公开(公告)号：US09538651B2

公开(公告)日：2017-01-03

申请号：US14820978

申请日：2015-08-07

Applicant: IBIDEN CO., LTD.

Inventor： Yasushi Inagaki ,  Kota Noda

IPC: H05K1/11 ,  H05K3/06 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/20 ,  H05K3/40 ,  H05K3/18

CPC classification number: H05K1/111 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/007 ,  H05K3/06 ,  H05K3/061 ,  H05K3/188 ,  H05K3/202 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4069 ,  H05K2201/0302 ,  H05K2201/0341 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/098 ,  H05K2203/06 ,  Y02P70/611

Abstract: A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer.

Abstract translation: 印刷布线板包括绝缘层，第一导体层，其嵌入绝缘层的第一表面中，并且包括用于连接电子部件的连接部分，从绝缘层的第二表面突出的第二导体层，阻焊层 覆盖第一导体层并具有露出连接部分的开口结构，形成在连接部分上的阻挡金属层，使得阻挡层从绝缘层的第一表面突出，以及形成在阻挡层上的金属柱，使得 金属柱分别位于连接部分上。 每个金属柱的宽度大于相应连接部分的宽度，并且阻挡金属层包括与形成金属柱的金属材料不同的金属材料和形成第一导体层的金属材料。

公开(公告)号：US09524813B2

公开(公告)日：2016-12-20

申请号：US14360904

申请日：2014-04-03

Applicant: Nuovo Film, Inc.

Inventor： Hakfei Poon

IPC: B32B3/00 ,  H01B13/30 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  G06F3/041 ,  H01B1/02 ,  H01B1/22 ,  H01L31/0224 ,  H01L31/18

CPC classification number: H01B13/30 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/02 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/032

Abstract: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region comprising a network of silver nanowires and means for protecting the nanowire from surface oxidation; and a second region, comprising a plurality of metal nanowires and means for protecting nanowire from surface oxidation, and metal oxide nanowires.

公开(公告)号：US20160270243A1

公开(公告)日：2016-09-15

申请号：US15033211

申请日：2015-08-27

Applicant: TOYO INK SC HOLDINGS CO., LTD. ,  TOYOCHEM CO., LTD.

Inventor： Satoshi NISHINOHARA ,  Hidenobu KOBAYASHI ,  Kazunori MATSUDO ,  Tsutomu HAYASAKA

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4611 ,  H05K1/02 ,  H05K2201/0302 ,  H05K2201/0364

Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2).The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.

Abstract translation: 金属加强板（2）包括形成在金属板（2a）的表面上的镍层（2b）。 存在于镍层（2b）的表面中的氢氧化镍与镍的表面积的比例大于3且等于或小于20。

公开(公告)号：US20160044777A1

公开(公告)日：2016-02-11

申请号：US14774593

申请日：2014-07-30

Applicant: LG CHEM, LTD.

Inventor： Jiehyun SEONG ,  Jinmi JUNG ,  Yong Goo SON ,  Seung Heon LEE ,  Song Ho JANG ,  Bu Gon SHIN ,  Ji Young HWANG

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K3/06

CPC classification number: H05K1/0274 ,  H01L51/0023 ,  H01L51/105 ,  H01L51/442 ,  H01L51/445 ,  H01L51/5212 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/09681 ,  Y02E10/549 ,  Y02P70/521

Abstract: Provided are a transparent conductive laminate, a transparent electrode including the transparent conductive laminate, and a manufacturing method for the transparent conductive laminate.

Abstract translation: 提供一种透明导电性层叠体，具备透明导电性层叠体的透明电极及透明导电性层叠体的制造方法。

公开(公告)号：US20150289372A1

公开(公告)日：2015-10-08

申请号：US14244142

申请日：2014-04-03

Applicant: Yikang Deng

Inventor： Yikang Deng

IPC: H05K1/11 ,  G01N21/95 ,  G01N21/64 ,  H05K3/42 ,  H01B1/12

CPC classification number: H05K3/42 ,  G01N21/64 ,  G01N21/643 ,  G01N21/6456 ,  G01N21/95 ,  G01N21/95684 ,  G01N2021/6439 ,  G01N2021/646 ,  H05K1/0269 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2203/163 ,  Y10T29/49165

Abstract: A microelectronic substrate having a substrate core with at least one plated through hole extending therethrough, wherein the plated through hole includes a fluorescent conductive fill material. In one embodiment, the plated through hole may comprise a hole defined to extend from a first surface to an opposing second surface of the substrate core, wherein a conductive material layer is formed on a sidewall(s) of the substrate core hole and a conductive fill material, having a fluorescent component, is disposed to fill the remaining substrate core hole after forming the conductive material layer. In another embodiment of the present description, the fluorescent conductive fill material is used for the detection of defects.

Abstract translation: 一种微电子衬底，其具有具有延伸穿过其中的至少一个电镀通孔的衬底芯，其中所述电镀通孔包括荧光导电填充材料。 在一个实施例中，电镀通孔可以包括限定为从衬底芯的第一表面延伸到相对的第二表面的孔，其中导电材料层形成在衬底芯孔的侧壁上，并且导电 具有荧光成分的填充材料被设置成在形成导电材料层之后填充剩余的基底芯孔。 在本说明书的另一实施例中，荧光导电填充材料用于检测缺陷。

公开(公告)号：US20150237739A1

公开(公告)日：2015-08-20

申请号：US14704597

申请日：2015-05-05

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Sung EOM ,  Kwang-Seong CHOI ,  Hyun-cheol BAE ,  Jung Hyun NOH ,  Jong Tae MOON

IPC: H05K3/12 ,  H05K3/10 ,  H05K3/18 ,  H05K1/09

CPC classification number: H05K3/1216 ,  C25D5/02 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  H05K1/095 ,  H05K3/102 ,  H05K3/188 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0302 ,  H05K2203/0425

Abstract: The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.

