-
公开(公告)号：US5028111A
公开(公告)日：1991-07-02
申请号：US432746
申请日：1989-10-16
Applicant: Mitsuru Yumoto , Takashi Yokota
Inventor： Mitsuru Yumoto , Takashi Yokota
CPC classification number: H01L25/167 , G02B6/32 , G02B6/4204 , G02B6/4238 , G02B6/4246 , G02B7/008 , H05K1/111 , H05K3/341 , H05K3/3421 , H01L2924/0002 , H01L33/58 , H05K1/0284 , H05K2201/09036 , H05K2201/09472 , H05K2201/10121 , H05K2201/10424 , H05K2201/10462 , H05K2203/0195 , Y02P70/611 , Y02P70/613
Abstract: According to the present invention, a fixing method by soldering is provided which attains, upon fixing to a substrate a cylindrical optical part which includes a lens, a photo-semiconductor device having a light emitting portion or a light receiving portion located substantially at a focus position of the lens, and terminals connected to the photo-semiconductor device, mechanical fixation of the cylindrical optical part to the substrate and electric connection of the terminals to the substrate at a time. According to another aspect of the present invention, a method of collectively fixing an optical part and an electric part on a substrate by soldering is provided. A heating block is divided into a portion made of a substance having a high coefficient of thermal conductivity and another portion made of another substance having a low coefficient of thermal conductivity. The portion made of the substance having a high coefficient of thermal conductivity is contacted with a reverse face of a portion of a substrate at which an optical part is mounted while the portion made of the substance having a low coefficient of thermal conductivity is contacted with the reverse face of another portion of the substrate at which an electric part is mounted.
Abstract translation: PCT No.PCT / JP89 / 00146 Sec。 371日期：1989年10月16日 102（e）日期1989年10月16日PCT提交1989年2月14日PCT公布。 出版物WO89 / 07779 日本1989年8月24日。根据本发明，提供一种通过焊接的固定方法，其在固定到基板上时实现包括透镜的圆柱形光学部件，具有发光部分或光的光半导体器件 基本上位于透镜的焦点位置处的接收部分，以及连接到光电半导体器件的端子，将圆柱形光学部件机械固定到基板并且一次将端子电连接到基板。 根据本发明的另一方面，提供了一种通过焊接将基板上的光学部件和电气部件集体固定的方法。 加热块被分成由具有高导热系数的物质制成的部分和由具有低导热系数的另一物质制成的另一部分。 由具有高导热系数的物质制成的部分与安装有光学部件的基板的一部分的反面接触，而由具有低导热系数的物质制成的部分与 安装有电气部件的基板的另一部分的反面。
-
公开(公告)号：US5026134A
公开(公告)日：1991-06-25
申请号：US316666
申请日：1989-02-28
Applicant: Mitsuru Sugawara , Akitoshi Yoshinaga , Fumihiko Shimizu , Masayuki Takami
Inventor： Mitsuru Sugawara , Akitoshi Yoshinaga , Fumihiko Shimizu , Masayuki Takami
IPC: G02B6/42 , H01L31/167 , H01S5/026 , H05K1/02
CPC classification number: H01S5/026 , G02B6/42 , G02B6/4246 , H01L31/167 , H05K1/0274 , H05K2201/10287 , H05K2201/10462
Abstract: An optical communication apparatus which comprises a printed circuit board, plural circuit elements fixed to the printed circuit board, the circuit elements having terminals extended to the printed circuit board, a photosensitive glass base fixed to the printed circuit board, various optical components accurately fixed to the glass base, the optical elements respectively having plural leads, and corresponding conductive members for electrically connecting the terminals of the circuit elements and the corresponding leads of the optical components, the conductive members each having a rigidity smaller than the rigidity of the corresponding leads of the optical components.
