公开(公告)号：US10465069B2

公开(公告)日：2019-11-05

申请号：US15744579

申请日：2016-04-08

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing Chen ,  Xianping Zeng

IPC: C08L71/12 ,  B32B27/00 ,  C08J5/24 ,  C08L9/06 ,  B32B27/28 ,  C08L25/10 ,  H05K1/03

Abstract: Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl resin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative aging resistance.

公开(公告)号：US20190300649A1

公开(公告)日：2019-10-03

申请号：US16468534

申请日：2017-05-15

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yundong MENG ,  Kehong FANG ,  Ying XU

IPC: C08G65/48 ,  C08L25/06 ,  C08L63/00 ,  C08L69/00 ,  C08L71/12 ,  C08L79/04 ,  C08K3/013 ,  C08K3/22

Abstract: The present invention relates to a flame-retardant polyphenylene ether resin composition, comprising, by weight percent: (A) 10-45% of a phosphorus-containing polyphenylene ether resin with a number-average molecular weight of 1000-6000; (B) 10-50% of an epoxy resin composition; (C) 10-50% of a cyanate ester resin; and (D) 10-30% of a soluble halogen flame retardant. The present invention adopts a phosphorus-containing polyphenylene ether resin with a low molecular weight that, when used in combination with an epoxy resin, a cyanate ester, and the like, improves the compatibility of the system and reduces a phase separation area of the system, and increases the adhesive force of a plate and enhances the toughness of the plate. The present invention adopts a soluble halogen flame retardant to further enhance the homogeneity of the resin system, and provides better uniformity, increased adhesion, and a lower dielectric constant and dielectric loss of the plate.

公开(公告)号：US10400099B2

公开(公告)日：2019-09-03

申请号：US15318787

申请日：2016-09-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hui Li ,  Kehong Fang ,  Yongjing Xu

IPC: H05K1/03 ,  B32B27/38 ,  B32B15/092 ,  B32B27/04 ,  B32B27/18 ,  C08G59/42 ,  C08G59/40 ,  C08G59/50 ,  C08G73/06 ,  C08J5/04 ,  C08J5/24 ,  C08L63/00 ,  C08L63/08 ,  C08L35/06 ,  C08L79/04 ,  C08F222/08 ,  H01B3/40 ,  C08K13/02 ,  C08G59/62 ,  C08G73/02 ,  C08G14/06 ,  C08L61/34

Abstract: The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

公开(公告)号：US20180346675A1

公开(公告)日：2018-12-06

申请号：US15780621

申请日：2016-09-14

Applicant: Shengyi Technology Co., Ltd.

Inventor： Wenxin Chen ,  Cuiming Du ,  Songgang Chai

IPC: C08J9/10 ,  C08J5/24 ,  C08L79/08 ,  C08L71/00 ,  C08L67/00 ,  C08L63/00 ,  C08L83/04 ,  C08K5/00

CPC classification number: B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  C08J5/24 ,  C08J9/10 ,  C08J9/28 ,  C08L61/06 ,  C08L63/00 ,  H05K1/03

Abstract: A thermosetting resin composition. The composition comprises thermosetting resin, a cross-linking agent, accelerator, and a porogen. The porogen is a porogen capable of being dissolved in an organic solvent. The organic solvent is an organic solvent capable of dissolving the thermosetting resin. A mode of directly adding the dissolvable porogen to a resin system is used, tiny pores that are uniform in pore diameter can be evenly distributed in resin matrix by means of a simple process at low cost, and the high-performance composition having a low dielectric constant and low dielectric loss is obtained; the method has good applicability to a great number of resin systems; because the pore size in the system reaches a nanometer grade, performance of the final system, such as mechanical strength, thermal performance and water absorption rate, is not sacrificed.

