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    Mold for transferring pattern and transfer device
    114.
    发明专利
    Mold for transferring pattern and transfer device 审中-公开
    用于传送图案和传送设备的模具

    公开(公告)号：JP2006245072A

    公开(公告)日：2006-09-14

    申请号：JP2005055097

    申请日：2005-02-28

    Applicant: Canon Inc ,  キヤノン株式会社

    Inventor： TOKITA TOSHINOBU ,  OTA HIROHISA ,  KAWAKAMI EIGO ,  HARUMI KAZUYUKI ,  NAKAMURA TAKU

    IPC: H01L21/027 ,  B81C99/00

    CPC classification number: B82Y10/00 ,  B81C99/009 ,  B81C2201/0152 ,  B81C2201/036 ,  B82Y40/00 ,  G03F7/0002

    Abstract: PROBLEM TO BE SOLVED: To make easily and certainly a mold release starting point, in a pattern transfer that uses a mold.
    SOLUTION: The mold used for a transferring device transfers a pattern to an optical curing resin, while stiffening this optical curing resin, by bringing a mold 1 in which the pattern is formed into contact to the optical curing resin 8 on a substrate 2, and a light is irradiated. In the transfer device using this, a second region 1b is formed to the exterior of the first region 1a, in which this pattern is formed in the bottom in which the pattern in the mold, is formed. The second region is referred to as a mold release shape 1c for making a part which makes the mold, photocuring resin after curing and secession start.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：使用模具的图案转印中，易于确定脱模起点。 解决方案：用于转印装置的模具将图案转移到光固化树脂，同时通过使形成图案的模具1与基板上的光固化树脂8接触而使该光固化树脂硬化 2，照射光。 在使用它的转印装置中，第二区域1b形成在第一区域1a的外部，其中形成有模具中的图案的底部形成图案。 第二区域被称为用于制造使模具的一部分，固化和分离开始后的光固化树脂的脱模形状1c。 版权所有（C）2006，JPO＆NCIPI

    FLUIDIC MODULE FABRICATION WITH HETEROGENEOUS CHANNEL-FORMING LAMINATES
    116.
    发明申请
    FLUIDIC MODULE FABRICATION WITH HETEROGENEOUS CHANNEL-FORMING LAMINATES 审中-公开
    具有异构通道成型层压板的流体模块制造

    公开(公告)号：WO2012071178A1

    公开(公告)日：2012-05-31

    申请号：PCT/US2011/060080

    申请日：2011-11-10

    Applicant: CORNING INCORPORATED ,  GROULT, Aline Martine Marie ,  MARQUES, Paulo Gaspar Jorge ,  SELLAM, Armand

    Inventor： GROULT, Aline Martine Marie ,  MARQUES, Paulo Gaspar Jorge ,  SELLAM, Armand

    IPC: C03B23/02

    CPC classification number: C03B23/02 ,  B81B2201/051 ,  B81B2203/0338 ,  B81C99/0085 ,  B81C2201/019 ,  B81C2201/036

    Abstract: A method is provided for fabricating a fluidic module (80) comprising fluidic channels (60) defined within a glass or glass-ceramic structure. According to the method, a heterogeneous channel-forming laminate (10) is provided comprising a mold-engaging layer (20) and a laminate backbone (30). The laminate backbone (30) comprises a vitreous body defining a supportive viscosity µ B . A channel-forming mold (50) is pressed into engagement with the mold-engaging layer (20) of the channel forming laminate (10) at a molding temperature T M to form fluidic channel components (40) in the channel-forming laminate (10). The molding viscosity µ M of the mold-engaging layer (20) is less than the supportive viscosity µB of the laminate backbone (30) at the molding temperature T M . The pressed channel-forming laminate (10') is stacked with a plurality of complementary pressed channel forming laminates (10') to define a plurality of fluidic channels (60) in a stacked laminate structure (70). The plurality of fluidic channels (60) in the stacked laminate structure (70) is sealed at a sealing temperature T S that is less than the molding temperature T M and above a softening point temperature of the mold-engaging layer (20). Fluidic modules (80) comprising a stacked laminate structure (70) are also provided.

