公开(公告)号：EP2790476A1

公开(公告)日：2014-10-15

申请号：EP12871458.1

申请日：2012-12-13

Applicant: Huawei Technologies Co., Ltd

Inventor： HUANG, Mingli ,  FENG, Tao ,  LI, Songlin

IPC: H05K3/46 ,  H05K3/40

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/144 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/10242

Abstract: Embodiments of the present invention provide a multi-layer printed circuit board and a method for fabricating a multi-layer printed circuit board, which relate to the field of electronics, and can avoid a problem that signal transmission performance is affected by a plated hole. The antenna feeder printed circuit board includes at least two layers of core plates that are adhered, where an antenna feeder circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.

Abstract translation: 本发明的实施例提供了一种多层印刷电路板和用于制造涉及电子领域的多层印刷电路板的方法，并且可以避免信号传输性能受镀层孔影响的问题。 天线馈线印刷电路板包括至少两层粘合的芯板，其中天线馈线电路机械部件设置在芯板上，在芯板上还设置有通孔，并且金属柱嵌入 其中金属柱的一端连接到设置在芯板上的天线馈电电路机械部件上的对应位置，另一端连接到设置在相邻层上的天线馈电电路机械部件上的对应位置 的核心板。 该方法用于制造多层印刷电路板。

公开(公告)号：EP2581995A3

公开(公告)日：2014-06-11

申请号：EP12187599.1

申请日：2012-10-08

Applicant: Tyco Electronics Japan G.K.

Inventor： Terajima, Keita

IPC: H01R43/02 ,  H05K3/40 ,  H05K3/42 ,  H01R4/02 ,  H01R12/58 ,  H01R13/533

CPC classification number: H01R43/0256 ,  H01R4/027 ,  H01R12/58 ,  H01R13/533 ,  H05K3/4046 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2201/10242

Abstract: A connector (1) includes an insulation board (11), a conductor pattern (15), a rod-shaped member (16) and solder (17). The insulation board (11) is provided with a through hole (11h) penetrating from a top face (11a) to a bottom face (11b). The conductor pattern (15) covers an internal wall of the through hole (11h). The rod-shaped member (16) includes a first end (16b) protruding from the bottom face (11b) and a second end (16a) inside the through hole (11h). The solder (17) closes a gap between the internal wall of the through hole (11h) and the rod-shaped member (16) and covers the second end (16a) of the rod-shaped member (16).

公开(公告)号：EP2642532A1

公开(公告)日：2013-09-25

申请号：EP12848326.0

申请日：2012-08-30

Applicant: Dongguan Kingsun Optoelectronic Co., Ltd

Inventor： BI, Xiaofeng

IPC: H01L33/00 ,  H01L33/64

CPC classification number: B23K31/02 ,  H01L33/64 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10416

Abstract: A manufacturing process of a high-power LED radiating structure includes steps of: (1) preparing parts or material such as a PCB board (4), a heat conducting plate (6) and a heat dissipating plate (9); (2) providing a first locating hole and a first fixing hole passing through the PCB board, welding a copper plate layer on one side of the PCB board, and welding an electrode weld pad on the other side of the PCB board, and then applying soldering paste on the surface of the copper plate layer; (3) providing a second locating hole and a second fixing hole passing through the heat conducting plate; (4) inserting a fixing pole into the first and second fixing holes to fixedly connect the PCB board and the heat conducting plate together; (5) inserting the heat conducting pole into the first and second locating holes; (6) proving the heat conducting plate and the PCB board resulted from step (5) on a stamping equipment, and adjusting the length of the protruding end of the heat conducting pole. The inventive process is simple, and the manufactured dissipating structure is advantageous for a simple construction and good heat conducting and dissipating effects.

