd. Intell. Prop. Group , Kuwabara, Kosuke, c/o Hitachi Ltd. Intell. Prop. G , Ogino, Masahiko, c/o Hitachi Ltd. intell. prop. Gr
IPC: B81C1/00
CPC classification number: B81C1/0046 , B29C43/021 , B29C2043/025 , B81B2201/0214 , B81B2203/0361 , B81C2201/0153 , B82Y10/00 , B82Y15/00 , B82Y40/00 , G03F7/0002
Abstract: It is an object of the present invention to provide a method which can easily and selectively modify specific sites on indentations or protrusions of indentation/protrusion structures fabricated by nanoimprinting. Pressing a mold having indentation/protrusion structures onto a polymer substrate comprising at least two layers of different chemical composition exposes the second layer, which has been covered by the outermost layer, in pillars formed as a result of the pressing. Site-specific chemical modification of the pillars can be achieved by formulating a desired chemical composition for the second layer beforehand, or by chemical modification of the exposed second layer cross-sections in the pillars.
Abstract translation: 本发明的目的是提供一种可以容易且有选择地修改通过纳米压印制造的压痕/突出结构的凹陷或突起上的特定部位的方法。 将具有凹陷/突起结构的模具压到包含至少两层不同化学组成的聚合物基材上，将由最外层覆盖的第二层暴露在由压制形成的柱中。 可以通过预先为第二层配制所需的化学组合物，或通过化学修饰柱中暴露的第二层横截面来实现柱的特定位点的化学修饰。
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公开(公告)号：US11878299B2
公开(公告)日：2024-01-23
申请号：US17169181
申请日：2021-02-05
Applicant: Illumina, Inc.
Inventor： Hui Han , Dajun Yuan , M. Shane Bowen
IPC: B01L3/00 , B29C65/16 , B29C65/14 , H01J37/32 , G03F7/038 , G03F7/00 , B81C1/00 , B32B17/10 , B32B17/06 , G03F7/30 , G03F7/16 , G03F7/20
CPC classification number: B01L3/502707 , B29C65/1406 , B29C65/1612 , B32B17/06 , B32B17/10 , B81C1/0038 , G03F7/0002 , G03F7/038 , H01J37/32009 , B01L2200/12 , B01L2300/0816 , B01L2300/0877 , B01L2300/0887 , B01L2300/0896 , B81C2201/0153 , G03F7/16 , G03F7/2002 , G03F7/30 , H01J2237/3341
Abstract: Imprinted substrates are often used to produce miniaturized devices for use in electrical, optic and biochemical applications. Imprinting techniques, such as nanoimprinting lithography, may leave residues in the surface of substrates that affect bonding and decrease the quality of the produced devices. An imprinted substrate with residue-free region, or regions with a reduced amount of residue for improved bonding quality is introduced. Methods to produce imprinted substrates without residues from the imprinting process are also introduced. Methods include physical exclusion methods, selective etching methods and energy application methods. These methods may produce residue-free regions in the surface of the substrate that can be used to produce higher strength bonding.
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公开(公告)号：US20180318868A1
公开(公告)日：2018-11-08
申请号：US15964548
申请日：2018-04-27
Applicant: CANON KABUSHIKI KAISHA
Inventor： Ken Katsuta
CPC classification number: B05C11/10 , B05D1/26 , B41J2/015 , B41J2/04508 , B41J2/0456 , B41J2/04581 , B81C1/00436 , B81C2201/0153
Abstract: An imprint apparatus, comprises: a discharge unit that discharges a liquid onto a substrate; a storage unit that stores a plurality of discharge conditions for the discharge unit; and a control unit that controls the discharge unit based on a discharge condition that is stored in the storage unit, wherein the control unit selects the discharge condition from the plurality of discharge conditions in accordance with a discharge spacing for discharging the liquid.
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公开(公告)号：US20180311877A1
公开(公告)日：2018-11-01
申请号：US15772042
申请日：2016-10-27
Inventor： Mohamed Sultan Mohiddin SAIFULLAH , Siew Ling Karen CHONG , Yee Chong LOKE , Alvin CHENG , Nicholas LEONG
CPC classification number: B29C45/37 , B81C99/009 , B81C2201/0153 , B82Y40/00 , C23C14/14 , C23C14/34 , C25D1/10 , G03F7/0002
Abstract: An injection mold insert with hierarchical structures and a method for method of making such injection mold inserts are provided. The method includes imprinting a primary imprint structure on an article and imprinting a secondary imprint structure on the primary imprint structure on the article. The secondary imprint structure includes a plurality of shapes, each of the plurality of shapes being substantially smaller than shapes of the primary imprint structure. The method further includes bonding the article to a substrate, sputter-coating the article with a metal film as an electroforming seed layer, and electroforming the injection mold insert over the article. Finally, the method includes dissolving the article to define the injection mold insert having a negative replica of the primary and secondary imprint structures.
