公开(公告)号：US20190300649A1

公开(公告)日：2019-10-03

申请号：US16468534

申请日：2017-05-15

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yundong MENG ,  Kehong FANG ,  Ying XU

IPC: C08G65/48 ,  C08L25/06 ,  C08L63/00 ,  C08L69/00 ,  C08L71/12 ,  C08L79/04 ,  C08K3/013 ,  C08K3/22

Abstract: The present invention relates to a flame-retardant polyphenylene ether resin composition, comprising, by weight percent: (A) 10-45% of a phosphorus-containing polyphenylene ether resin with a number-average molecular weight of 1000-6000; (B) 10-50% of an epoxy resin composition; (C) 10-50% of a cyanate ester resin; and (D) 10-30% of a soluble halogen flame retardant. The present invention adopts a phosphorus-containing polyphenylene ether resin with a low molecular weight that, when used in combination with an epoxy resin, a cyanate ester, and the like, improves the compatibility of the system and reduces a phase separation area of the system, and increases the adhesive force of a plate and enhances the toughness of the plate. The present invention adopts a soluble halogen flame retardant to further enhance the homogeneity of the resin system, and provides better uniformity, increased adhesion, and a lower dielectric constant and dielectric loss of the plate.

公开(公告)号：US20180223093A1

公开(公告)日：2018-08-09

申请号：US15743978

申请日：2015-12-07

Applicant: Shengyi Technology Co., Ltd.

Inventor： Ying XU ,  Kehong FANG

IPC: C08L63/00 ,  C08G59/50 ,  C08G59/62 ,  C08J5/24 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  B32B15/18 ,  H05K1/03

CPC classification number: C08L63/00 ,  B32B5/26 ,  B32B15/092 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/04 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2457/08 ,  C08G59/5033 ,  C08G59/504 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/03 ,  C08K5/523 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/03 ,  C08L2312/04 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/012 ,  C08K5/0066

Abstract: The present invention relates to an epoxy resin composition for a copper clad laminate, and an application of the epoxy resin composition. The epoxy resin composition contains phosphorus-containing and bromine-containing flame retardant additives, and may be used for the preparation of pre-pregs and copper clad laminates. By using brominated polystyrene, decabromodiphenyl ethane etc. as bromine sources and taking a phosphazene, melamine polyphosphate, aluminum metaphosphate or melamine cyanurate etc. as phosphorus sources, and adjusting the proportions of the phosphorus-containing and bromine-containing flame retardant additives within the composition, the bromine content is controlled at 5-12%, the phosphorus content is controlled at 0.2-1.5%, and the flame retardancy achieves the level of UL94 V-0. Compared to pure bromine flame retardant copper clad laminates, the heat resistance is higher, and a higher CTI value is achieved. Compared to pure phosphorus flame retardant copper clad laminates, the moisture absorption is lower, and the adhesion performance and process operability required for printed circuit substrates are provided. Compared to the use of a large amount of aluminum hydroxide in traditional high CTI sheet material, the present invention achieves CTI>600V using a small amount of aluminum hydroxide or without using aluminum hydroxide.

公开(公告)号：US20180201776A1

公开(公告)日：2018-07-19

申请号：US15744005

申请日：2015-12-07

Applicant: Shengyi Technology Co., Ltd.

Inventor： Ying XU ,  Kehong FANG

IPC: C08L63/00 ,  C08J5/24 ,  C08G59/50 ,  C08G59/30 ,  C08G59/38 ,  B32B5/26 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03

CPC classification number: C08L63/00 ,  B32B5/02 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B27/04 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2457/08 ,  C08G59/304 ,  C08G59/308 ,  C08G59/38 ,  C08G59/5033 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2463/02 ,  C08K5/03 ,  C08K5/523 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/03 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08K5/0025 ,  C08K5/18 ,  C08L61/04 ,  C08K5/3445 ,  C08K5/50 ,  C08K3/013

Abstract: The present invention relates to an epoxy resin composition for a copper clad laminate, and an application of the epoxy resin composition. The epoxy resin composition may be used for the preparation of pre-pregs and copper clad laminates. By using brominated epoxy resin such as a low bromine epoxy resin and a high bromine epoxy resin as bromine sources and taking a phosphorus-containing phenanthrene-type compound as a phosphorus source, and adjusting the proportions of the brominated epoxy resins and the phosphorus-containing phenanthrene-type compound within the epoxy resin composition, the bromine content is controlled at 5-12%, the phosphorus content is controlled at 0.2-1.5%, and the flame retardancy achieves the level of UL94 V-0. Compared to pure bromine flame retardant copper clad laminates, the heat resistance is higher, and a higher CTI value is achieved. Compared to pure phosphorus flame retardant copper clad laminates, the moisture absorption is low, and the adhesion performance and process operability required for printed circuit substrates are provided. Compared to the use of a large amount of aluminum hydroxide in traditional high CTI sheet material, the present invention achieves CTI>600V using a small amount of aluminum hydroxide or without using aluminium hydroxide.

公开(公告)号：US20180201761A1

公开(公告)日：2018-07-19

申请号：US15743930

申请日：2015-12-07

Applicant: Shengyi Technology Co., Ltd.

Inventor： Ying XU ,  Kehong FANG

IPC: C08K5/53 ,  C08K3/22 ,  C08K3/30 ,  C08K5/136 ,  C08G59/50 ,  C08J5/24 ,  B32B5/26 ,  B32B5/02 ,  B32B15/14 ,  H05K1/03

CPC classification number: C08K5/53 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B15/14 ,  B32B27/04 ,  B32B27/18 ,  B32B27/38 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2457/08 ,  C08G59/38 ,  C08G59/5033 ,  C08G59/621 ,  C08G59/686 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08K3/22 ,  C08K3/30 ,  C08K3/34 ,  C08K5/136 ,  C08K2003/2227 ,  C08K2003/3045 ,  C08K2201/005 ,  H05K1/034 ,  H05K1/0373 ,  H05K2201/012

Abstract: The present invention relates to an epoxy resin composition for a copper clad laminate, and an application of the epoxy resin composition. The epoxy resin composition may be used for the preparation of pre-pregs and copper clad laminates. By respectively using brominated bisphenol A and a phosphorus-containing phenolic aldehyde as bromine and phosphorus sources, and adjusting the proportions of the brominated bisphenol A and the phosphorus-containing phenolic aldehyde within the epoxy resin composition, the bromine content is controlled at 5-12%, the phosphorus content is controlled at 0.2-1.5%, and the flame retardancy achieves the level of UL94 V-0. Pre-pregs and laminates manufactured using the epoxy resin composition have reduced halogen content and improved heat resistance. Substrate pressure resistance is improved, moisture absorption is low, adhesion, reactivity and processability are good, comparative tracking index (CTI)>600V is satisfied, and production costs are significantly reduced.