Abstract translation: 大功率LED辐射结构的制造工艺包括以下步骤：（1）制备诸如PCB板（4），导热板（6）和散热板（9）的部件或材料; （2）提供穿过PCB板的第一定位孔和第一固定孔，在PCB板的一侧焊接铜板层，并在PCB板的另一侧焊接电极焊盘，然后施加 铜板表面焊膏; （3）提供穿过导热板的第二定位孔和第二固定孔; （4）将固定杆插入第一和第二固定孔中以将PCB板和导热板固定在一起; （5）将导热柱插入第一和第二定位孔; （6）在冲压设备上证明由步骤（5）导出的导热板和PCB板，并调整导热柱的突出端的长度。 本发明方法简单，制造的散热结构对于简单的结构和良好的导热和散热效果是有利的。

公开(公告)号：EP2101551B1

公开(公告)日：2010-12-08

申请号：EP09164309.8

申请日：2002-04-17

Applicant: Epson Toyocom Corporation

Inventor： Takanashi, Hitoshi ,  Uchiyama, Tsuneo ,  Nagano, Youji ,  Horie, Kyo ,  Watanabe, Noriyuki ,  Shii, Kazuhiro

IPC: H05K1/18 ,  H05K5/00

CPC classification number: H03H9/1021 ,  H03H9/0547 ,  H03H9/0552 ,  H05K1/181 ,  H05K3/3442 ,  H05K5/0091 ,  H05K2201/10083 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10515 ,  H05K2201/2018 ,  Y02P70/611

Abstract: A piezoelectric oscillator comprising a piezoelectric vibrator with a piezoelectric vibrating element housed in a package and bottom terminals formed on the outer side of the bottom of the package, a circuit board with at least one electronic circuit component mounted and conductor patterns formed on the top side, and columnlike supports which mechanically and electrically connects the bottom terminals of the piezoelectric vibrator and the conductor patterns on the circuit board. The piezoelectric oscillator has a smaller board occupation area, and can be manufactured by quantity production using a batch process at a high productivity and a reduced cost.

公开(公告)号：EP1381151B1

公开(公告)日：2010-06-23

申请号：EP02764101.8

申请日：2002-04-17

Applicant: Epson Toyocom Corporation

Inventor： TAKANASHI, Hitoshi, c/o Epson Toyocom Corporation ,  UCHIYAMA, Tsuneo, c/o Epson Toyocom Corporation ,  NAGANO, Youji, c/o Epson Toyocom Corporation ,  HORIE, Kyo, c/o Epson Toyocom Coporation ,  WATANABE, Noriyuki, c/o Epson Toyocom Corporation ,  SHII, Kazuhiro, c/o Epson Toyocom Corporation

IPC: H03B5/32 ,  H01B1/18 ,  H05K5/00

CPC classification number: H03H9/1021 ,  H03H9/0547 ,  H03H9/0552 ,  H05K1/181 ,  H05K3/3442 ,  H05K5/0091 ,  H05K2201/10083 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10515 ,  H05K2201/2018 ,  Y02P70/611

Abstract: A piezoelectric oscillator which has a piezoelectric oscillator packaged with column members fixed on a wiring board for mounting electronic components constituting an oscillation circuit or a temperature compensation circuit, removes a variation in dimensions of the support member or a wrong placement of column members during reflow, and shows a high reliability and an excellent working efficiency. This oscillator is a quartz oscillator comprising a wiring board which mounts electronic components constituting an oscillation circuit and a temperature compensation circuit on a land on the top and has an external electrode and a quartz oscillator fixed with a predetermined gap via column members fixed on the top of the wiring board. This oscillator has the bottom electrode of the column member electromechanically fixed to a column member fixing pattern formed on the top of the wiring board, and the upper electrode of the column member electromechanically fixed to the bottom electrode of the quartz oscillator.

公开(公告)号：EP1630864A3

公开(公告)日：2008-02-13

申请号：EP05017786.4

申请日：2005-08-16

Applicant: TECNISCO LTD.

