公开(公告)号：US20140333484A1

公开(公告)日：2014-11-13

申请号：US14117476

申请日：2011-08-04

Applicant: Kouji Muraoka

Inventor： Kouji Muraoka

IPC: H01Q1/38 ,  H01Q1/36

CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H01Q1/27 ,  H01Q1/36 ,  H01Q1/364 ,  H05K3/18 ,  H05K3/182 ,  H05K3/245 ,  H05K3/246 ,  H05K2201/0266 ,  H05K2203/0709

Abstract: This antenna (10) has an underlying print layer (2) which is upon the surface of a material (1) to be printed in a predetermined antenna pattern, and an electro-less plating layer (3) applied to the surface of the underlying print layer (2). The underlying print layer (2) is formed from an ink (2a) and a metallic powder (2b). A portion of the particles of the metallic powder (2b) are entrained within the ink layer in which the ink (2a) has been printed in a substantially uniform thickness. Some particles which are of large particle size project from the ink layer, and a portion of the ink (2a) covering the projecting portions is removed.

Abstract translation: 该天线（10）具有下面的印刷层（2），该印刷层（2）位于要以预定天线图案打印的材料（1）的表面上，并且将无电镀层（3）施加到下面的表面 打印层（2）。 下面的印刷层（2）由油墨（2a）和金属粉末（2b）形成。 金属粉末（2b）的一部分颗粒被夹带在其中印刷有大致均匀厚度的油墨（2a）的油墨层中。 一些粒径大的颗粒从油墨层突出，并且去除了覆盖突出部分的油墨（2a）的一部分。

公开(公告)号：US20140287158A1

公开(公告)日：2014-09-25

申请号：US14219047

申请日：2014-03-19

Applicant: Intrinsiq Materials, Inc.

Inventor： Janet Heyen ,  Michael Carmody

IPC: C09D5/24

CPC classification number: H05K1/095 ,  C08K9/10 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0326 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/0514 ,  H01L2924/00

Abstract: A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents.

Abstract translation: 用于筛网的导电糊剂具有平均直径在1.0-8.0微米之间的铜薄片和平均直径为10nm至100nm的铜纳米颗粒的混合物，其中铜片与纳米颗粒的比例为2:1 和5：1重量比; 以及包含分子量超过10,000的聚合物的大约一半的树脂和一种或多种溶剂。

公开(公告)号：US20140087614A1

公开(公告)日：2014-03-27

申请号：US14115306

申请日：2012-04-27

Applicant: PANASONIC CORPRORATION

Inventor： Takashi Matsuda ,  Mitsuyoshi Nishino ,  Kiyotaka Komori

IPC: C08K3/00 ,  C08L63/00 ,  H05K1/03

CPC classification number: C08K3/013 ,  B32B15/092 ,  B32B2264/102 ,  B32B2311/12 ,  B32B2363/00 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/22 ,  C08K3/26 ,  C08K2003/222 ,  C08K2003/2224 ,  C08K2003/2227 ,  C08K2003/265 ,  C08K2201/003 ,  C08K2201/005 ,  C08K2201/014 ,  C08L63/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T442/20 ,  Y10T442/3431 ,  Y10T442/3472

Abstract: Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D50) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D50) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.

Abstract translation: 本发明提供一种热固性树脂组合物，相对于100体积份的热固性树脂固体和无机填料，含有40〜80体积份的无机填料。 无机填料含有（A）选自三水铝矿型氢氧化铝粒子和平均粒径（D50）为1〜15μm的氢氧化镁粒子中的至少一种粒子; （B）平均粒径（D50）为1.5μm以下的氧化铝粒子; 和（C）钼化合物，组分（A），组分（B）和组分（C）相对于无机填料的总量的100％的共混比（体积比）为组分（A ）：30〜70％，（B）成分：1〜40％，成分（C）：1〜10％。

公开(公告)号：US20130333931A1

公开(公告)日：2013-12-19

申请号：US14002552

申请日：2012-02-22

Applicant: Yoshihide Sekito

Inventor： Yoshihide Sekito

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  C08G18/0823 ,  C08G18/6659 ,  C08G18/672 ,  C08G18/758 ,  C08J5/18 ,  C08K7/16 ,  C08K2003/026 ,  C08K2003/0812 ,  C08K2201/003 ,  H05K3/287 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0266 ,  C08G18/44

Abstract: The present invention provides an insulating film including: a (A) binder polymer; (B) spherical organic beads; and (C) fine particles containing at least one element selected from the group consisting of phosphorus, aluminum, and magnesium, both the (B) spherical organic bead and the (C) fine particles being dispersed in a predetermined state in the insulating film.