Abstract translation: 本发明涉及用于形成导电电路图案的图案形成组合物。 图案形成组合物包括Cu粉末，用于电耦合Cu粉末的焊料，聚合物树脂，固化剂和还原剂。 根据本发明，可以以低成本形成具有优良导电性的电路图案。

公开(公告)号：US20150014025A1

公开(公告)日：2015-01-15

申请号：US14360876

申请日：2014-01-22

Applicant: Nuovo Film Inc.

Inventor： Hakfei Poon

IPC: H05K1/02 ,  H05K1/09

CPC classification number: H01B1/02 ,  B22F9/16 ,  C23C22/58 ,  C23C22/73 ,  C23C22/78 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/22 ,  H01B13/30 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0108 ,  H05K2201/0302 ,  H05K2201/032 ,  Y10T428/249921

Abstract: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region having a network of metal nanowires; and a second region, having a metal/metal oxide nanowire in a core shell structure.

Abstract translation: 本发明公开了一种图案化的透明导电电极，其包含衬底和在衬底顶部上的基本单个导电层。 单个导电层包括具有金属纳米线网络的第一区域; 以及具有芯壳结构中的金属/金属氧化物纳米线的第二区域。

公开(公告)号：US20140299365A1

公开(公告)日：2014-10-09

申请号：US14240815

申请日：2012-09-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Muthu Sebastian ,  Dominic M. Travasso ,  Nancy S. Lennhoff ,  Steven T. Swartz

IPC: H05K1/02 ,  H05K3/06

CPC classification number: H05K1/0274 ,  G06F3/044 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0302 ,  H05K2201/032

Abstract: An article includes a multilayer structure, such as, e.g., a touch sensor, having two opposing sides and comprising a central polymeric UV transparent substrate, a transparent conductive layer on each of the two major opposing surfaces of the polymeric substrate, a metallic conductive layer on each transparent conductive layer, and a patterned photoimaging mask on each metallic conductive layer.

Abstract translation: 一种物品包括多层结构，例如触摸传感器，具有两个相对的侧面并且包括中心聚合物UV透明基板，在聚合物基板的两个主要相对表面的每一个上的透明导电层，金属导电层 在每个透明导电层上，以及每个金属导电层上的图案化成像掩模。

公开(公告)号：WO2014188055A1

公开(公告)日：2014-11-27

申请号：PCT/FI2014/050264

申请日：2014-04-11

Applicant: NOKIA CORPORATION

Inventor： ALLEN, Mark Lee ,  BOWER, Chris ,  COTTON, Darryl

IPC: H05K3/10

CPC classification number: H05K1/0272 ,  H01L23/52 ,  H01L24/00 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/24101 ,  H01L2224/24226 ,  H01L2224/24997 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/2919 ,  H01L2224/82101 ,  H01L2224/82138 ,  H01L2224/8284 ,  H01L2224/82862 ,  H01L2224/82874 ,  H01L2224/82877 ,  H01L2224/82986 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K1/092 ,  H05K1/097 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0257 ,  H05K2201/0302 ,  H05K2201/09036 ,  H05K2201/09227 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A substrate (101) comprising a fluid reservoir (102) and a connected fluid channel (103), the fluid reservoir (102) positioned away from a component region (104) of the substrate (101), the fluid channel (103) configured to extend from the fluid reservoir (102) to guide an electrically conductive fluid from the fluid reservoir (102) at a reservoir end (105) of the fluid channel (103) through the fluid channel (103) to a component end (106) of the fluid channel (103), the component end (106) extending to the component region (104) of the substrate (101) to enable the formation of an electrical connection to a connector of an electronic component appropriately positioned in the component region (104), formation of the electrical connection allowing the electronic component to be interconnected to other electronic components using one or more of the fluid reservoir (102) and fluid channel (103).

Abstract translation: 包括流体储存器（102）和连接的流体通道（103）的基板（101），所述流体储存器（102）远离所述基板（101）的部件区域（104）定位，所述流体通道（103）被配置 从所述流体储存器（102）延伸以将来自所述流体通道（103）的储存器端（105）处的流体储存器（102）的导电流体通过所述流体通道（103）引导到部件端部（106） 所述流体通道（103）的所述部件端部（106）延伸到所述基板（101）的所述部件区域（104），以使得能够形成到适于定位在所述部件区域中的电子部件的连接器的电连接（ 104），形成允许电子部件使用一个或多个流体储存器（102）和流体通道（103）与其它电子部件互连的电连接。

公开(公告)号：WO2014161499A1

公开(公告)日：2014-10-09

申请号：PCT/CN2014/074717

申请日：2014-04-03

Applicant: NUOVO FILM INC.

Inventor： POON, Hakfei

IPC: H01B5/14

CPC classification number: H01B13/30 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/02 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/032

Abstract: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region comprising a network of silver nanowires and means for protecting the nanowire from surface oxidation; and a second region, comprising a plurality of metal nanowires and means for protecting nanowire from surface oxidation, and metal oxide nanowires.

Abstract translation: 本文公开了一种图案化的透明导电电极，其包括衬底和在衬底顶部上的基本单个导电层。 单个导电层包括包含银纳米线网络的第一区域和用于保护纳米线免受表面氧化的装置; 以及包括多个金属纳米线的第二区域和用于保护纳米线免受表面氧化的装置和金属氧化物纳米线。