公开(公告)号：US08131903B2

公开(公告)日：2012-03-06

申请号：US11799169

申请日：2007-04-30

Applicant: Roger A. Pearson ,  Shane Ward

Inventor： Roger A. Pearson ,  Shane Ward

IPC: G06F13/00 ,  G06F13/28 ,  H05K7/10

CPC classification number: G06F13/409 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/10159

Abstract: A multi-channel memory connection system comprises a circuit board comprising a plurality of memory connectors, at least one of the plurality of memory connectors configured to receive either a memory module or a memory riser, the at least one memory connector having at least two memory channels connected thereto through the circuit board.

Abstract translation: 多通道存储器连接系统包括包括多个存储器连接器的电路板，所述多个存储器连接器中的至少一个被配置为接收存储器模块或存储器提升器，所述至少一个存储器连接器具有至少两个存储器 通过电路板与其连接的通道。

公开(公告)号：US07848115B2

公开(公告)日：2010-12-07

申请号：US11586912

申请日：2006-10-26

Applicant: Brian W. Casto ,  John J. Retterer ,  Thomas L. Smith

Inventor： Brian W. Casto ,  John J. Retterer ,  Thomas L. Smith

IPC: H01R12/16

CPC classification number: H05K1/14 ,  G06F1/18 ,  H05K1/144 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10189

Abstract: In one exemplary embodiment, a system for supplying electrical connectivity to one or more circuit board based devices includes a backplane and at least one module. The backplane includes a mounting surface having a plurality of modular power connectors. The at least one module includes an interface portion, a power connection portion, and a circuit board. The power connection portion is configured to connect with the corresponding one of the plurality of modular power connectors. The circuit board includes a plurality of power-related electrical contacts and a plurality of data-related electrical contacts. At least one of the plurality of power-related electrical contacts is connected with the power connection portion, and at least one of the plurality of data-related electrical contacts is connected with the interface portion. The backplane is configured to connect with a power supply, such that the power supply supplies power to the at least one module through one of the modular power connectors when the at least one module is connected with the corresponding modular power connector.

Abstract translation: 在一个示例性实施例中，用于向一个或多个基于电路板的设备提供电连接的系统包括背板和至少一个模块。 背板包括具有多个模块化电源连接器的安装表面。 所述至少一个模块包括接口部分，电源连接部分和电路板。 电源连接部分被配置为与多个模块化电源连接器中的相应一个连接。 电路板包括多个功率相关的电触点和多个数据相关的电触点。 所述多个功率相关的电触头中的至少一个与所述电源连接部分连接，并且所述多个与数据有关的电触点中的至少一个与所述接口部分连接。 背板被配置为与电源连接，使得当至少一个模块与相应的模块化电源连接器连接时，电源通过模块化电源连接器之一向至少一个模块供电。

公开(公告)号：US07719850B2

公开(公告)日：2010-05-18

申请号：US10240334

申请日：2002-02-13

Applicant: Thomas Duerbaum ,  Reinhold Elferich

Inventor： Thomas Duerbaum ,  Reinhold Elferich

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K7/1092 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/182 ,  H05K2201/045 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A power supply module arrangement with an integrated circuit mounted on a bearing unit and a power supply includes an integrated circuit mounted on a bearing unit and a power supply module arrangement that is placed on the combination of bearing unit and integrated circuit. The power supply module arrangement includes a base extending at least partially over the base of the integrated circuit and/or all around the base of the integrated circuit. The power supply module arrangement allows for greater permissible load jumps, greater permissible current change rates and ever tighter tolerances regarding the constancy of the supply voltage.

