公开(公告)号：US11774283B2

公开(公告)日：2023-10-03

申请号：US16963303

申请日：2019-01-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi Baba ,  Tatsuya Hashi ,  Yoshihito Suzuki ,  Kenji Makino ,  Shigeyuki Nakamura

IPC: G01J1/44 ,  G01S7/4863 ,  G01S7/4865 ,  G01S17/894

CPC classification number: G01J1/44 ,  G01S7/4863 ,  G01S7/4865 ,  G01J2001/448 ,  G01J2001/4466 ,  G01S17/894

Abstract: A photodetector device includes an avalanche photodiode array substrate. A circuit substrate includes time measurement circuits and a clock driver. Each of the time measurement circuit includes a delay line unit, and is arranged to acquire, from an operation result of a delay line, time information indicating timing at which a pulse signal is input from a corresponding avalanche photodiode. The delay line unit is arranged to initiate an operation of the delay line in response to input of the pulse signal to the time measurement circuit, and to stop the operation of the delay line in response to input of a clock signal from a clock driver to the time measurement circuit, and is arranged to detect a time interval shorter than a cycle of the clock signal by the operation of the delay line.

公开(公告)号：US20230268928A1

公开(公告)日：2023-08-24

申请号：US18112056

申请日：2023-02-21

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Alps) SAS

Inventor： Nicolas MOENECLAEY ,  Laurent VACCARIELLO

IPC: H03M1/38 ,  G01J1/44 ,  G01J1/42 ,  H01L27/144

CPC classification number: H03M1/38 ,  G01J1/44 ,  G01J1/4204 ,  H01L27/1446 ,  H01L27/1443 ,  G01J2001/448 ,  G01J2001/446

Abstract: An ambient light sensor includes pixels arranged in an array. Each pixel includes a doped insulated well of a first type, a pinned photodiode in the well, a doped region of a second type arranged in the well, a transfer gate coupling the photodiode to said region, and a first circuit applying a first or second potential to the well. A successive approximation analog-to-digital converter of the sensor has a node connected to the doped regions of the pixels, a switch applying a third potential to the node, a comparator coupled to the node, and a second circuit receiving an output of the comparator and controlling the first circuits to selectively apply the first and second potentials. A sensor control circuit controls the gates and the first switch.

公开(公告)号：US11714000B2

公开(公告)日：2023-08-01

申请号：US16985940

申请日：2020-08-05

Applicant: CANON KABUSHIKI KAISHA

Inventor： Kento Iimori ,  Noriyuki Kaifu

IPC: G01J1/44 ,  G01N22/00

CPC classification number: G01J1/44 ,  G01N22/00 ,  G01J2001/448

Abstract: A detection device with pixels arranged in N rows and M columns where N and M are each an integer of one or more, each of the pixels including: a detector configured to detect an electromagnetic wave; a first capacitor connected to the detector; a first switch and a second switch each connected to a terminal of the first capacitor opposite to the detector; and a second capacitor connected to a terminal of the second switch opposite to the first capacitor, wherein each of a terminal of the first switch opposite to the first capacitor and a terminal of the second capacitor opposite to the second switch is connected to a reference potential, and wherein an integration operation of turning ON/OFF the first switch and then turning ON/OFF the second switch while maintaining the first switch in an OFF state is repeatedly performed a plurality of times.

公开(公告)号：US11705646B2

公开(公告)日：2023-07-18

申请号：US17000775

申请日：2020-08-24

Applicant: HIRAKAWA HEWTECH CORPORATION

Inventor： Hiroyuki Tanaka

IPC: G01J1/44 ,  H01R4/02 ,  H01R4/04

CPC classification number: H01R4/023 ,  G01J1/44 ,  H01R4/029 ,  H01R4/04 ,  G01J2001/448

Abstract: A connection structure between sensor and cable includes a cable formed by assembling a plurality of electric wires each including a covering portion covering a core and a core-exposing portion exposing the core at an end of the covering portion, a spacer that is interposed in a space surrounded by the covering portions of the electric wires and holds end portions of the covering portions in the state that the end portions are spaced from each other, and a sensor that detects a physical quantity, and the core-exposing portion of each of the electric wires of the cable is electrically connected to the sensor via a fixing member in the state that each of the electric wires is held by the spacer.

公开(公告)号：US20190080668A1

公开(公告)日：2019-03-14

申请号：US15699941

申请日：2017-09-08

Applicant: Apple Inc.

Inventor： Prashanth S. Holenarsipur ,  Dong Zheng ,  Serhan O. Isikman

IPC: G09G5/10 ,  H04N5/33 ,  G01J1/42 ,  G01J1/44 ,  G01J1/04

CPC classification number: G09G5/10 ,  G01J1/0425 ,  G01J1/0437 ,  G01J1/0474 ,  G01J1/0492 ,  G01J1/4204 ,  G01J1/44 ,  G01J2001/448 ,  G01J2003/2806 ,  G09G2310/0259 ,  G09G2320/0626 ,  G09G2360/144 ,  H04N5/33

Abstract: An electronic device may be provided with a display mounted in a housing. The display may have an array of pixels that form an active area and may have an inactive area that runs along an edge of the active area. An opaque layer may be formed on an inner surface of a display cover layer in the inactive area of the display or may be formed on another transparent layer in the electronic device. An optical component window may be formed from the opening and may be aligned with an ambient light sensor such as a color ambient light sensor. The color ambient light sensor may have an infrared-blocking filter to block infrared light such as infrared light emitted by an infrared-light-emitting diode in the device. A light diffuser layer, light guide, and other structures may also be included in the ambient light sensor.

