公开(公告)号：US20110194258A1

公开(公告)日：2011-08-11

申请号：US13021344

申请日：2011-02-04

Applicant: Robert E. Kodadek, III

Inventor： Robert E. Kodadek, III

IPC: H05K7/20

CPC classification number: F21V29/67 ,  F21V29/02 ,  F21V29/673 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10545

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

Abstract translation: 用于电气部件的热管理系统包括能够接收PCB的第一侧上的电气部件的印刷电路板（PCB）。 细长构件具有连接到PCB的第二侧的一端，以及远离PCB设置的另一端。 细长构件还具有有利于两端之间的流体连通的开放内部。 端部中的一个限定了PCB上的至少部分闭合的边界。 PCB包括邻近边界设置穿过的孔，使得在PCB的第一侧和PCB的第二侧之间以及沿着细长构件的至少一部分容易流体连通。

公开(公告)号：US20110063812A1

公开(公告)日：2011-03-17

申请号：US12853647

申请日：2010-08-10

Applicant: Teru NAKANISHI ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

Inventor： Teru NAKANISHI ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

IPC: H05K7/02 ,  H05K3/30

CPC classification number: H05K3/3426 ,  G01R31/2853 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/4006 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/73253 ,  H01L2224/81054 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/19041 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10257 ,  H05K2201/10265 ,  H05K2201/10984 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/4913

Abstract: An electronic device includes a circuit board having a first electrode formed on a main surface thereof, a semiconductor device disposed toward the main surface of the circuit board, the semiconductor device having a second electrode formed on a surface thereof opposed to the main surface, and a connection member electrically connecting between the first and second electrodes. The connection member includes a hollow cylindrical member and a conductive member disposed within the hollow cylindrical member.

Abstract translation: 电子设备包括：电路板，具有形成在其主表面上的第一电极，半导体器件设置在电路板的主表面上，该半导体器件具有形成在与主表面相对的表面上的第二电极， 电连接在第一和第二电极之间的连接构件。 连接构件包括中空圆柱形构件和设置在中空圆柱形构件内的导电构件。

公开(公告)号：US07755200B2

公开(公告)日：2010-07-13

申请号：US12210920

申请日：2008-09-15

Applicant: Hau Nguyen

Inventor： Hau Nguyen

IPC: H01L23/48

CPC classification number: B23K3/0623 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/40 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  Y10T428/24612

Abstract: The present invention relates to methods and arrangements for forming a solder joint connection. One embodiment involves an improved solder ball. The solder ball includes a perforated, metallic shell with an internal opening. Solder material encases the shell and fills its internal opening. The solder ball may be applied to an electrical device, such as an integrated circuit die, to form a solder bump on the device. The solder bump in turn can be used to form an improved solder joint connection between the device and a suitable substrate, such as a printed circuit board. In some applications, a solder joint connection is formed without requiring the application of additional solder material to the surface of the substrate. The present invention also includes different solder bump arrangements and methods for using such arrangements to form solder joint connections between devices and substrates.

Abstract translation: 本发明涉及形成焊点连接的方法和装置。 一个实施例涉及一种改进的焊球。 焊球包括具有内部开口的穿孔金属外壳。 焊接材料包住外壳并填充其内部开口。 焊球可以被施加到诸如集成电路管芯的电气装置上，以在器件上形成焊料凸块。 焊料凸点又可用于在器件和合适的衬底（例如印刷电路板）之间形成改进的焊点连接。 在一些应用中，形成焊接接头，而不需要向衬底的表面施加额外的焊料。 本发明还包括不同的焊料凸块布置和使用这种布置来形成器件和衬底之间的焊接连接的方法。

公开(公告)号：US20080128158A1

公开(公告)日：2008-06-05

申请号：US11814425

申请日：2006-01-24

Applicant: Markus Wolfel

Inventor： Markus Wolfel

IPC: H05K1/00

CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

Abstract: The invention relates to a wire-printed circuit board or card comprising conductors that run on and/or in the circuit board or card between connection points. In order to improve circuit boards of this type, the invention provides for at least one of the conductors to have a rectangular or square cross-section.

