公开(公告)号：KR1020130069078A

公开(公告)日：2013-06-26

申请号：KR1020110136610

申请日：2011-12-16

Applicant: 삼성전기주식회사

Inventor： 김대욱 ,  김용구 ,  정웅태

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  H05K3/321 ,  H05K3/34 ,  H05K9/0024 ,  H05K2201/09372 ,  H05K2203/04

Abstract: PURPOSE: A camera module is provided to prevent a conductive material from overflowing to the outside, by filling the conductive material in a closed soldering space. CONSTITUTION: A grounding portion (11a) is protruded in the lower part of the side part of a shield can. A guide portion (21) is formed in the outer part of a circuit board (20). The grounding portion is inserted into the guide portion. A ground pad is comprised in the lower part of the circuit board. A conductive connection portion (30) is comprised in the lower part of the circuit board, in order to cover the ground pad. The conductive connection portion forms a closed soldering space (21a) on the guide portion.

Abstract translation: 目的：通过将导电材料填充在封闭的焊接空间中，提供相机模块以防止导电材料溢出到外部。 构成：在屏蔽罐的侧部的下部突出有接地部（11a）。 引导部分（21）形成在电路板（20）的外部部分中。 接地部分插入引导部分。 接地垫包含在电路板的下部。 导电连接部分（30）包括在电路板的下部，以覆盖接地垫。 导电连接部分在引导部分上形成封闭的焊接空间（21a）。

公开(公告)号：KR1020130024305A

公开(公告)日：2013-03-08

申请号：KR1020110087670

申请日：2011-08-31

Applicant: 엘지이노텍 주식회사

Inventor： 김학호

IPC: H04N5/225

CPC classification number: H04N5/2252 ,  H04N5/2254 ,  H04N5/335 ,  H05K2201/09372 ,  H05K2201/095

Abstract: PURPOSE: A camera module is provided to emit the heat of an image sensor to the outside through a ground pad, thereby increasing heat emitting efficiency. CONSTITUTION: A camera module includes housings(100,200) and a printed circuit board(PCB)(300). A housing is bonded in the PCB. An image sensor(330) is mounted on the PCB. A ground pad(310) is formed on the PCB. The image sensor is adhered to the ground pad with an adhesive(320). The heat of the image sensor is emitted to the outside through the ground pad.

Abstract translation: 目的：提供相机模块，通过接地垫将图像传感器的热量发射到外部，从而提高散热效率。 构成：相机模块包括外壳（100,200）和印刷电路板（PCB）（300）。 在PCB中结合一个外壳。 图像传感器（330）安装在PCB上。 在PCB上形成接地焊盘（310）。 图像传感器用粘合剂（320）粘附到接地垫。 图像传感器的热量通过接地垫发射到外部。

公开(公告)号：KR1020100054393A

公开(公告)日：2010-05-25

申请号：KR1020080113305

申请日：2008-11-14

Applicant: 한화테크윈 주식회사

Inventor： 김덕흥 ,  이상민

IPC: H05K1/02 ,  H05K3/18

CPC classification number: H05K3/243 ,  H05K1/111 ,  H05K3/188 ,  H05K2201/09372

Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve reliability of the printed circuit board by preventing an insulation layer from covering a plating layer on a connection pad for connecting an external terminal. CONSTITUTION: A printed circuit board includes a substrate(211), a connection pad(221), an electrolytic plating layer(230), and an insulation layer(240). The substrate is made of the insulation material. The connection pad is formed on the substrate. The electrolytic plating layer includes a nickel plating layer and a gold plating layer. The nickel plating layer is formed on the connection pad. The gold plating layer is formed on the nickel plating layer. The insulation layer surrounds the edge of the electrolytic plating layer. The insulation layer is higher than the electrolytic plating layer.

Abstract translation: 目的：提供印刷电路板及其制造方法，以通过防止绝缘层覆盖用于连接外部端子的连接焊盘上的镀层来提高印刷电路板的可靠性。 构成：印刷电路板包括基板（211），连接焊盘（221），电解镀层（230）和绝缘层（240）。 基板由绝缘材料制成。 连接垫形成在基板上。 电解镀层包括镀镍层和镀金层。 镍镀层形成在连接焊盘上。 镀镍层形成在镀镍层上。 绝缘层围绕电解镀层的边缘。 绝缘层高于电解镀层。

公开(公告)号：KR1020090128272A

公开(公告)日：2009-12-15

申请号：KR1020080054351

申请日：2008-06-10

Applicant: 삼성전기주식회사

Inventor： 석진수 ,  권세문 ,  강환준 ,  박명재

IPC: H04N5/225

CPC classification number: H04N5/2251 ,  H05K2201/05 ,  H05K2201/09372

Abstract: PURPOSE: A camera module and a manufacturing method thereof are provided to improve an electric connecting structure between a substrate and an actuator to prevent short, thereby reducing defective products. CONSTITUTION: A housing receives a lens module and an actuator for transferring the lens module. A connection board(20) comprises a plurality of connection pads(22). The connection pads are electrically connected to the actuator. A substrate(30) comprises connection terminals electrically connected to the connection pads.