    Abstract translation: 提供了一种用于制造流体模块（80）的方法，流体模块（80）包括限定在玻璃或玻璃 - 陶瓷结构内的流体通道（60）。 根据该方法，提供了包含模具接合层（20）和层叠骨架（30）的非均匀通道形成层叠体（10）。 层压骨架（30）包括限定支撑粘度μB的玻璃体。 通道形成模具（50）在成形温度TM下被挤压成与通道形成叠片（10）的模具接合层（20）接合，以在通道形成叠层（10）中形成流体通道部件（40） ）。 模具接合层（20）的成型粘度μM小于成型温度TM下层压骨架（30）的支撑粘度μB。 压制通道形成层压板（10'）堆叠有多个互补压制通道形成层压板（10'），以在层叠的层叠结构（70）中限定多个流体通道（60）。 堆叠的层压结构（70）中的多个流体通道（60）在小于成型温度TM且高于模具接合层（20）的软化点温度的密封温度TS下密封。 还提供了包括堆叠层叠结构（70）的流体模块（80）。

    METHOD FOR MANUFACTURING MICROSTRUCTURES HAVING MULTIPLE MICROELEMENTS WITH THROUGH-HOLES
    119.
    发明申请
    METHOD FOR MANUFACTURING MICROSTRUCTURES HAVING MULTIPLE MICROELEMENTS WITH THROUGH-HOLES 审中-公开
    制造具有多孔微量元素的微结构的方法

    公开(公告)号：WO2004076339A2

    公开(公告)日：2004-09-10

    申请号：PCT/US2004/005382

    申请日：2004-02-24

    Applicant: THE PROCTER & GAMBLE COMPANY ,  GARTSTEIN, Vladimir ,  SHERMAN, Faiz, Feisal

    Inventor： GARTSTEIN, Vladimir ,  SHERMAN, Faiz, Feisal

    IPC: B81B1/00

    CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B26F1/24 ,  B26F1/26 ,  B81B2201/055 ,  B81C2201/034 ,  B81C2201/036

    Abstract: A method is provided for manufacturing microstructures of the type which contain a substrate and an array of protruding microelements with through-holes, which are used in penetrating layers of skin. The microelements are embossed or pressed into an initial substrate structure, which in some embodiments is formed from extruded polymeric material, and in some cases from two layers of polymer that are co-extruded. The through-holes are formed from filled through-cylinders of a second material that is removed after the embossing or pressing step; in other instances, the through-holes are left hollow during the embossing or pressing step.

    Abstract translation: 提供了一种用于制造包含基底的微结构的方法和具有通孔的突出微元件阵列，其用于穿透皮肤层。 微元件被压花或压制成初始的基底结构，其在一些实施方案中由挤出的聚合物材料形成，并且在一些情况下由共挤出的两层聚合物形成。 通孔由在压花或压制步骤之后被去除的第二材料的填充的通孔形成; 在其他情况下，在压花或压制步骤期间，通孔留空。

    METHODS FOR PATTERNING USING LIQUID EMBOSSING
    120.
    发明申请
    METHODS FOR PATTERNING USING LIQUID EMBOSSING 审中-公开
    使用液体压痕的方法

    公开(公告)号：WO2003031136A2

    公开(公告)日：2003-04-17

    申请号：PCT/US2002/032747

    申请日：2002-10-11

    Applicant: NANOTECTONICA, INC.

    Inventor： BULTHAUP, Colin ,  SPINDT, Chris

    IPC: B29C

    CPC classification number: G03F7/0002 ,  B29C43/021 ,  B29C2043/023 ,  B41M1/24 ,  B41M3/006 ,  B81C1/0046 ,  B81C2201/036 ,  B82Y10/00 ,  B82Y40/00 ,  H01L51/0004

    Abstract: The current invention is directed to a method of patterning a surface or layer in the fabrication of a micro-device. In accordance with a preferred embodiment of the invention, a first mask structure is formed by depositing a layer of a first material onto the surface or layer and embossing the layer with a micro-stamp structure. The layer is preferably embossed as a liquid, which is solidified or cured to form the first mask structure. The first mask structure can be used as an etch-stop mask which is removed in a subsequent processing step or, alternatively, the first mask structure can remain a functional layer of the micro-device. In further embodiments, unmasked regions of the surface or layer are chemically treated through the first mask structure and/or a second material is deposited onto the unmasked regions of the surface or layer through the first mask structure to form a second mask structure and/or a second functional layer of the micro-device.

    Abstract translation: 本发明涉及在微型器件的制造中图案化表面或层的方法。 根据本发明的优选实施例，通过在表面或层上沉积第一材料层并用微型印模结构压印该层来形成第一掩模结构。 该层优选为液体压花，其被固化或固化以形成第一掩模结构。 第一掩模结构可以用作在后续处理步骤中去除的蚀刻停止掩模，或者替代地，第一掩模结构可以保留在微型器件的功能层。 在另外的实施例中，通过第一掩模结构化学处理表面或层的未掩蔽区域，和/或通过第一掩模结构将第二材料沉积到表面或层的未掩蔽区域上，以形成第二掩模结构和/或 微器件的第二功能层。

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