-
公开(公告)号：EP0700237A1
公开(公告)日：1996-03-06
申请号：EP95202970.0
申请日：1992-05-19
Applicant: AMP-Akzo LinLam VOF
Inventor： Middelman, Erik , Zuuring, Pieter Hendrik
CPC classification number: H05K1/0366 , B32B5/12 , H05K2201/0287
Abstract: The invention is a printed wire board laminate comprising resin layers reinforced with parallel, unidirectional fibres, the laminate having a thickness factor of below 5,5. The thickness factor is the ratio of the thickness of the substrate in µm and the average titer (linear density) of the yarn used (in tex). The laminates can be made using a method in which a high extent of filament spreading can be retained by virtue of at least partial curing of the UD-reinforced layers.
Abstract translation: 本发明是一种印刷线路板层叠体，其包含用平行的单向纤维增强的树脂层，层压体的厚度因子低于5.5。 厚度系数是以μm为单位的基板厚度与所用纱线的平均滴度（线密度）之比（tex）。 层压体可以通过使UD增强层至少部分固化而能够保持高范围的细丝展开的方法制成。
-
112.发明公开
公开(公告)号：EP0478051A3
公开(公告)日：1992-06-10
申请号：EP91202360.3
申请日：1991-09-16
Applicant: AMP-Akzo LinLam VOF
Inventor： Middelman, Erik
CPC classification number: B29C70/16 , B29C67/20 , B29C70/202 , B29C70/50 , B29K2105/0076 , B29L2031/3425 , B32B38/18 , B32B2038/1891 , H05K1/0366 , H05K2201/0287
Abstract: A method for the manufacture in a continuous process of a flat substrate from a fibres-reinforced matrix for a printed circuit, in which use is made of at least two moving layers of reinforcing fibres (5,11) and the fibres are positioned in at least two crossing directions, whereupon the filaments layers provided with matrix material, optionally together with one or more electrical conducting layers, such as a metal foil (20,21), and/or insulating layers on one or on either outer side, are passed through a preferably heated laminating zone, such as a double belt press (22,23), characterized in that use is made of filaments-containing layers made up of a plurality of mutually parallel filaments that are not bound in the form of a fabric and extend substantially linear.
-
113.发明公开
公开(公告)号：EP0478051A2
公开(公告)日：1992-04-01
申请号：EP91202360.3
申请日：1991-09-16
Applicant: AMP-Akzo LinLam VOF
Inventor： Middelman, Erik
CPC classification number: B29C70/16 , B29C67/20 , B29C70/202 , B29C70/50 , B29K2105/0076 , B29L2031/3425 , B32B38/18 , B32B2038/1891 , H05K1/0366 , H05K2201/0287
Abstract: A method for the manufacture in a continuous process of a flat substrate from a fibres-reinforced matrix for a printed circuit, in which use is made of at least two moving layers of reinforcing fibres (5,11) and the fibres are positioned in at least two crossing directions, whereupon the filaments layers provided with matrix material, optionally together with one or more electrical conducting layers, such as a metal foil (20,21), and/or insulating layers on one or on either outer side, are passed through a preferably heated laminating zone, such as a double belt press (22,23), characterized in that use is made of filaments-containing layers made up of a plurality of mutually parallel filaments that are not bound in the form of a fabric and extend substantially linear.
Abstract translation: 一种用于制造在从用于印刷电路一个纤维增强基体的平坦衬底的连续方法，其中使用了至少两个移动增强纤维（5.11）及纤维层的方法被定位在 至少两个交叉的方向，其中在所述丝层与一个或多个导电层，颜色设置有基体材料，任选地一起：诸如金属箔（20,21），和/或在一个或在任outerside绝缘层，被传递 通过一个优选加热层压区，检查作为双带压机（22,23），其特征在于在没有使用由由相互平行的长丝的多个层含有长丝-并在织物的形式不结合和 基本线性延伸。
-
公开(公告)号：EP0309982A3
公开(公告)日：1990-09-12
申请号：EP88115864.6
申请日：1988-09-27
Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
Inventor： Bolt, John Davis , Button, Daniel Paul , Yost, Bruce Allen
CPC classification number: C08J5/044 , B32B27/04 , H01L23/145 , H01L23/3737 , H01L2924/0002 , H05K1/0366 , H05K2201/0287 , H05K2201/029 , H05K2201/0293 , H05K2201/068 , H01L2924/00
Abstract: A composite containing high purity crystalline ceramic fibers in a polymeric matrix, suitable for use as a microelectronic device package or circuit board. The composite exhibits high thermal conductivity, and low coefficients of thermal expansion in-plane, and moderate thermal conductivities and low dielectric constants out-of-plane.