-
公开(公告)号：US4897769A
公开(公告)日：1990-01-30
申请号：US197186
申请日：1988-05-18
Applicant: John M. Lang
Inventor： John M. Lang
IPC: H01L33/48 , H01R13/717 , H05K3/30 , H05K3/34
CPC classification number: H05K3/301 , H01R12/58 , H01L33/483 , H01R12/7064 , H01R13/7175 , H05K2201/10462 , H05K2201/10606 , H05K3/3447 , Y10S362/80
Abstract: This invention relates to a right angle light emitting diode assembly with snap-in feature wherein an insulating body, generally in the shape of a rectangular parallelepiped, no larger than a finger nail, holds a light emitting diode in the insulating body at right angles to the surface of a printed wiring board, the insulating body being shaped such that robotic equipment can be used to insert the diode assembly cheaply and efficiently onto said board. The insulating body has front and back generally parallel surfaces, top and bottom generally parallel surfaces, and first and second generally parallel side surfaces, the respective surfaces having grooves and protuberances to allow the light emitting diode (LED) to be fixedly mounted in said body and the body to be inserted into a printed wiring board which can then be wave soldered without deleterious effects on the LED or supporting body. The bottom of the body has two oppositely faced snap-in proturbances which pass through the hole on a printed wiring board which deform inwardly slightly while passing through the hole and expand outwardly after extending out from beyond the hole to fixedly mount the diode assembly in the correct position on the board.
-
公开(公告)号：US10037898B2
公开(公告)日：2018-07-31
申请号：US15089208
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Kabir J. Mirpuri
IPC: H05K1/18 , H05K1/11 , H01L21/48 , H01L23/498 , B23K35/36 , B23K101/40 , H01L23/488 , B23K101/42
CPC classification number: H01L21/4864 , B23K35/3613 , B23K2101/40 , B23K2101/42 , H01L21/4853 , H01L23/488 , H01L23/49816 , H01L2225/06513 , H01L2225/06517 , H05K1/11 , H05K1/181 , H05K2201/10462 , H05K2201/10674
Abstract: A one-step water soluble (WS) flux process may reduce residue staining and increase yields for bond grid array (BGA) packages. In one example, the WS flux may use increased amounts of bonding polymer (BP) and reduced amounts of amine to increase viscosity. The increased viscosity may eliminate using a second no-clean flux and enable a single WS flux to both clean the associated substrate and provide stable solder ball support during reflow.
-
公开(公告)号：US09462996B2
公开(公告)日：2016-10-11
申请号：US14549364
申请日：2014-11-20
Applicant: SAMSUNG MEDISON CO., LTD.
Inventor： Gil Ju Jin , Jung Lim Park , Jae Yk Kim
CPC classification number: A61B8/4494 , A61B8/00 , A61B8/4461 , A61B8/4483 , B06B1/0622 , H05K1/189 , H05K3/305 , H05K2201/055 , H05K2201/09681 , H05K2201/09781 , H05K2201/10083 , H05K2201/10462 , Y02P70/613
Abstract: Probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.
Abstract translation: 探头包括换能器，具有经由面对面接触而与换能器接触的图案部分的PCB以及将换能器接合到PCB的图案部分的接合构件。 PCB的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善接合 传感器和PCB之间的力。 结果，换能器可以可靠地结合到PCB，使得可以防止换能器的性能由于PCB和换能器之间的不良连接而劣化。
-
Patent Agency Ranking
公开(公告)号：US09064634B2
公开(公告)日：2015-06-23
申请号：US13817964
申请日：2011-08-23
Applicant: Tatsuya Nakamura
Inventor： Tatsuya Nakamura
IPC: H05K7/14 , H01L23/48 , H01G4/248 , H01G4/228 , H01G2/10 , H01R3/00 , H01G2/06 , H01G9/08 , H01G9/12 , H05K3/30 , H05K3/34
CPC classification number: H01G2/10 , H01G2/06 , H01G9/08 , H01G9/12 , H05K3/301 , H05K3/3447 , H05K2201/10462 , H05K2201/10583 , H05K2201/10606 , H05K2201/10651
Abstract: A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.
Abstract translation: 一种电容器保持器，包括形成为能够安装电容器的尖端的形状的主体部分; 以及引导部，其固定到主体部并且可以被焊接到预定的配合位置。 主体部分具有露出电容器的前端的开口，以及当电容器的前端装配到电容器的前端时与端子表面抵接部分邻接电容器的顶端表面 身体部位。 引线部分相对于参考平面固定在与电容器相对的位置处的主体部分，该基准面是包括抵靠端表面抵接部分的电容器的末端表面的平面。
-
公开(公告)号：US20150144385A1
公开(公告)日：2015-05-28
申请号：US14407405
申请日：2013-06-21
Applicant: KYOCERA Corporation
Inventor： Yoshio Ohashi , Kunihide Shikata
CPC classification number: H05K1/181 , C04B37/025 , C04B2237/10 , C04B2237/343 , C04B2237/407 , C04B2237/55 , C04B2237/59 , C04B2237/86 , H01L2224/48091 , H01L2224/73265 , H05K1/0306 , H05K1/092 , H05K1/111 , H05K3/388 , H05K2201/10462 , H05K2201/2063 , Y02P70/611 , H01L2924/00014
Abstract: The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.