Abstract translation: 本发明涉及一种线印刷电路板或卡，其包括在连接点之间在电路板或卡上延伸和/或运行的导体。 为了改进这种类型的电路板，本发明提供至少一个导体具有矩形或正方形的横截面。

公开(公告)号：US20050266702A1

公开(公告)日：2005-12-01

申请号：US11139846

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R4/02 ,  H01R12/00 ,  H01R13/24 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环都焊接到基板和设备。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US20030060066A1

公开(公告)日：2003-03-27

申请号：US10255373

申请日：2002-09-26

Applicant: NEC Corporation

Inventor： Tomoko Harada

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K2201/0116 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  H01L2924/00

Abstract: A solder ball achieves a desired quantity of solder material for a solder joint easily without increasing the thickness of a solder layer formed to cover a core. The solder ball comprises a conductive core having depressions on its outer surface, and a solder layer formed to cover the outer surface of the core in such a way as to fill the depressions of the core. Thus, the quantity of the solder material included in the ball is supplemented by the solder material filled into the depressions. Preferably, the core has a higher melting point than the solder layer and wettability to the solder layer. The core may have a cavity in its inside, thereby forming a shell-shaped core. The core may be made of a porous metal body having pores, in which part of the pores reaches the outer surface of the core, thereby forming the depressions.

Abstract translation: 焊球容易获得所需量的用于焊接接头的焊料材料，而不增加形成覆盖芯的焊料层的厚度。 焊球包括在其外表面上具有凹陷的导电芯，以及形成为以填充芯的凹陷的方式覆盖芯的外表面的焊料层。 因此，包含在球中的焊料材料的量由填充到凹部中的焊料材料补充。 优选地，芯具有比焊料层更高的熔点和对焊料层的润湿性。 芯可以在其内部具有空腔，从而形成壳形芯。 芯可以由具有孔的多孔金属体制成，其中一部分孔到达芯的外表面，从而形成凹陷。

公开(公告)号：US06189203B1

公开(公告)日：2001-02-20

申请号：US09288750

申请日：1999-04-08

Applicant: Randy T. Heinrich ,  Allen F. Rozman ,  Thang D. Truong ,  William L. Woods, Jr.

Inventor： Randy T. Heinrich ,  Allen F. Rozman ,  Thang D. Truong ,  William L. Woods, Jr.

IPC: H01F4106

CPC classification number: H05K1/165 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10234 ,  H05K2201/10257 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49126

Abstract: A surface mountable power supply and a method of manufacturing the power supply. In one embodiment, the power supply includes: (1) a substrate having opposing upper and lower conductive layers (2) a lower electrical component having a first lead mounted on a first pad on the lower conductive layer and subject to forces capable of detaching the lower electrical component from the substrate when the power supply passes through a reflow soldering process, (3) an upper electrical component having a second lead mounted on a second pad on the upper conductive layer, (4) a solder located proximate the first lead, the lower electrical component of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the lower electrical component in contact with the lower conductive layer as the power supply passes through the reflow soldering process, (5) a planar magnetic device mounted on the substrate, the planar magnetic device having windings formed from a portion of conductive traces on the upper and lower conductive layers and a core disposed through apertures of the substrate and proximate the windings and (6) an inter-substrate conductive mount, coupled to the lower conductive layer, composed of a material having a melting point above a solder reflow temperature and adapted to mount the power supply to an adjacent substrate and provide a conductive path therebetween, the conductive mount including first and second compliant solder joints at interfaces of the substrate and the adjacent substrate, respectively.

Abstract translation: 一种可表面安装的电源和一种制造电源的方法。 在一个实施例中，电源包括：（1）具有相对的上和下导电层（2）的衬底，下电气部件具有安装在下导电层上的第一焊盘上的第一引线，并受到能够分离 当电源通过回流焊接工艺时，从基板上降低电气部件，（3）具有安装在上导电层上的第二焊盘上的第二引线的上部电气部件，（4）位于第一引线附近的焊料， 较低的电气部件具有足够低的重量，使得当电源通过回流焊接工艺时，焊料的液态的表面张力足以保持较低的电气部件与下导电层接触;（5） 安装在基板上的平面磁性装置，该平面磁性装置具有由上和下导电层上的一部分导电迹线形成的绕组 以及通过所述基板的孔径并且靠近所述绕组设置的芯体，以及（6）连接到所述下导电层的衬底间导电安装件，所述衬底由具有高于焊料回流温度的熔点的材料组成，并且适于安装所述功率 供应到相邻基板并在其间提供导电路径，导电安装座分别包括在基板和相邻基板的界面处的第一和第二柔性焊接点。

公开(公告)号：US06092280A

公开(公告)日：2000-07-25

申请号：US318952

申请日：1999-05-26

Applicant: Robert John Wojnarowski

Inventor： Robert John Wojnarowski

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/32 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R43/00 ,  H01L23/40

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K3/326 ,  H05K3/4092 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T428/24917

Abstract: A flexible film interface includes a flexible film; flexible material attached to a portion of the flexible film; surface metallization on the flexible material, the flexible film having at least one via extending therethrough to the surface metallization; and a floating pad structure including floating pad metallization patterned over the flexible material and the surface metallization, a first portion of the floating pad metallization forming a central pad and a second portion of the floating pad metallization forming at least one extension from the central pad and extending into the at least one via.