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Patent Agency Ranking
公开(公告)号：US20170363954A1
公开(公告)日：2017-12-21
申请号：US15538526
申请日：2015-12-22
Inventor： Stephan LANDIS , Nicolas POSSEME , Lamia NOURI
CPC classification number: H01L21/266 , B81C1/00103 , B81C1/0046 , B81C1/00587 , B81C2201/0136 , B81C2201/0153 , B82Y10/00 , B82Y40/00 , C23C14/042 , C23C14/48 , G03F7/0002 , H01L21/30604 , H01L21/30608 , H01L21/3065 , H01L21/3086 , H01L21/31111 , H01L21/31144 , H01L31/02363 , H01L31/0392 , H01L31/1852 , H01L33/007 , H01L33/20 , H01L33/22 , Y02E10/50
Abstract: The invention relates in particular to a method for producing subsequent patterns in an underlying layer (120), the method comprising at least one step of producing prior patterns in a carbon imprintable layer (110) on top of the underlying layer (120), the production of the prior patterns involving nanoimprinting of the imprintable layer (110) and leave in place a continuous layer formed by the imprintable layer (110) and covering the underlying layer (120), characterized in that it comprises the following step: at least one step of modifying the underlying layer (120) via ion implantation (421) in the underlying layer (120), the implantation (421) being carried out through the imprintable layer (110) comprising the subsequent patterns, the parameters of the implantation (421) being chosen in such a way as to form, in the underlying layer (120), implanted zones (122) and non-implanted zones, the non-implanted zones defining the subsequent patterns and having a geometry that is dependent on the prior patterns.
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公开(公告)号：US09777079B2
公开(公告)日：2017-10-03
申请号：US15035897
申请日：2014-12-17
Applicant: DIC Corporation
Inventor： Takeshi Ibe , Makoto Yada
IPC: B29C59/02 , C08F12/36 , H01L21/311 , C08F12/34 , C08F257/00 , C08K5/00 , C08L101/02 , C08F12/32 , C09D125/16 , G03F7/00
CPC classification number: C08F12/36 , B29C59/026 , B81C2201/0153 , C08F12/32 , C08F12/34 , C08F257/00 , C08K5/00 , C08L101/02 , C09D125/16 , G03F7/0002 , H01L21/31144
Abstract: Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.
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公开(公告)号：US09718674B2
公开(公告)日：2017-08-01
申请号：US14914015
申请日：2014-08-26
Applicant: SILEX MICROSYSTEMS AB
Inventor： Edvard Kalvesten , Thorbjorn Ebefors , Niklas Svedin
CPC classification number: B81B7/007 , B81B2201/01 , B81B2201/0264 , B81B2201/0271 , B81B2203/0118 , B81B2203/0127 , B81B2207/095 , B81C1/00301 , B81C2201/0153 , B81C2201/036 , B81C2203/0109 , B81C2203/0145 , H01L21/50 , H01L23/08 , H01L24/94 , H01L2924/16235
Abstract: A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702). It also includes spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via the spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) includes vias (710) including metal for providing electrical connection through the capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.
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公开(公告)号：US20140034229A1
公开(公告)日：2014-02-06
申请号：US14048745
申请日：2013-10-08
Applicant: Molecular Imprints, Inc.
Inventor： Frank Y. Xu
IPC: B32B37/14
CPC classification number: B32B37/14 , B32B38/06 , B81C1/0046 , B81C2201/0153 , B82Y10/00 , B82Y40/00 , C08L59/00 , C09J5/00 , C09J2205/31 , C09J2451/00 , G03F7/0002 , Y10T156/10
Abstract: The present invention provides a method for adhering a layer to a substrate that features defining first and second interfaces by having a composition present between the layer and the substrate that forms covalent bonds to the layer and adheres to the substrate employing one or more of covalent bonds, ionic bonds and Van der Waals forces. In this manner, the strength of the adhering force of the layer to the composition is assured to be stronger than the adhering force of the layer to the composition formed from a predetermined adhering mechanism, i.e., an adhering mechanism that does not include covalent bonding.
Abstract translation: 本发明提供了一种通过使层与衬底之间存在的组合物与层形成共价键并且使用一种或多种共价键粘合到衬底上而将层粘合到基底上的特征，其特征在于限定第一和第二界面 ，离子键和范德华力。 以这种方式，确保层对组合物的粘附力的强度比由预定粘合机构即不包括共价键的粘合机构形成的组合物的层的粘合力更强。
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公开(公告)号：US08557351B2
公开(公告)日：2013-10-15
申请号：US11187407
申请日：2005-07-22
Applicant: Frank Y. Xu
Inventor： Frank Y. Xu
CPC classification number: B32B37/14 , B32B38/06 , B81C1/0046 , B81C2201/0153 , B82Y10/00 , B82Y40/00 , C08L59/00 , C09J5/00 , C09J2205/31 , C09J2451/00 , G03F7/0002 , Y10T156/10
Abstract: The present invention provides a method adhering a layer to a substrate that features defining first and second interfaces by having a composition present between the layer and the substrate that forms covalent bonds to the layer and adheres to the substrate employing one or more of covalent bonds, ionic bonds and Van der Waals forces. In this manner, the strength of the adhering force of the layer to the composition is assured to be stronger than the adhering force of the layer to the composition formed from a predetermined adhering mechanism, i.e., an adhering mechanism that does not include covalent bonding.
Abstract translation: 本发明提供了一种通过使层与衬底之间存在的组合物与层形成共价键并且使用一种或多种共价键粘合到衬底上而将层粘附到基底上的方法，其特征在于限定第一和第二界面， 离子键和范德华力。 以这种方式，确保层对组合物的粘附力的强度比由预定粘合机构即不包括共价键的粘合机构形成的组合物的层的粘合力更强。
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