Abstract:
The device is used for cooling hot exhaust gas in low- pressure CVD coating device, which is necessary for depositing silicon insulating film in manufacturing semiconductor elements. The device comprises main body (1) having inlet/outlet flanges (1a)(1b) for absorbing or discharging exhaust gas; sealed liquid nitrogen container (3) having inlet (3a) and outlet (3b) and fixed at upper panel (2) on the main body; copper-made spiral coil tube (4) for flowing cooling water; o-ring (6) inserted between the upper panel (2) and lower panel (5).
Abstract:
The apparatus includes a plurality of pressure sensors (PS1- PS5) for detecting the pressures of the respective reactors to convert them into voltage signals. A power supplying and reading circuit supplies power to the pressure sensors (PS1-PS5), and vacuum valves (V1-V5) are connected to the respective reaction chambers. A throttle valve adjusts the pressure of the reaction chambers, and a vacuum pump produces vacuum within discharge tubes, while an interface board transmits and receives analogue signals representing the pressures of the chambers, to transmit the signals between the power supplying and reading circuit and a throttle valve controller.
Abstract:
The lens used for producing the semiconductor element, enables it to change the lens factors such as clearance, thickness, radius of the electrode, and to improve the focusing characteristics of lens without rebuilding of the whole electrode structure. The equipotential electrostatic lens composed of three electrodes, has the first electrode (100) with insert electrode (110), second electrode (200) with the insert electrode (210), and third electrode (300) with the insert electrode (310). An insert electrode is composed of the plate type electrode (7) laminated with two more plies. The lens suppresses increasing of the excessive voltage according to increasing of ion-beam energy, reduces the danger from electric discharge, and stabilizes the lenses.