Abstract translation: 具有安装在轴承单元和电源上的集成电路的电源模块装置包括安装在轴承单元上的集成电路和放置在轴承单元和集成电路的组合上的电源模块装置。 电源模块装置包括至少部分地在集成电路的基极上延伸的基座和/或整个集成电路的基极周围的基极。 电源模块布置允许更大的允许负载跳跃，更大的允许电流变化率和关于电源电压的恒定性的更严格的公差。

公开(公告)号：US20080094086A1

公开(公告)日：2008-04-24

申请号：US11976128

申请日：2007-10-22

Applicant: Woo-Seop Kim

Inventor： Woo-Seop Kim

IPC: G01R31/02 ,  H01L23/48

CPC classification number: G01R31/31905 ,  G01R1/0483 ,  G01R31/318505 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/141 ,  H05K1/145 ,  H05K2201/045 ,  H05K2201/10734

Abstract: A stack-type semiconductor package socket may include: a first package connection portion for connection with leads of a lowermost package of a stack-type semiconductor package; a second package connection portion for connection between pads of an odd-numbered package and leads of an even-numbered package, wherein the odd-numbered package and the even-numbered package are adjacent to each other; a lower case for fixing the first package connection portion; and an upper case for fixing the second package connection portion. A stack-type semiconductor package test system may include: a stack-type semiconductor package socket that includes first and second package connection portions; a printed circuit board electrically connected to leads of the lowermost package through the first package connection portion; and a test controller for receiving, outputting, or receiving and outputting signals from, to, or from and to the stack-type semiconductor package through the PCB and the stack-type semiconductor package socket.

公开(公告)号：US20070147796A1

公开(公告)日：2007-06-28

申请号：US11642863

申请日：2006-12-21

Applicant: Tomokazu Sugamura ,  Masuo Ogawa

Inventor： Tomokazu Sugamura ,  Masuo Ogawa

IPC: H04N5/00

CPC classification number: H04N5/64 ,  B82Y20/00 ,  G11B31/00 ,  G11B33/10 ,  G11B33/12 ,  H04N21/42646 ,  H05K1/14 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/048

Abstract: A disk unit-integrated display capable of increase in conveyance efficiency and reduce in conveyance cost of a disk unit, a holding member and a first circuit board unitized with each other can be obtained. This disk unit-integrated display includes the disk unit having a drive portion, the holding member for supporting the disk unit, the first circuit board arranged between the disk unit and the holding member and having an opening at a position corresponding to the drive portion of the disk unit.

Abstract translation: 可以获得能够提高输送效率并降低盘单元，保持构件和彼此组合的第一电路板的输送成本的盘单元集成显示器。 该盘单元集成显示器包括具有驱动部分的盘单元，用于支撑盘单元的保持构件，布置在盘单元和保持构件之间的第一电路板，并且在与驱动部分的驱动部分相对应的位置处具有开口 磁盘单元。

公开(公告)号：US20070015381A1

公开(公告)日：2007-01-18

申请号：US11481676

申请日：2006-07-06

Applicant: Simon Muff ,  Siva Raghuram

Inventor： Simon Muff ,  Siva Raghuram

IPC: H01R12/00

CPC classification number: G11C5/04 ,  H05K1/144 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2203/1572

Abstract: A memory extension memory module, a memory module system, and a memory module is disclosed. The memory module including at least one memory device and a connector for connecting the memory module to a computer system, wherein the memory module additionally includes a surface-mounted connector for connecting a memory extension memory module to the memory module. Furthermore, a method for manufacturing a memory module is disclosed. The memory module including at least one memory device and at least one connector for connecting a memory extension memory module to the memory module, wherein the at least one memory device and the at least one connector are connected to the memory module in a single manufacturing process.

Abstract translation: 公开了一种存储器扩展存储器模块，存储器模块系统和存储器模块。 所述存储器模块包括至少一个存储器件和用于将所述存储器模块连接到计算机系统的连接器，其中所述存储器模块还包括用于将存储器扩展存储器模块连接到所述存储器模块的表面安装连接器。 此外，公开了一种用于制造存储器模块的方法。 所述存储器模块包括至少一个存储器设备和用于将存储器扩展存储器模块连接到所述存储器模块的至少一个连接器，其中所述至少一个存储器设备和所述至少一个连接器在单个制造过程中连接到所述存储器模块 。

公开(公告)号：US07075183B2

公开(公告)日：2006-07-11

申请号：US09880733

申请日：2001-06-12

Applicant: Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

Inventor： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L29/40

CPC classification number: H01L24/13 ,  B32B15/01 ,  C22C5/02 ,  C22C9/02 ,  C22C11/06 ,  C22C13/00 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/4924 ,  H01L23/49513 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81409 ,  H01L2224/81815 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/045 ,  H05K2201/09572 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