Abstract translation: 电路基板包括陶瓷烧结体和在其至少一个主表面上设置有玻璃层的金属布线层，并且当观察到垂直于陶瓷烧结体的主表面的电路板的横截面时， 玻璃层和金属布线层之间的界面的长度与沿着主表面的方向上的玻璃层的长度的比率为1.25至1.80。
-
公开(公告)号：US08913399B2
公开(公告)日：2014-12-16
申请号：US13533698
申请日：2012-06-26
Applicant: Gil Ju Jin , Jung Lim Park , Jae Yk Kim
Inventor： Gil Ju Jin , Jung Lim Park , Jae Yk Kim
CPC classification number: A61B8/4494 , A61B8/00 , A61B8/4461 , A61B8/4483 , B06B1/0622 , H05K1/189 , H05K3/305 , H05K2201/055 , H05K2201/09681 , H05K2201/09781 , H05K2201/10083 , H05K2201/10462 , Y02P70/613
Abstract: Disclosed herein are a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.
Abstract translation: 这里公开了印刷电路板（PCB）和包括该电路板的探针。 探头包括换能器，具有经由面对面接触与换能器接触的图案部分的PCB以及将换能器接合到PCB的图案部分的接合构件。 PCB的接合部分设置有图案部分以增加接合部分的接合面积，并且允许接合部件不仅接触接合部分的金属层，而且接触其电绝缘部分，从而改善接合 传感器和PCB之间的力。 结果，换能器可以可靠地结合到PCB，使得可以防止换能器的性能由于PCB和换能器之间的不良连接而劣化。
-
119.发明申请公开(公告)号：US20120300424A1
公开(公告)日：2012-11-29
申请号：US13577447
申请日：2010-11-16
CPC classification number: H05K3/3426 , H03H9/1007 , H05K3/3494 , H05K2201/10068 , H05K2201/10075 , H05K2201/10462 , Y02P70/613 , Y10T29/49124
Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.
Abstract translation: 本发明公开了一种没有外部封装的晶体器件，其包括：晶体（21）和两个引脚（22），其中晶体（21）是具有外部封装（15）的晶体的圆柱形主体端口，以及 冗余引脚（12,13）被去除，并且被水平布置在印刷电路板（PCB）上。 两个销（22）连接到晶体（21）的底端。 两个销（22）的延伸部分朝向PCB倾斜，并且当它们到达PCB并且被焊接到PCB时变得水平，并且两个销（22）之间的间隔逐渐增加。 本公开还公开了一种用于制造没有封装的晶体器件的方法。 该装置和方法可以降低成本，使焊接更方便。
-
公开(公告)号：US20120026698A1
公开(公告)日：2012-02-02
申请号：US12847276
申请日：2010-07-30
Applicant: Chun-Kong CHAN , Chi Ching CHEN
Inventor： Chun-Kong CHAN , Chi Ching CHEN
IPC: H05K1/18
CPC classification number: H05K1/18 , H05K1/0231 , H05K3/308 , H05K3/3447 , H05K2201/10462 , H05K2201/10757 , H05K2201/2018
Abstract: An integrated circuit board includes a bridging filtering capacitor, a bypass capacitor, a thermistor, and a varistor. The integrated circuit board further includes an electrolytic capacitor set having a plurality of electrolytic capacitors, which are arranged in parallel and adjacent to each other, and a mounting frame for grouping the electrolytic capacitors. The present invention uses the above elements to reduce the vertical height, the horizontal width, and the occupied area. Therefore, the overall dimension of the circuit board can be reduced to make the electronic devices smaller, especially for thin electronic devices such as LCD TVs and screens.
Abstract translation: 集成电路板包括桥接滤波电容器，旁路电容器，热敏电阻器和变阻器。 集成电路板还包括具有彼此平行并相邻布置的多个电解电容器的电解电容器组和用于分组电解电容器的安装框架。 本发明使用上述元件来减小垂直高度，水平宽度和占用面积。 因此，可以减小电路板的整体尺寸，使电子装置更小，特别是对于液晶电视和屏幕等薄型电子设备。
-
-
-
-
-
-
-
-
-
Search Results
236
records
(took 0.043 seconds)