公开(公告)号：US20180315798A1

公开(公告)日：2018-11-01

申请号：US15945790

申请日：2018-04-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： NAOKI SHIMASAKI ,  Tokuhiko Tamaki ,  SANSHIRO SHISHIDO

IPC: H01L27/30 ,  H01L51/42 ,  H01L51/44 ,  H04N5/3745 ,  H04N5/355 ,  G01J1/44 ,  G01S17/08

CPC classification number: H01L27/307 ,  G01J1/44 ,  G01J2001/448 ,  G01S7/4863 ,  G01S17/08 ,  H01L27/146 ,  H01L27/283 ,  H01L51/0078 ,  H01L51/4253 ,  H01L51/442 ,  H04N5/3559 ,  H04N5/3572 ,  H04N5/3597 ,  H04N5/374 ,  H04N5/37452 ,  H04N5/378 ,  Y02E10/549

Abstract: A photodetector includes: a semiconductor substrate including first and second impurity regions; a gate insulating layer located on a region of the semiconductor substrate, the region being between the first and second impurity regions, the gate insulating layer including a photoelectric conversion layer; a gate electrode located on the gate insulating layer and having a light-transmitting property; a first charge transfer channel transferring signal charges corresponding to a current occurring between the first impurity region and the second impurity region depending on a change in a dielectric constant of the photoelectric conversion layer caused by light incidence on the photoelectric conversion layer; a second charge transfer channel diverging from the first charge transfer channel; a first charge storage storing charges, among the signal charges, transferred via the second charge transfer channel; and a first gate switching transfer and shutdown of charges passing through the second charge transfer channel.

公开(公告)号：US20180180473A1

公开(公告)日：2018-06-28

申请号：US15850385

申请日：2017-12-21

Applicant: SICK AG

Inventor： Klaus CLEMENS ,  Gottfried HUG ,  Stefan SEITZ ,  Sebastian TSCHUCH

IPC: G01J1/44

CPC classification number: G01J1/44 ,  G01J1/46 ,  G01J2001/4406 ,  G01J2001/4466 ,  G01J2001/448 ,  G01S7/4816 ,  G01S7/4863 ,  G01S7/497 ,  G01S17/08 ,  G01S17/89

Abstract: A light receiver (22) having a plurality of avalanche photodiode elements (24) each configured to be biased with a bias voltage above a breakdown voltage and thus to be operated in a Geiger mode for triggering a Geiger current upon light reception, the light receiver (22) comprising a plurality of bias voltage terminals (40a-c) providing different bias voltages, wherein the avalanche photodiode elements (24) form a plurality of groups (421-42n), and wherein the avalanche photodiode elements (24) of a group (421-42n) are each supplied with a same one of the different bias voltages.

公开(公告)号：US20180026145A1

公开(公告)日：2018-01-25

申请号：US15551099

申请日：2015-12-14

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Shogo KAMAKURA ,  Ryuta YAMADA ,  Kenichi SATO

IPC: H01L31/02 ,  G01J1/02 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/107 ,  G01J1/44 ,  H01L27/144

CPC classification number: H01L31/02005 ,  G01J1/02 ,  G01J1/44 ,  G01J2001/4466 ,  G01J2001/448 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L27/1446 ,  H01L31/02027 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/10 ,  H01L31/107 ,  H01L2224/05554 ,  H01L2224/32227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/12043 ,  H01L2924/30105 ,  H04N5/369 ,  H01L2924/00014

Abstract: A semiconductor substrate includes a first region in which a plurality of pixels are disposed and a second region located inside the first region to be surrounded by the first region when viewed from a direction in which a principal surface and a principal surface oppose each other. A through-hole penetrating through the semiconductor substrate is formed in the second region of the semiconductor substrate. An electrode disposed on a side of the principal surface of the semiconductor substrate and electrically connected to the plurality of pixels and an electrode disposed on a side of a principal surface of a mount substrate are connected to each other via a bonding wire inserted through the through-hole.

公开(公告)号：US20170243906A1

公开(公告)日：2017-08-24

申请号：US15448247

申请日：2017-03-02

Applicant: SONY CORPORATION

Inventor： Ryosuke NAKAMURA ,  Fumihiko KOGA ,  Taiichiro WATANABE

IPC: H01L27/146

CPC classification number: H01L27/14614 ,  G01J1/44 ,  G01J2001/448 ,  H01L27/14605 ,  H01L27/1461 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14647 ,  H01L27/14689

Abstract: There is provided a solid-state image pickup device including: a semiconductor substrate; a photodiode formed in the semiconductor substrate; a transistor having a gate electrode part or all of which is embedded in the semiconductor substrate, the transistor being configured to read a signal electric charge from the photodiode via the gate electrode; and an electric charge transfer layer provided between the gate electrode and the photodiode.

公开(公告)号：US20170176250A1

公开(公告)日：2017-06-22

申请号：US14977259

申请日：2015-12-21

Applicant: STMicroelectronics (Research & Development) Limited

Inventor： Bruce Rae ,  Ivan Ivanov

IPC: G01J1/44 ,  H01L27/146 ,  H01L31/107

CPC classification number: H01L27/14683 ,  G01J2001/442 ,  G01J2001/4466 ,  G01J2001/448 ,  H01L27/14609 ,  H01L27/14636 ,  H01L27/14643

Abstract: A device includes an array of single photon avalanche diodes (SPADs) and a plurality of pulse shapers. Each of the SPADs are electrically coupled to a respective SPAD quench circuit. Each of the pulse shapers have an input electrically coupled to an output of a respective SPAD quench circuit.