Abstract translation: 本发明提供一种绝缘膜，包括：（A）粘合剂聚合物; （B）球形有机珠粒; 和（C）含有选自磷，铝和镁中的至少一种元素的细颗粒，（B）球形有机珠和（C）微粒均以预定状态分散在绝缘膜中。

公开(公告)号：US20130105980A1

公开(公告)日：2013-05-02

申请号：US13659466

申请日：2012-10-24

Applicant: Hitachi, Ltd.

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Yoshio Kobayashi

IPC: B23K35/24 ,  H01L23/488 ,  B23K31/02

CPC classification number: H05K1/097 ,  B22F1/0018 ,  B22F3/10 ,  B22F9/24 ,  B82Y30/00 ,  C22C1/0425 ,  C22C9/00 ,  H01B1/026 ,  H01B1/16 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2224/83205 ,  H01L2224/8384 ,  H05K3/32 ,  H05K2201/0266 ,  H01L2924/00014

Abstract: Disclosed is a sinterable bonding material which is a liquid or a paste containing copper nanoparticles having a particle diameter of 1,000 nm or less, in which the copper nanoparticles have one or more particle diameter peaks of a number-based grain size distribution within a class of particle diameter of 1 to 35 nm and within a class of particle diameter of more than 35 nm and 1,000 nm or less respectively, and in which the copper nanoparticles include individual particles (primary particles) and secondary particles, each of the secondary particles being a fused body of the primary particles. Thus, oxidation resistance and bondability are made compatible in a sinterable bonding material using copper nanoparticles, and ion migration is suppressed in a bonded portion of a semiconductor device, etc. manufactured by using the sinterable bonding material.

Abstract translation: 公开了一种可烧结接合材料，其是含有粒径为1,000nm以下的铜纳米颗粒的液体或糊料，其中铜纳米颗粒具有一类或多种粒径分布的粒径分布的一个或多个粒径峰 粒径为1〜35nm，粒径分别为35nm以上且1000nm以下，其中，铜纳米粒子包括单粒子（一次粒子）和二次粒子，二次粒子为 融合体的初级粒子。 因此，使用铜纳米粒子的可烧结接合材料中的抗氧化性和结合性相容，并且通过使用可烧结接合材料制造的半导体器件等的接合部分抑制了离子迁移。

公开(公告)号：US20120189818A1

公开(公告)日：2012-07-26

申请号：US13498802

申请日：2010-09-28

Applicant: Katsura Hayashi

Inventor： Katsura Hayashi

IPC: B32B5/16 ,  H05K3/00 ,  H05K1/02 ,  B32B5/30 ,  B32B3/30

CPC classification number: H05K1/0306 ,  H05K3/4602 ,  H05K3/4655 ,  H05K3/4673 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0355 ,  Y10T428/24521 ,  Y10T428/25 ,  Y10T428/2982

Abstract: A circuit board includes an inorganic insulating layer having first inorganic insulating particles connected to each other, and second inorganic insulating particles connected to each other via the first inorganic insulating particles and having a larger particle diameter than that of the first inorganic insulating particles. A circuit board manufacturing method includes applying an inorganic insulating sol including first inorganic insulating particles and second inorganic insulating particles having a larger particle diameter than that of the first inorganic insulating particles, and heating the first inorganic insulating particles and the second inorganic insulating particles at a temperature lower than a crystallization onset temperature of the first inorganic insulating particles and lower than a crystallization onset temperature of the second inorganic insulating particles, and connecting the first inorganic insulating particles to each other, and connecting second insulating particles to each other via the first insulating particles.