公开(公告)号：US20180327558A1

公开(公告)日：2018-11-15

申请号：US15525884

申请日：2014-12-02

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hui Li ,  Kehong Fang

IPC: C08J5/24 ,  B32B5/02 ,  B32B27/12 ,  B32B27/38 ,  C08L63/00 ,  H05K1/03

CPC classification number: C08J5/24 ,  B32B5/022 ,  B32B5/024 ,  B32B27/04 ,  B32B27/12 ,  B32B27/38 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2262/101 ,  B32B2457/08 ,  C08J2363/00 ,  C08J2435/06 ,  C08J2471/12 ,  C08J2479/04 ,  C08L63/00 ,  C08L2201/02 ,  H05K1/0373 ,  H05K1/038 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/029 ,  C08K3/36 ,  C08L35/06 ,  C08L71/12

Abstract: A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.

公开(公告)号：US20180223093A1

公开(公告)日：2018-08-09

申请号：US15743978

申请日：2015-12-07

Applicant: Shengyi Technology Co., Ltd.

Inventor： Ying XU ,  Kehong FANG

IPC: C08L63/00 ,  C08G59/50 ,  C08G59/62 ,  C08J5/24 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  B32B15/18 ,  H05K1/03

CPC classification number: C08L63/00 ,  B32B5/26 ,  B32B15/092 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/04 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2457/08 ,  C08G59/5033 ,  C08G59/504 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/03 ,  C08K5/523 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/03 ,  C08L2312/04 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/012 ,  C08K5/0066

Abstract: The present invention relates to an epoxy resin composition for a copper clad laminate, and an application of the epoxy resin composition. The epoxy resin composition contains phosphorus-containing and bromine-containing flame retardant additives, and may be used for the preparation of pre-pregs and copper clad laminates. By using brominated polystyrene, decabromodiphenyl ethane etc. as bromine sources and taking a phosphazene, melamine polyphosphate, aluminum metaphosphate or melamine cyanurate etc. as phosphorus sources, and adjusting the proportions of the phosphorus-containing and bromine-containing flame retardant additives within the composition, the bromine content is controlled at 5-12%, the phosphorus content is controlled at 0.2-1.5%, and the flame retardancy achieves the level of UL94 V-0. Compared to pure bromine flame retardant copper clad laminates, the heat resistance is higher, and a higher CTI value is achieved. Compared to pure phosphorus flame retardant copper clad laminates, the moisture absorption is lower, and the adhesion performance and process operability required for printed circuit substrates are provided. Compared to the use of a large amount of aluminum hydroxide in traditional high CTI sheet material, the present invention achieves CTI>600V using a small amount of aluminum hydroxide or without using aluminum hydroxide.

公开(公告)号：US10030143B2

公开(公告)日：2018-07-24

申请号：US15539436

申请日：2015-06-01

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Suwen Ye ,  Guofang Tang

IPC: C08K3/34 ,  B32B3/26 ,  B27N3/10 ,  C08L83/04 ,  C08K13/02 ,  B32B15/08

Abstract: The present invention relates to a ceramized silicone resin composition and a pre-preg and a laminate that use the composition. The ceramized silicone resin composition comprises: 50-100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, 5-80 parts of a ceramic-forming filler, and 0.01-50 parts of a flux. The pre-preg and the laminate manufactured using the ceramized silicone resin composition, when used in a sustained high temperature, can transform into complex ceramized structure thereby providing ceramic properties, thus providing great fireproof and flame retardant effects; also, manufacturing of the laminate is similar to that of a regular FR-4 laminate, where the process is easy to operate. The ceramized silicone resin composition, the pre-preg, and the laminate have the advantages of being halogen-free, low smoke, low toxicity, flame retardant, and fireproof, provide a novel concept and a novel method in terms of flame retardancy and fire resistance, accelerate the research progress in laminate passive fire protection technology, and have broad prospects in the field of fire protection and fire resistance.

公开(公告)号：US20180201776A1

公开(公告)日：2018-07-19

申请号：US15744005

申请日：2015-12-07

Applicant: Shengyi Technology Co., Ltd.