Inventor： Yoshioka, Hokichi ,  Ito, Kazuhiko

IPC: H01L23/10 ,  H01L23/498

CPC classification number: H05K3/4046 ,  H01L23/10 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/0306 ,  H05K3/388 ,  H05K2201/09572 ,  H05K2201/10242 ,  H01L2924/00

Abstract: A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavity defined by the metal film.

公开(公告)号：EP1630864A2

公开(公告)日：2006-03-01

申请号：EP05017786.4

申请日：2005-08-16

Applicant: TECNISCO LTD.

Inventor： Yoshioka, Hokichi ,  Ito, Kazuhiko

IPC: H01L23/10 ,  H01L23/498

CPC classification number: H05K3/4046 ,  H01L23/10 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/0306 ,  H05K3/388 ,  H05K2201/09572 ,  H05K2201/10242 ,  H01L2924/00

Abstract: A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavity defined by the metal film.

Abstract translation: 具有设置在其中的多个通孔接触装置的基板。 每个通孔接触装置由形成在基板中的作为通孔的通孔，设置在通孔的内周面上的金属膜和填充到由金属膜限定的空腔中的焊料构成 。

公开(公告)号：EP1443548A3

公开(公告)日：2004-08-18

申请号：EP03104978.6

申请日：2003-12-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tellkamp, John P ,  Matsunami, Akira

IPC: H01L21/60 ,  H01L23/00 ,  H01L23/485 ,  B23K3/06 ,  B23K35/26 ,  B23K35/02 ,  H05K3/00

CPC classification number: H05K3/3436 ,  B23K3/0623 ,  B23K35/001 ,  B23K35/0222 ,  B23K35/0238 ,  B23K2201/40 ,  H01L23/562 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3463 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/033 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2224/29099

Abstract: An integrated circuit chip (903), which has a plurality of pads (903b) and non-reflowable contact members (1201) to be connected by reflow attachment to external parts. Each of these contact members (1201) has a height-to-diameter ratio and uniform diameter favorable for absorbing strain under thermomechanical stress. The members have a solderable surface (1202) on each end and a layer of reflowable material on each end. Each member is solder-attached (1204) at one end to a chip contact pad (903b), while the other end (1203) of each member is operable for reflow attachment to external parts.

公开(公告)号：EP0753990B1

公开(公告)日：2000-04-12

申请号：EP96401487.2

申请日：1996-07-05

Applicant: THOMSON-CSF

Inventor： Baumert, Eric ,  Chazelas, Jean

IPC: H05K3/34 ,  H01L21/60 ,  H01R12/04

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05611 ,  H01L2224/13 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13618 ,  H01L2224/13624 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01R12/707 ,  H05K3/3436 ,  H05K2201/0308 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

公开(公告)号：WO2017062095A1

公开(公告)日：2017-04-13

申请号：PCT/US2016/045928

申请日：2016-08-06

Applicant: RAYTHEON COMPANY

Inventor： ELLIOTT, James M. ,  WILSON, James S. ,  SWERNOFSKY, David E.

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H05K1/0209 ,  H05K1/142 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10242

Abstract: An apparatus includes a printed circuit board (PCB) (200, 200a-200m, 705) including a surface (205) that has a layer of circuitry (215, 220, 225, 230, 235, 240, 245, 250, 255, 260, 265, 709, 710). The apparatus also includes a heat sink (300) configured to receive heat from the PCB. The apparatus further includes a thermally- conductive post (400, 500, 707) configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.

Abstract translation: 一种装置包括印刷电路板（PCB）（200,200a-200m，705），其包括具有电路层（215,220,225,230,235,240,245,250,255,255,255）的表面（205） 260,265,709,710）。 该设备还包括配置为从PCB接收热量的散热器（300）。 该装置还包括导热柱（400,500,770），其被配置为通过热路径的热传导将热量从PCB去除到散热器。 热路径基本上垂直于PCB的表面。 该柱包括被配置为物理耦合到电路层的端部。