Abstract translation: 柔性膜界面包括柔性膜; 柔性材料附着在柔性膜的一部分上; 在柔性材料上的表面金属化，所述柔性膜具有至少一个通过其延伸到表面金属化的通孔; 以及浮动焊盘结构，其包括在所述柔性材料和所述表面金属化之上图案化的浮动焊盘金属化，所述浮动焊盘金属化的第一部分形成中心焊盘，并且所述浮动焊盘金属化的第二部分形成从所述中心焊盘的至少一个延伸部， 延伸到所述至少一个通孔中。

公开(公告)号：US6046410A

公开(公告)日：2000-04-04

申请号：US139049

申请日：1998-08-24

Applicant: Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

Inventor： Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

IPC: H01L21/48 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K3/326 ,  H05K3/4092 ,  Y02P70/613 ,  Y10S438/94 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole. A conductive contact area interface may include an electrically conductive first contact area; an electrically conductive second contact area facing and being substantially aligned with the first contact area; and at least one interface structure coupled between the first and second contact areas and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

Abstract translation: 界面包括具有导电垫的表面; 表面上的柔顺涂层具有延伸到垫的通孔; 金属化图案化在柔性涂层上并延伸到通孔中; 覆盖顺应性涂层并具有延伸到金属化的界面的低模量介电界面层; 以及浮动衬垫结构，其包括在电介质界面层上图案化的浮动衬垫金属化，第一部分形成中心焊盘，第二部分形成从延伸到接口通孔的中心焊盘的延伸部分。 另一个界面包括一个衬底，该衬底包括一个具有至少部分贯穿其中延伸的孔的低模量介电界面材料，以及一个浮动接触结构，其包括导电材料，该导电材料涂覆孔，浮动金属化中的至少一些从孔形成延伸。 导电接触区界面可以包括导电的第一接触区域; 面向并基本上与第一接触区域对准的导电的第二接触区域; 以及耦合在所述第一和第二接触区域之间的至少一个接口结构，并且包括具有部分敞开的内部的电导体，以在所述第一和第二接触区域之间形成柔性接头。

公开(公告)号：WO2019072475A1

公开(公告)日：2019-04-18

申请号：PCT/EP2018/074489

申请日：2018-09-11

Applicant: ENDRESS+HAUSER SE+CO. KG

Inventor： STRÜTT, Bernd ,  GERWIG, Simon ,  BAUER, Max

IPC: H05K3/28 ,  H05K3/34

CPC classification number: H05K3/284 ,  H01L21/50 ,  H01L23/04 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/181 ,  H05K3/303 ,  H05K3/341 ,  H05K2201/10257 ,  H05K2201/10371 ,  H05K2201/10606 ,  H05K2201/2018 ,  H05K2203/043 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Die Erfindung betrifft ein Verfahren zur mechanischen Kontaktierung insbesondere eines Vergussrahmens (1) auf einer Leiterplatte (20) einer elektronischen Baugruppe (2). Hierzu weist der Vergussrahmen (1) zumindest eine metallische Kontaktfläche (11) auf; Die Leiterplatte (20) weist eine Grundfläche (21) auf, die korrespondierend zur Kontaktfläche (11) metallisch strukturiert ist. Das Verfahren umfasst folgende Verfahrensschritte: Positionieren der mechanischen Komponente (1) mit Orientierung der Kontaktfläche (11) zu der korrespondierenden Grundfläche (21) hin, und Verlöten der mechanischen Komponente (1) mit der Leiterplatte (20) über die Kontaktfläche (11) und die Grundfläche (21). Damit bietet das erfindungsgemäße Verfahren zum einen den Vorteil, dass eine materialsparende Kapselung für elektronische Baugruppen (2) in explosionsgefährdeten Bereichen bereitgestellt werden kann. Gleichzeitig kann auf einen zusätzlichen Prozessschritt zur mechanischen Kontaktierung der Kapselung auf der Leiterplatte (20) verzichtet werden, da das mechanische Kontaktieren des Vergussrahmens (1) in einem Prozessschritt zusammen mit dem Verlöten der weiteren elektrischen Bauteile (3) auf der Leiterplatte (20) durchgeführt werden kann.