Abstract translation: 目的：提供相机模块及其制造方法，以改善基板和致动器之间的电连接结构，以防止短路，从而减少不良品。 构成：壳体接收透镜模块和用于传送透镜模块的致动器。 连接板（20）包括多个连接焊盘（22）。 连接垫电连接到致动器。 基板（30）包括电连接到连接焊盘的连接端子。

公开(公告)号：KR1020090118272A

公开(公告)日：2009-11-18

申请号：KR1020080043958

申请日：2008-05-13

Applicant: 삼성전기주식회사

Inventor： 황준오 ,  목지수 ,  김성용 ,  이응석

IPC: H05K1/11

CPC classification number: H05K3/0094 ,  H05K1/116 ,  H05K3/227 ,  H05K3/429 ,  H05K2201/09372 ,  H05K2201/09563

Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce a process stage and a process time by omitting a laser process for forming the via and a dry film separation process. CONSTITUTION: A printed circuit board includes a core substrate(10), a first positive photosensitive insulation layer(18), and a first via(30). The core substrate is comprised of an insulation layer(16), a bump(14), and a metal layer. A land(12a) and a first circuit pattern(12b) are formed in the metal layer. The first positive photosensitive insulation layer is formed on the core substrate. The first via is connected to the land by passing through the first positive photosensitive insulation layer. A second circuit pattern(28) is formed on the first positive photosensitive insulation layer.

Abstract translation: 目的：提供一种印刷电路板及其制造方法，以通过省略用于形成通孔的激光工艺和干膜分离工艺来减少处理阶段和处理时间。 构成：印刷电路板包括芯基板（10），第一正感光绝缘层（18）和第一通孔（30）。 芯基板由绝缘层（16），凸块（14）和金属层构成。 在金属层中形成有焊盘（12a）和第一电路图案（12b）。 第一正性感光绝缘层形成在芯基板上。 第一通孔通过第一正性感光绝缘层连接到焊盘。 在第一正性感光绝缘层上形成第二电路图案（28）。

公开(公告)号：KR1020090097338A

公开(公告)日：2009-09-16

申请号：KR1020080022413

申请日：2008-03-11

Applicant: 삼성전기주식회사

Inventor： 고민철

IPC: H04N5/225

CPC classification number: H04N5/2251 ,  G02B5/208 ,  H05K3/323 ,  H05K13/046 ,  H05K2201/09372

Abstract: A web camera and a manufacturing method thereof are provided to simplify the structure and process of a web camera, thereby reducing the manufacturing cost, and improving the performance and productivity. A web camera manufacturing method comprises the following steps of: preparing a web cam board(100) in which an upper pad(112) is formed at an upper surface; forming a lower pad corresponding to the upper pad and assembling a housing(130) on a substrate in which an image sensor is mounted; and then electrically connecting the upper pad and lower pad to mount a camera module on the web cam board.

Abstract translation: 提供网络摄像机及其制造方法以简化网络摄像机的结构和处理，从而降低制造成本，并提高性能和生产率。 网络摄像机制造方法包括以下步骤：准备在上表面形成有上垫（112）的腹板凸轮板（100） 形成对应于上焊盘的下焊盘，并将壳体（130）组装在安装有图像传感器的基板上; 然后电连接上垫和下垫以将相机模块安装在卷筒纸凸轮板上。

公开(公告)号：KR1020090046271A

公开(公告)日：2009-05-11

申请号：KR1020070112294

申请日：2007-11-05

Applicant: 삼성전기주식회사

Inventor： 김호균

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  H04N5/2251 ,  H05K1/111 ,  H05K13/046 ,  H05K2201/09372

Abstract: 본 발명은 인쇄회로기판의 구조를 개선하여 하우징과의 본딩시 본드가 인쇄회로기판의 측면패드로 유입되는 것을 방지하고, 인쇄회로기판 및 카메라 모듈의 접속성을 향상시킴과 아울러 제조 시간을 단축하고 제조 비용을 절감하기 위한 것이다.
이를 위해, 본 발명은, 측면에 형성된 접속홀에 측면패드가 구비된 기판부; 및 상기 기판부의 상면에 설치되어 상기 접속홀의 상단 개구부를 덮는 폴리이미드(polyimide) 재질의 캡핑(capping)부재;를 포함하는 인쇄회로기판과 그 제조방법 및 이를 포함하는 카메라 모듈 및 그 제조방법을 제공한다.
카메라 모듈, 인쇄회로기판, 기판부, 캡핑부재, 폴리이미드

