中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

337 records (took 0.023 seconds)

    Thermal conductive electronics substrate and assembly
    101.
    发明申请
    Thermal conductive electronics substrate and assembly 失效
    导热电子基板和组件

    公开(公告)号：US20070120250A1

    公开(公告)日：2007-05-31

    申请号：US11287834

    申请日：2005-11-28

    Applicant: M. Fairchild ,  Aleksandra Djordjevic ,  Javier Ruiz

    Inventor： M. Fairchild ,  Aleksandra Djordjevic ,  Javier Ruiz

    IPC: H01L23/34

    CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L24/33 ,  H01L2224/32225 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H05K3/0061 ,  H05K2201/09836 ,  H01L2924/00

    Abstract: An electronics assembly is provided including a circuit board substrate having a top surface and a bottom surface and a plurality of thermal conductive vias extending from the top surface to the bottom surface. At least one electronics package is mounted to the top surface of the substrate. A heat sink device is in thermal communication with the bottom surface of the substrate. Thermal conductive vias are in thermal communication to pass thermal energy from the at least one electronics package to the heat sink. At least some of the thermal conductive vias are formed extending from the top surface to the bottom surface of the substrate at an angle.

    Abstract translation: 提供一种电子组件，其包括具有顶表面和底表面的电路板基底和从顶表面延伸到底表面的多个导热通孔。 至少一个电子封装被安装到基板的顶表面。 散热器件与衬底的底表面热连通。 导热通孔热传导通过热能从至少一个电子封装到散热器。 至少一些导热通孔形成为以一定角度从基板的顶表面延伸到底表面。

    Slanted vias for electrical circuits on circuit boards and other substrates
    103.
    发明授权
    Slanted vias for electrical circuits on circuit boards and other substrates 失效
    电路板和其他基板上的电路的倾斜通孔

    公开(公告)号：US07083425B2

    公开(公告)日：2006-08-01

    申请号：US10927760

    申请日：2004-08-27

    Applicant: Chin Hui Chong ,  Choon Kuan Lee

    Inventor： Chin Hui Chong ,  Choon Kuan Lee

    IPC: H01R12/00 ,  H05K1/00

    CPC classification number: H01R12/526 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09836 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/4922

    Abstract: Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface of the dielectric portion for connection to a first electronic component. A second terminal is disposed on the second surface of the dielectric portion for connection to a second electronic component. The apparatus further includes a passage extending through the dielectric portion along a longitudinal axis oriented at an oblique angle relative to the first surface. The passage is at least partially filled with conductive material electrically connecting the first terminal to the second terminal.

    Abstract translation: 本文公开了具有倾斜通孔的电路板，微电子器件和其它设备。 在一个实施例中，用于互连电子部件的装置包括具有第一表面和第二表面的电介质部分。 第一端子设置在电介质部分的第一表面上，用于连接到第一电子部件。 第二端子设置在电介质部分的第二表面上，用于连接到第二电子部件。 该装置还包括沿着相对于第一表面以倾斜角定向的纵向轴线延伸通过电介质部分的通道。 该通道至少部分地填充有将第一端子与第二端子电连接的导电材料。

    Circuit boards containing vias and methods for producing same
    108.
    发明申请
    Circuit boards containing vias and methods for producing same 有权
    含有通孔的电路板及其制造方法

    公开(公告)号：US20030067074A1

    公开(公告)日：2003-04-10

    申请号：US09974947

    申请日：2001-10-10

    Inventor： Larry D. Kinsman

    IPC: H01L023/52

    CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09945 ,  H01L2924/00

    Abstract: The present invention is directed to an apparatus and method for connecting integrated circuits placed on opposite sides of a circuit board through utilization of conduction elements embedded in the circuit board and extending from one surface of the board to the other. Conductive traces extend along the surface of the circuit board from the conduction elements to the integrated circuits. The conductive traces may be formed from multiple conductive layers.

    Abstract translation: 本发明涉及一种用于连接放置在电路板的相对侧上的集成电路的装置和方法，该集成电路通过利用嵌入电路板中的导电元件并从板的一个表面延伸到另一个表面。 导电迹线沿着电路板的表面从导电元件延伸到集成电路。 导电迹线可以由多个导电层形成。

    Flexible circuit with conductive vias having off-set axes
    109.
    发明授权
    Flexible circuit with conductive vias having off-set axes 失效
    具有导通孔的柔性电路具有偏置轴

    公开(公告)号：US06211468B1

    公开(公告)日：2001-04-03

    申请号：US09132828

    申请日：1998-08-12

    Applicant: David J. Windschitl

    Inventor： David J. Windschitl

    IPC: H01R909

    CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/388 ,  H05K3/4076 ,  H05K2201/0166 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H01L2924/00

    Abstract: A flexible circuit includes a flexible non-conductive substrate having a first surface and a second surface. A first electrically conductive trace is provided on the first surface and a second electrically conductive trace is provided on the second surface. A passage extends through the substrate from an end of the first trace to an end of the second trace. The passage includes a beveled opening of a first size formed in the first side and axially aligned with a second beveled opening of the first size formed in the second side. The first and second openings are interconnected by an aperture axially aligned therewith and being of a second size less than the first size. An electrically conductive surface is provided on the passage for electrically interconnecting the first trace and the second trace.

    Abstract translation: 柔性电路包括具有第一表面和第二表面的柔性非导电基底。 第一导电迹线设置在第一表面上，第二导电迹线设置在第二表面上。 通道从第一迹线的端部延伸穿过基底到第二迹线的末端。 通道包括形成在第一侧中的第一尺寸的斜切开口，并且与形成在第二侧中的第一尺寸的第二斜切开口轴向对准。 第一和第二开口通过与其轴向对齐并且具有小于第一尺寸的第二尺寸的孔相互连接。 在通道上设置导电表面，用于电连接第一迹线和第二迹线。

Patent Agency Ranking