公开(公告)号：US20060145352A1

公开(公告)日：2006-07-06

申请号：US11338529

申请日：2006-01-23

Applicant: Tasao Soga ,  Hanae Hata ,  Tetsuya Nakatsuka ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

Inventor： Tasao Soga ,  Hanae Hata ,  Tetsuya Nakatsuka ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L23/48

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/262 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/045 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05669

Abstract: In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Abstract translation: 在实现温度分级接合中的高温侧焊接的电子设备中，半导体器件与衬底之间的接合部分由Cu等金属球形成，并且由金属球和Sn形成的化合物 ，金属球通过化合物结合在一起。

公开(公告)号：US07068120B2

公开(公告)日：2006-06-27

申请号：US10183614

申请日：2002-06-25

Applicant: Yinan Wu ,  Tao Liang ,  John R. Benham

Inventor： Yinan Wu ,  Tao Liang ,  John R. Benham

IPC: H01P5/02 ,  H01P5/18

CPC classification number: H01R12/526 ,  H05K1/0239 ,  H05K1/14 ,  H05K1/141 ,  H05K7/1458 ,  H05K2201/044 ,  H05K2201/045

Abstract: An assembly (for example, an assembly in the form of an interposer that is distinct from a motherboard and from the devices that communicate with the motherboard) includes electromagnetic couplings. Each of the electromagnetic couplings couples signals being communicated between a device and a bus. Each of the electromagnetic couplings is connected to (a) an associated bus connector to provide connections of the couplings to the bus, and (b) an associated device connector to provide connections of the couplings to the device.

Abstract translation: 组件（例如，与主板和与主板通信的设备不同的插入件形式的组件）包括电磁耦合。 每个电磁耦合耦合在设备和总线之间传送的信号。 每个电磁耦合器连接到（a）相关联的总线连接器以提供耦合到总线的连接，以及（b）相关联的设备连接器，以提供耦合到设备的连接。

公开(公告)号：US07015571B2

公开(公告)日：2006-03-21

申请号：US10704793

申请日：2003-11-12

Applicant: Chih-Huang Chang ,  Shih-Chang Lee

Inventor： Chih-Huang Chang ,  Shih-Chang Lee

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/144 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/045 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/10378

Abstract: A multi-chips module assembly package mainly comprises a first package, a second package and an intermediate substrate. The intermediate substrate includes an opening, at least a via and a plurality of circuit layers, wherein the second package is accommodated in the opening. The via has an inner wall, and a plurality of separated electrically conductive layers, which is formed on the inner wall and connected with the corresponding circuit layers. The first package electrically connects with the second package through the intermediate substrate, and the intermediate substrate is interposed between the first package and the second package. At least an insulator is formed in the via, and the separated electrically conductive layers are separated from each other. After the intermediate substrate is interposed between the first package and the second package, there will be not enough space between the intermediate substrate, the first package and the second package for disposing conductive devices therein. Therefore, the first package will be electrically connected to the second package through the separated electrically conductive layers of the intermediate substrate for providing more conductive devices disposed and interposed between the intermediate substrate, the first package and the second package.

Abstract translation: 多芯片模块组装封装主要包括第一封装，第二封装和中间基板。 中间基板包括开口，至少通孔和多个电路层，其中第二封装容纳在开口中。 通孔具有内壁和多个分离的导电层，其形成在内壁上并与相应的电路层连接。 第一包装通过中间基板与第二包装电连接，并且中间基板插入在第一包装和第二包装之间。 至少在通孔中形成绝缘体，并且分离的导电层彼此分离。 在中间基板插入在第一封装和第二封装之间之后，中间基板，第一封装和第二封装之间将没有足够的空间用于在其中设置导电器件。 因此，第一封装将通过中间衬底的分离的导电层电连接到第二封装，用于提供设置和介于中间衬底，第一封装和第二封装之间的更多导电器件。