Inventor： Ying XU ,  Kehong FANG

IPC: C08L63/00 ,  C08J5/24 ,  C08G59/50 ,  C08G59/30 ,  C08G59/38 ,  B32B5/26 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03

CPC classification number: C08L63/00 ,  B32B5/02 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B27/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2457/08 ,  C08G59/304 ,  C08G59/308 ,  C08G59/38 ,  C08G59/5033 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2463/02 ,  C08K5/03 ,  C08K5/523 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/03 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08K5/0025 ,  C08K5/18 ,  C08L61/04 ,  C08K5/3445 ,  C08K5/50 ,  C08K3/013

Abstract: The present invention relates to an epoxy resin composition for a copper clad laminate, and an application of the epoxy resin composition. The epoxy resin composition may be used for the preparation of pre-pregs and copper clad laminates. By using brominated epoxy resin such as a low bromine epoxy resin and a high bromine epoxy resin as bromine sources and taking a phosphorus-containing phenanthrene-type compound as a phosphorus source, and adjusting the proportions of the brominated epoxy resins and the phosphorus-containing phenanthrene-type compound within the epoxy resin composition, the bromine content is controlled at 5-12%, the phosphorus content is controlled at 0.2-1.5%, and the flame retardancy achieves the level of UL94 V-0. Compared to pure bromine flame retardant copper clad laminates, the heat resistance is higher, and a higher CTI value is achieved. Compared to pure phosphorus flame retardant copper clad laminates, the moisture absorption is low, and the adhesion performance and process operability required for printed circuit substrates are provided. Compared to the use of a large amount of aluminum hydroxide in traditional high CTI sheet material, the present invention achieves CTI>600V using a small amount of aluminum hydroxide or without using aluminium hydroxide.

公开(公告)号：US20180126701A1

公开(公告)日：2018-05-10

申请号：US15529335

申请日：2016-09-08

Applicant: Shengyi Technology Co., Ltd.

Inventor： Jiang YOU ,  Tianhui HUANG ,  Yongjing XU ,  Zhongqiang YANG

IPC: B32B15/092 ,  C08L63/00 ,  B32B27/18 ,  C08K3/36 ,  C08K5/357 ,  C08G59/62 ,  C08G59/32

CPC classification number: B32B15/092 ,  B32B27/18 ,  B32B33/00 ,  C08G59/32 ,  C08G59/62 ,  C08J2300/24 ,  C08K3/36 ,  C08K5/357 ,  C08L63/00

Abstract: The present invention relates to a halogen-free thermosetting resin composition, a prepreg and a laminate for printed circuit boards using the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 16 to 42 parts by weight of a halogen-free epoxy resin, (B) from 1.5 to 4.8 parts by weight of a compound containing dihydrobenzoxazine ring; (C) from 10 to 28 parts by weight of a phosphorus-containing bisphenol curing agent, wherein the phosphorus-containing bisphenol curing agent has a weight average molecular weight of 1000-6500, and (D) from 30 to 70 parts by weight of silicon dioxide. The prepreg and laminate for printed circuit boards prepared from the halogen-free thermosetting resin composition have high glass transition temperature, excellent dielectric performances, low water absorption, high heat resistance and better processability, and can achieve halogen-free flame retardancy and UL94 V-0.

公开(公告)号：US20180037705A1

公开(公告)日：2018-02-08

申请号：US15555826

申请日：2015-09-18

Applicant: Shengyi Technology Co., Ltd.

Inventor： Xianping ZENG ,  Guangbing CHEN ,  Chiji GUAN ,  Wenhua YANG

IPC: C08J5/24 ,  H05K1/03 ,  B32B37/10 ,  C08L71/12 ,  B32B15/20 ,  B32B15/085

Abstract: Provided in the present invention are a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of a polyolefin resin and a bifunctional maleimide or a multifunctional maleimide; and, (B) vinyl thermosetting polyphenylene ether, where with the weight of the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide being 100 parts by weight, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight. The present invention, by employing the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the polyolefin resin and vinyl thermosetting polyphenylene ether. An aqueous glue solution so mixed is uniform and consistent, the pre-preg has a uniform expression, and a substrate resin area is free of a phase-separation problem.