Abstract translation: 电路板包括具有彼此连接的第一无机绝缘颗粒的无机绝缘层和通过第一无机绝缘颗粒彼此连接并且具有比第一无机绝缘颗粒的粒径更大的颗粒直径的第二无机绝缘颗粒。 一种电路板的制造方法，其特征在于，包括：第一无机绝缘粒子和比第一无机绝缘粒子的粒子直径大的第二无机绝缘粒子的无机绝缘溶胶，将第一无机绝缘粒子和第二无机绝缘粒子加热到 温度低于第一无机绝缘粒子的结晶起始温度，并且低于第二无机绝缘粒子的结晶化开始温度，并且将第一无机绝缘粒子彼此连接，并且经由第一绝缘体将第二绝缘粒子彼此连接 粒子。

公开(公告)号：US08178193B2

公开(公告)日：2012-05-15

申请号：US12260042

申请日：2008-10-28

Applicant: Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

Inventor： Beom Joon Cho ,  Jong Myeon Lee ,  Ho Sung Choo

IPC: B32B7/02 ,  B32B37/06 ,  B32B9/04

CPC classification number: H05K3/4611 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0266 ,  H05K2203/308 ,  Y10T428/24992

Abstract: Provided are a constraining green sheet and a method of manufacturing a multi-layer ceramic substrate. The constraining green sheet includes a first constraining layer and a second constraining layer. The first constraining layer has a side to be disposed on a multi-layer ceramic laminated structure and is formed of a first inorganic powder having a first particle diameter. The second constraining layer is disposed on top of the first constraining layer and is formed of a second inorganic powder having a second particle diameter larger than the first particle diameter. The second constraining layer is equal to or lower than the first constraining layer in terms of powder packing density. A shrinkage suppression rate can be increased and a de-binder passage can be secured in a firing process of the ceramic laminated structure by using the constraining green sheet formed of inorganic powders having different density and particle diameter.

Abstract translation: 本发明提供约束生片和多层陶瓷基片的制造方法。 约束生片包括第一约束层和第二约束层。 第一约束层具有设置在多层陶瓷层叠结构上的一侧，并且由具有第一粒径的第一无机粉末形成。 第二约束层设置在第一约束层的顶部，并且由具有大于第一粒径的第二粒径的第二无机粉末形成。 关于粉末填充密度，第二约束层等于或低于第一约束层。 通过使用由具有不同密度和粒径的无机粉末形成的约束生片，可以在陶瓷层压结构的烧制过程中确保收缩抑制率，并且可以确保去粘合剂通道。

公开(公告)号：US20120104618A1

公开(公告)日：2012-05-03

申请号：US13348072

申请日：2012-01-11

Applicant: Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC: H01L23/488

CPC classification number: H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 一种粘合材料，其包含涂覆有碳原子数为2〜8的有机物质的金属粒子，其中，所述金属粒子包含100nm以下的第一部分和大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US08105414B2

公开(公告)日：2012-01-31

申请号：US12512315

申请日：2009-07-30

Applicant: Alfred A. Zinn

Inventor： Alfred A. Zinn

IPC: B22F1/00 ,  B22F1/02

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract translation: 组合物可以具有直径为20纳米或更小并具有小于约220℃的熔融温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

公开(公告)号：US20120018048A1

公开(公告)日：2012-01-26

申请号：US12307370

申请日：2007-07-03

Applicant: Mitsuo Yamashita ,  Tomoaki Goto ,  Takeshi Asagi

Inventor： Mitsuo Yamashita ,  Tomoaki Goto ,  Takeshi Asagi

IPC: B23K35/26

CPC classification number: H05K3/341 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  B23K2101/42 ,  C22C1/0483 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L2924/0132 ,  H01L2924/0133 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/04 ,  H05K2203/12 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01029

Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.

Abstract translation: 通过将Sn-Ag-Cu合金与助熔剂捏合而获得的膏状焊料，其中，Sn-Ag-Cu合金包括第一粉末合金和第二粉末合金的混合物，第一粉末合金由Sn- Ag相图具有固液共存区域，并且具有比共晶组合物（3.5重量％银）大的给定银量，第二粉末合金的银量为共晶组合物中的银量（ 3.5重量％的银），或者接近于共晶组合物中的银，并且小于第一粉末合金中的银。 这种膏状焊料具有优异的强度和热稳定性，并且具有令人满意的粘合性能。 它基于廉价的Sn-Ag-Cu焊料合金。 适用于符合温度梯度键合的高温侧无铅焊料。 还提供了一种焊接方法。