公开(公告)号：KR100817143B1

公开(公告)日：2008-03-27

申请号：KR1020060096698

申请日：2006-09-30

Applicant: (주)케이나인

Inventor： 구자욱 ,  권규형

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  H04N5/2251 ,  H05K2201/09372 ,  H05K2203/049

Abstract: A slim type camera module of a portable terminal is provided to achieve the reduction of entire height, by forming an image hole in the center of a PCB(Printed Circuit Board) and mounting an image sensor chip on a bottom surface of the PCB. A PCB(10) has a square type image hole(10a) through which an image passes, a plurality of pads(22) formed at both sides of the image holes, and narrow and long wire holes(10b) formed outside the pads. An image sensor chip(20) is mounted on a bottom surface of the PCB to monitor the image passing through the image hole. A housing(30) is attached to an upper surface of the PCB. A lens holder(40) is screw-joined to an inside of a protrusion of the housing. Wires(50) bond the pads and the pads to each other through the wire holes.

Abstract translation: 通过在PCB（印刷电路板）的中心形成图像孔并将图像传感器芯片安装在PCB的底面上，提供便携式终端的超薄型摄像机模块以实现全高度的降低。 PCB（10）具有图像通过的方形图像孔（10a），形成在图像孔的两侧的多个焊盘（22），以及形成在焊盘外部的窄且长的线孔（10b）。 图像传感器芯片（20）安装在PCB的底表面上，以监视通过图像孔的图像。 壳体（30）附接到PCB的上表面。 透镜保持架（40）与壳体的突起内侧螺纹接合。 电线（50）通过线孔将焊盘和焊盘彼此连接。

公开(公告)号：KR1020080018583A

公开(公告)日：2008-02-28

申请号：KR1020060080916

申请日：2006-08-25

Applicant: 엘지이노텍 주식회사

Inventor： 이학규

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  H05K9/0064 ,  H05K9/0079 ,  H05K2201/09372

Abstract: A camera module for preventing ESD(ElectroStatic Discharge) is provided to discharge static electricity applied from the exterior to the exterior without causing damage. A holder(20) includes ESD line terminals made of a conductive material to discharge electricity on its outer surface. A PCB(Printed Circuit Board)(40) includes ground pads formed at positions where the ESD line terminals contact when the holder(20) is mounted thereon. The conductive material is formed of a metallic thin film, a metallic tape, etc. The ground pads are connected with a certain ground terminal to implement ground. The ground pads are formed by removing a solder resister of a corresponding surface to open a ground film.

Abstract translation: 提供用于防止ESD（静电放电）的相机模块，用于将外部施加的静电放电到外部而不造成损坏。 保持器（20）包括由导电材料制成的ESD线端子，用于在其外表面上放电。 PCB（印刷电路板）（40）包括在保持器（20）安装在其上时ESD线端子接触的位置处形成的接地焊盘。 导电材料由金属薄膜，金属带等形成。接地焊盘与特定的接地端子连接以实现接地。 通过去除对应表面的焊料来形成接地焊盘以打开地膜。

公开(公告)号：KR100769725B1

公开(公告)日：2007-10-23

申请号：KR1020060092825

申请日：2006-09-25

Applicant: 삼성전기주식회사

Inventor： 김나용

IPC: H04N5/225

CPC classification number: H04N5/2251 ,  H01L2224/80203 ,  H05K3/323 ,  H05K5/0026 ,  H05K2201/05 ,  H05K2201/09372

Abstract: A dual camera module is provided to mount the dual camera module at the same position on both sides of a PCB which is fixedly stuck to an FPCB using one connector, thereby providing a small-sized and slim dual camera module. A dual camera module includes an FPCB(200), a PCB, the first camera module(100a), and the second camera module(100b). The FPCB(100) has one end portion provided with a connector electrically connected to an external appliance. The PCB is electrically connected to the FPCB(200) while being fixedly stuck to the FPCB(200) through a conductive pad. The first camera module(100a) is mounted on one surface of the PCB. The second camera module(100b) is mounted on an opposite surface of the attached surface of the first camera module(100a).

Abstract translation: 提供了一种双摄像头模块，用于将双摄像机模块安装在使用一个连接器固定在FPCB上的PCB两侧的相同位置上，从而提供了一个小型和超薄的双摄像头模块。 双相机模块包括FPCB（200），PCB，第一相机模块（100a）和第二相机模块（100b）。 FPCB（100）具有设置有与外部设备电连接的连接器的一个端部。 PCB通过导电垫固定地粘接到FPCB（200）上，电连接FPCB（200）。 第一相机模块（100a）安装在PCB的一个表面上。 第二相机模块（100b）安装在第一相机模块（100a）的附接表面的相对表面上。