-
公开(公告)号：KR1020150014562A
公开(公告)日：2015-02-09
申请号：KR1020130089557
申请日：2013-07-29
Applicant: 삼성디스플레이 주식회사
IPC: G09F9/00
CPC classification number: G06F1/1652 , B32B2457/202 , H05K1/0278 , H05K1/028 , H05K1/036 , H05K1/0366 , H05K1/038 , H05K2201/0287 , H05K2201/029 , H05K2201/051 , H05K2201/055
Abstract: 접이식 표시 장치는 가요성을 갖는 연질 영역과 상기 연질 영역의 적어도 일측에 위치한 경질 영역으로 이루어진 베이스 기판과 상기 베이스 기판 상에 제공된 영상 표시 소자를 포함한다. 상기 베이스 기판은 매트릭스와, 상기 매트릭스에 함침되며 상기 연질 영역에 대응하는 연질부와 상기 경질 영역에 대응하는 경질부를 포함하는 직물을 포함한다. 상기 경질부와 상기 연질부는 서로 다르게 직조된다.
Abstract translation: 可折叠显示装置包括：基底，其包括具有柔性的柔软材料区域和位于软质材料区域中的至少一个中的硬化材料区域;以及设置在基底基板上的图像显示装置。 基底基材包括基质，埋在基质中并对应于软质材料区域的软质材料部分和对应于硬化区域的硬化材料部分。 硬化材料部分和软材料部分被不同地制造。
-
Patent Agency Ranking116.发明授权
公开(公告)号：KR100263509B1
公开(公告)日：2000-08-01
申请号：KR1019970707108
申请日：1996-12-17
Applicant: 기비디 이탈리아 에스.피.아.
CPC classification number: H05K1/0366 , D03D15/0011 , D03D19/00 , H05K2201/0287 , H05K2201/029 , Y10S428/901 , Y10T442/102 , Y10T442/3065 , Y10T442/3309
Abstract: 본 발명은 안정화 바인딩사의 역할을 하는 가느다란 유리섬유사와 섞어 짜여져 있으며, 낮은 꼬임수를 갖거나 또는 꼬임이 없는 서로 다른 선밀도의 연속섬유사로 제조된 일방향 유리섬유직물 및 이의 인쇄회로와 기타 다양한 공업적 응용으로의 사용 및 그 제조방법에 관한 것이다.
-
公开(公告)号：US10003087B1
公开(公告)日：2018-06-19
申请号：US14563885
申请日：2014-12-08
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Dick Tak Shing Pang , Anwar Mohammed , Murad Kurwa
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: A stretchable battery and the method of manufacturing the same. The stretchable battery can be manufactured by using a printing process. The construction of the stretchable battery can comprise a first layer of an elastomer film, a first current collector layer, a layer of cathode, a separating layer, a layer of anode, and a second current collector layer. Metal traces can be used to couple with the first and/or the second current collector layers.
-
公开(公告)号：US09867283B2
公开(公告)日：2018-01-09
申请号：US15197736
申请日：2016-06-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jin-gyu Kim , Hyun Lee , Dong-han Kim
IPC: H05K1/03 , H05K1/02 , H01L23/498 , H01L21/48 , H05K3/00
CPC classification number: H05K1/0271 , H01L21/4846 , H01L23/145 , H01L23/49838 , H05K1/03 , H05K1/0366 , H05K3/0011 , H05K2201/0287 , H05K2201/029 , H05K2201/0293 , H05K2201/2009
Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.
-
公开(公告)号：US09839125B1
公开(公告)日：2017-12-05
申请号：US14266723
申请日：2014-04-30
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: An electronics assembly includes multiple electronic components coupled to a fabric. Each of the multiple electronic components includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. One of the electrically conductive wire braids interconnects two electronic components, thereby providing an electrical connection between the two electronic components. The electrically conductive wire braid can be attached to the fabric by an adhesive, a stitched thread, which can be either electrically insulated or electrically conductive, or both adhesive and stitched thread. The fabric can be a wearable fabric, such as a shirt or pants, or other form to be worn by a user, such as an armband, waistband, hat or shoes.
-
120.发明授权公开(公告)号：US09398714B1
公开(公告)日：2016-07-19
申请号：US14229671
申请日：2014-03-28
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more metal foils, each metal foil electrically coupled at one end to an electrical connection point of the electrical module and at another end to an electrically conductive wire. The electrically conductive wire is stitched to the metal foil and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board. The metal foils can be formed from interconnects on the printed circuit board or the metal foils can be separate elements coupled to the printed circuit board.
Abstract translation: 可穿戴电子组件包括耦合到可穿戴电子织物的一个或多个电子模块。 所述一个或多个电子模块中的每一个包括一个或多个金属箔，每个金属箔在一端电连接到电气模块的电连接点，另一端电连接到导电线。 导电线被缝合到金属箔和连接到电子模块的织物上。 电子模块可以包括耦合到印刷电路板的一个或多个电子部件。 金属箔可以由印刷电路板上的互连形成，或者金属箔可以是与印刷电路板耦合的分离元件。
-
-
-
-
-
-
-
-
-
Search Results
173
records
(took 0.017 seconds)
